NUMBER
TYPE
BUS-12-064
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
BergPin®
1 of 13
AUTHORIZED BY
DATE
F
04 SEP 08
H. T. BREWBAKER
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test, quality and reliability requirements of the BergPin®
0.64mm/0.025 inch square pin product.
2.0
SCOPE
This specification covers the BergPin® 0.64mm/0.025 inch square pin for use in single or double-sided
printed wiring boards.
3.0
GENERAL
3.1 Index
This document is composed of the following sections:
Title
OBJECTIVE
SCOPE
GENERAL
Index
Type
Classification
Banned/Restricted Substances
APPLICABLE DOCUMENTS
REQUIREMENTS
Qualification
Material
Finish
Design and Construction
Electrical Characteristics
Mechanical Characteristics
Environmental Characteristics
QUALITY ASSURANCE PROVISION
PACKAGING AND MARKING
GENERAL INFORMATION
Page
1
1
1
1
1
2
2
2
3
3
3
3
3
4
5
6
8
11
12
Paragraph
1.0
2.0
3.0
3.1
3.2
3.3
3.4
4.0
5.0
5.1
5.2
5.3
5.4
5.5
5.6
5.7
6.0
7.0
8.0
3.2
Type
The BergPin® shall be available in one of the following types, as limited by the appropriate
product drawing.
Type
I.
II.
III.
IV.
V.
VI.
VII.
Plating
0,76u/30u” gold
1,27u/50u” gold
0,38u/15u” gold
3,05u/120u” tin-lead
0,76u/30u” GXT
0,38u/15u” GXT
2,54u/100u” tin
Copyright
Form E-3334
Rev F
FCI
GS-01-001
PDM: Rev:F
STATUS:
Released
Printed: Nov 28, 2010
.
NUMBER
TYPE
BUS-12-064
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
BergPin®
2 of 13
AUTHORIZED BY
DATE
F
04 SEP 08
H. T. BREWBAKER
CLASSIFICATION
UNRESTRICTED
3.3
Classification. BergPin® shall be classified as follows:
Class I:
Class II
Reeled BergPin® suitable for automatic or semiautomatic application.
Loose-piece BergPin® suitable for handtool application.
Unless otherwise specified herein all requirements are applicable to both classes of BergPin®
3.4
Banned/Restricted Substances All product where the part number ends in “LF” meet the
European Union directives and other country regulations as described in GS-22-008. The part
numbers that do not end in “LF” meet all regulations except for Pb in SnPb plating, if available. Tin
plated “LF” product has 100% tin plating in the interface and has not been tested for whisker growth
in all interconnect environments.
4.0
APPLICABLE DOCUMENTS
4.1
Issues of Documents . The following documents, of the issue in effect on the date of the latest
revision of this specification, shall form a part of this specification to the extent specified herein.
SPECIFICATIONS
FEDERAL
QQ-N-290
QQ-W-343
QQ-B-613
QQ-B-750
Nickel Plating (Electrodeposited)
Wire Electrical and Nonelectrical, copper, (Uninsulated)
Brass, Leaded and Nonleaded
Bronze, Phosphor: Bar, Plate. Rod, Sheet, Strip, Flat Wire, and Structural and Special-
Shaped Sections.
MILITARY
MIL-F-14256
MIL-P-13949
MIL-G-45204
MIL-P-55110
MIL-P-81728
MIL-P-45209
MIL-STD-105
MIL-STD-202
MIL-STD-275
MIL-STD-1130
MIL-STD-1344
MIL-STD-45662
4.2
Flux,Soldering. Liquid (Rosin Base), Activated.
Plastic sheet, Laminated, Metal-Clad (for printed wiring) General Specification for
Gold Plating, Electrodeposited
Printed Wiring Boards
Plating, Tin-Lead (Electrodeposited)
PALLADIUM Plating, (Electrodeposited)
Sampling Procedures and Tables for Inspection by Attributes
Test Methods for Electrical and Electronic
Printed Wiring for Electronic Equipment
Connections, Electrical Solderless Wrapped
Test Methods for Electrical Connectors
Calibration Systems Requirements
Other Publications
The following documents from a part of this specification to the extent specified
herein:
American Society for Testing and Materials (ASTM) ASTM B-159-Phosphor Bronze Wire
Copyright
Form E-3334
Rev F
FCI
GS-01-001
PDM: Rev:F
STATUS:
Released
Printed: Nov 28, 2010
.
NUMBER
TYPE
BUS-12-064
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
BergPin®
3 of 13
AUTHORIZED BY
DATE
F
04 SEP 08
H. T. BREWBAKER
CLASSIFICATION
UNRESTRICTED
5.0
REQUIREMENTS
5.1
Qualification - Panel assemblies produced using BergPin® furnished under this specification shall
be capable of meeting the qualification test requirements specified here. (see 6.0)
Material - The material for each part shall be as specified herein, or equivalent. Substitute material
shall meet the performance requirements of this specification.
5.2.1
BergPin®
The pin shall be drawn wire phosphor bronze alloy UNS C-51000, in
accordance with ASTM B-159.
The separable carrier (reeled version only) shall be brass alloy UNS C-
26000, in accordance with QQ-B-613.
5.2
5.2.2
Carrier
5.3
Finish
5.3.2
BergPin®
The finish on the pin shall be as specified herein for the particular type
(see Paragraph 3.2) of BergPin® under consideration.
Types I,II and III. The pin shall be gold plated with the specified minimum
thickness (see Paragraph 3.2). The plated deposits shall be in
accordance with MIL-G-45204, Type II, Grade Cover 1,27u/50u” minimum
of nickel. The plated deposits shall be in accordance with QQ-N-290, class
2. Non-critical areas such as the sheared tips may have exposed base
metal.
Type IV The pin shall be plated with 3,05u/120u” minimum of 93/7 tin-
lead. Over 1,27u/50u” minimum of nickel. The plated deposits shall be in
accordance with MIL-P-81728. Non-critical areas such as the sheared tips
may have exposed base metal.
Type V and VI The pin shall be plated with 0,76/30u” or 0,38u/15u”
minimum respectively of palladium alloy. The plated deposits shall be in
accordance MIL-P-45209 and a thin soft gold flash over 1,27u/50u”
minimum of nickel The plated deposits shall be in accordance with QQ-N-
290, Class 2. Non-critical areas such as the sheared tip may have
exposed base metal.
Type VII The pin shall be plated with 2,54/100u” of tin over 1,27/50u”
minimum of nickel. The plated deposits shall be in accordance with GS-
46-001 (Confidential). Non-critical areas such as the sheared tip may have
exposed base metal.
5.3.1.1
5.3.1.2
5.3.1.3
5.3.1.4
5.4
Design and Construction The BergPin® shall be available in various above and below board lengths
suitable for use as 0,64mm/0.025 inch square male disconnects or as similarly configured
wrapposts for solderless wrapped connections, in accordance with MIL-STD-1130. The pin shall
incorporate a formed staking area, known as a star, providing mechanical stability of the free-
standing pin. The standard BergPin® shall have 0,99 +0,03 – 0,05mm/0.039 + .001,-.002 inch, star
diagonal and a large star BergPin® shall have a 1,04
±
0,03mm/0.041
±
.001 inch. star diagonal.
Pin Lengths - The standard pin is available in a variety of installed lengths.
Copyright
Form E-3334
Rev F
FCI
GS-01-001
PDM: Rev:F
STATUS:
Released
Printed: Nov 28, 2010
.
NUMBER
TYPE
BUS-12-064
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
BergPin®
4 of 13
AUTHORIZED BY
DATE
F
04 SEP 08
H. T. BREWBAKER
CLASSIFICATION
UNRESTRICTED
5.4.1
Installation
The standard BergPin® with 0.99mm / 0.039 inch diagonal star shall be
installed in a plated-through hole having a finished diameter of 0,81
±
0,05mm / 0.032
±
.002 inch for 1,57mm / 0.062 inch thick PWB (Printed Wiring Board) and 0,86 ± 0.05mm /
0.034 ± .002 inch for 3.18mm / 0.125 inch thick PWB. The large star BergPin® with
1.04mm / .041 inch diagonal star shall be installed in a plated-through-hole having a
finished diameter of 0,86
±
0,05mm / 0.034
±
.002 inch for 1.57mm / 0.062 inch PWB,
and 0.91 ± 0.05mm / 0.036 ± .002 inch for 2.36mm / 0.093 inch and 3.18mm / 0.125 inch
PWB. The Pin shall be capable of installation on minimum centers of 2.54mm / 0.100 inch
on PWB. The BergPin® shall be soldered in accordance with good industry techniques
that insure a sound solder bond in order to meet the specifications called herein. The
breakout of termination holes should be no greater than .127mm / 0.005 inch x 45
°
or
.127mm / 0.005 inch radius.
Printed Wiring Board requirements The laminate used in the fabrication of printed wiring
boards shall be typed GE* **** A1/1A A/1/B, in accordance with MIL-P-13949, or
equivalent. Plated-through-holes shall be constructed as follows:
Drilled Hole Diameter – 1,02
±
0,03mm / 0.040
±
.001 inch for Large Star BergPin®
0,97
±
0,03mm / 0.038
±
.001 inch for Standard Star BergPin®
Copper Plated Thickness – 0,03mm / 0.001 inches (minimum)
Tin-Lead (60-40) Plating Thickness – 0,00762mm / 0.0003 inches (minimum):
0,0178mm / 0.0007 inches (maximum)
*N or P is optional
**** 0930 or 1250, as appropriate
5.4.2
5.4.3
Wrappost The wrappost geometry shall be in accordance with Para. 5.2 of MIL-STD-
1130. The tip of the wrappost shall be bevelled to facilitate insertion into the bit of the
wire wrap tooling.
Workmanship Pin shall be uniform in quality and shall be free from burrs scratches,
cracks, voids, chips, sharp edges, and other defects that will adversely affect life or
serviceability.
5.4.4
5.5
Electrical Characteristics
5.5.1
Operating Temperature Unless otherwise specified, the pins shall have an operating
temperature of + 85 o C maximum and – 40 o C minimum.
Low-Level Circuit Resistance The low-level circuit resistance between the pin and the
plated-through-hole after soldering shall not exceed 0.2 milliohms when measured in
accordance with MIL-STD-1344, Method 3002. The following details shall apply:
A. Test Current-100ma, maximum (short circuit)
B. Open Circuit Voltage-20 mv D.C., maximum
C. Method of Connection-attach current and voltage leads as shown in Figure 1.
5.5.2
Copyright
Form E-3334
Rev F
FCI
GS-01-001
PDM: Rev:F
STATUS:
Released
Printed: Nov 28, 2010
.
NUMBER
TYPE
BUS-12-064
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
BergPin®
5 of 13
AUTHORIZED BY
DATE
F
04 SEP 08
H. T. BREWBAKER
CLASSIFICATION
UNRESTRICTED
5.5.3
Current rating
The Pin provides the electrical resistance equivalent of AWG 29 wire in
a balanced system would be rated at approximately 3.0 Amperes D.C.
FIGURE 1- LOW-LEVEL CIRCUIT RESISTANCE
5.6
Mechanical Characteristics
5.6.1
Contact retention
Depending upon Pin to plated-through-hole interference the pin
could have 8.9 to 89N (2 to 20 lbs) of retention force before the assembled boards are
soldered.
A torque of 0.021 N.m (3.0 ounce-inches) applied to the tip of the
Wrappost Torque
installed wrappost shall not cause yielding of this member, when tested in accordance
with MIL-STD-202, Method 211, condition E.
5.6.2
Copyright
Form E-3334
Rev F
FCI
GS-01-001
PDM: Rev:F
STATUS:
Released
Printed: Nov 28, 2010
.
stm32/stm8
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
