Although Belden makes every reasonable effort to ensure their accuracy at the time of this publication, information and specifications described herein are subject to error or omission and to
change without notice, and the listing of such information and specifications does not ensure product availability.
Belden provides the information and specifications herein on an "AS IS" basis, with no representations or warranties, whether express, statutory or implied. In no event will Belden be liable for
any damages (including consequential, indirect, incidental, special, punitive, or exemplary damages) whatsoever, even if Belden has been advised of the possibility of such damages, whether
in an action under contract, negligence or any other theory, arising out of or in connection with the use, or inability to use, the information or specifications described herein.
All sales of Belden products are subject to Belden's standard terms and conditions of sale.
Belden believes this product to be in compliance with EU RoHS (Directive 2002/95/EC, 27-Jan-2003). Material manufactured prior to the compliance date may be in stock at Belden facilities
and in our Distributor’s inventory. The information provided in this Product Disclosure, and the identification of materials listed as reportable or restricted within the Product Disclosure, is
correct to the best of Belden’s knowledge, information, and belief at the date of its publication. The information provided in this Product Disclosure is designed only as a general guide for the
safe handling, storage, and any other operation of the product itself or the one that it becomes a part of. This Product Disclosure is not to be considered a warranty or quality specification.
Regulatory information is for guidance purposes only. Product users are responsible for determining the applicability of legislation and regulations based on their individual usage of the
product.
Belden declares this product to be in compliance with EU LVD (Low Voltage Directive 2014/35/EU).
国际半导体设备材料产业协会（SEMI）昨（10）日公布半导体设备资本支出的年中预测报告（SEMI Capital Equipment Forecast），预估2012年全球半导体设备营收规模将达到423.8亿美元，2013年将成长至467.1亿美元。
受惠平板电脑、智慧型手机与行动装置等消费性电子商品亮丽表现，半导体设备的采购需求仍将持续。SEMI在报告中指出，2011年半...[详细]
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