1GB DDR SDRAM SO-DIMM (128M words x64 bits, 2 Ranks)

| EBD11UD8ADDA-E | EBD11UD8ADDA-6B-E | EBD11UD8ADDA-7A-E | EBD11UD8ADDA-7B-E | |
|---|---|---|---|---|
| 描述 | 1GB DDR SDRAM SO-DIMM (128M words x64 bits, 2 Ranks) | 1GB DDR SDRAM SO-DIMM (128M words x64 bits, 2 Ranks) | 1GB DDR SDRAM SO-DIMM (128M words x64 bits, 2 Ranks) | 1GB DDR SDRAM SO-DIMM (128M words x64 bits, 2 Ranks) |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 |
| 厂商名称 | - | ELPIDA | ELPIDA | ELPIDA |
| 零件包装代码 | - | SODIMM | SODIMM | SODIMM |
| 包装说明 | - | DIMM, DIMM200,24 | DIMM, DIMM200,24 | DIMM, DIMM200,24 |
| 针数 | - | 200 | 200 | 200 |
| Reach Compliance Code | - | unknow | unknow | unknow |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 |
| 访问模式 | - | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
| 最长访问时间 | - | 0.7 ns | 0.75 ns | 0.75 ns |
| 其他特性 | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| 最大时钟频率 (fCLK) | - | 167 MHz | 133 MHz | 133 MHz |
| I/O 类型 | - | COMMON | COMMON | COMMON |
| JESD-30 代码 | - | R-XZMA-N200 | R-XZMA-N200 | R-XZMA-N200 |
| 内存密度 | - | 8589934592 bi | 8589934592 bi | 8589934592 bi |
| 内存集成电路类型 | - | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
| 内存宽度 | - | 64 | 64 | 64 |
| 功能数量 | - | 1 | 1 | 1 |
| 端口数量 | - | 1 | 1 | 1 |
| 端子数量 | - | 200 | 200 | 200 |
| 字数 | - | 134217728 words | 134217728 words | 134217728 words |
| 字数代码 | - | 128000000 | 128000000 | 128000000 |
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C |
| 组织 | - | 128MX64 | 128MX64 | 128MX64 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | - | DIMM | DIMM | DIMM |
| 封装等效代码 | - | DIMM200,24 | DIMM200,24 | DIMM200,24 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度(摄氏度) | - | 260 | 260 | 260 |
| 电源 | - | 2.5 V | 2.5 V | 2.5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | - | 8192 | 8192 | 8192 |
| 自我刷新 | - | YES | YES | YES |
| 最大待机电流 | - | 0.048 A | 0.048 A | 0.048 A |
| 最大压摆率 | - | 4.6 mA | 3.88 mA | 3.88 mA |
| 最大供电电压 (Vsup) | - | 2.7 V | 2.7 V | 2.7 V |
| 最小供电电压 (Vsup) | - | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | - | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | - | NO | NO | NO |
| 技术 | - | CMOS | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | - | 0.6 mm | 0.6 mm | 0.6 mm |
| 端子位置 | - | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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