Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | F/FAST |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.89 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.02 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 61 mA |
| Prop。Delay @ Nom-Sup | 11 ns |
| 传播延迟（tpd） | 7.5 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| 54F563LMQB | 54F563DM | 54F563DMQB | 54F563FMQB | 54F563LM | 54F563FM | 74F563SJX | |
|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CQCC20, CERAMIC, LCC-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CDIP20, CERAMIC, DIP-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CDIP20, CERAMIC, DIP-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CDFP20, CERAMIC, FP-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CQCC20, CERAMIC, LCC-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CDFP20, CERAMIC, FP-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, PDSO20, 5.30 MM, EIAJ TYPE2, SOP-20 |
| 零件包装代码 | QLCC | DIP | DIP | DFP | QLCC | DFP | SOIC |
| 包装说明 | QCCN, LCC20,.35SQ | CERAMIC, DIP-20 | CERAMIC, DIP-20 | DFP, FL20,.3 | QCCN, | DFP, | SOP, SOP20,.3 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | compliant |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | S-CQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | R-GDFP-F20 | S-CQCC-N20 | R-GDFP-F20 | R-PDSO-G20 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | QCCN | DIP | DIP | DFP | QCCN | DFP | SOP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK | SMALL OUTLINE |
| 传播延迟（tpd） | 7.5 ns | 7 ns | 7 ns | 7.5 ns | 7.5 ns | 7.5 ns | 10.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.905 mm | 5.08 mm | 5.08 mm | 2.286 mm | 1.905 mm | 2.286 mm | 2.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | FLAT | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 8.89 mm | 7.62 mm | 7.62 mm | 6.731 mm | 8.89 mm | 6.731 mm | 5.3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | 不符合 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | - | e0 |
| 长度 | 8.89 mm | 24.51 mm | 24.51 mm | - | 8.89 mm | - | 12.6 mm |
| 最大I（ol） | 0.02 A | - | 0.02 A | 0.02 A | - | - | 0.024 A |
| 封装等效代码 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | FL20,.3 | - | - | SOP20,.3 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | - | - | 5 V |
| 最大电源电流（ICC） | 61 mA | - | 61 mA | 61 mA | - | - | 61 mA |
| Prop。Delay @ Nom-Sup | 11 ns | - | 11 ns | 11 ns | - | - | 9.5 ns |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 厂商名称 | - | Fairchild | Fairchild | - | - | Fairchild | Fairchild |
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