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FEATURES
Four DACs in a 28 Pin, 0.6 Inch Wide DIP or 28-Pin JEDEC
Plastic Chip Carrier
1/4 LSB Endpoint Linearity
Guaranteed Monotonic
DACs Matched to Within 1%
Microprocessor Compatible
Read/Write Capability (with Memory)
TTL/CMOS Compatible
Four-Quadrant Multiplication
Single-Supply Operation (+5 V)
Low Power Consumption
Latch-Up Resistant
Available In Die Form
APPLICATIONS
Voltage Set Points in Automatic Test Equipment
Systems Requiring Data Access for Self-Diagnostics
Industrial Automation
Multichannel Microprocessor-Controlled Systems
Digitally Controlled Op Amp Offset Adjustment
Process Control
Digital Attenuators
Quad 8-Bit Multiplying CMOS
D/A Converter with Memory
DAC8408
A common 8-bit TTL/CMOS compatible input port is used to
load data into any of the four DAC data-latches. Control lines
DS1, DS2,
and A/B determine which DAC will accept data.
Data loading is similar to that of a RAMs write cycle. Data can
be read back onto the same data bus with control line R/W. The
DAC8408 is bus compatible with most 8-bit microprocessors,
including the 6800, 8080, 8085, and Z80. The DAC8408 oper-
ates on a single +5 volt supply and dissipates less than 20 mW.
The DAC8408 is manufactured using PMI’s highly stable,
thin-film resistors on an advanced oxide-isolated, silicon-gate,
CMOS process. PMI’s improved latch-up resistant design elimi-
nates the need for external protective Schottky diodes.
ORDERING INFORMATION
1
Model
DAC8408GP
DAC8408ET
DAC8408AT
2
DAC8408FT
DAC8408BT
2
DAC8408FPC
3
DAC8408FS
DAC8408FP
INL
±
1/4 LSB
±
1/4 LSB
±
1/4 LSB
±
1/2 LSB
±
1/2 LSB
±
1/2 LSB
±
1/2 LSB
±
1/2 LSB
DNL
±
1/2 LSB
±
1/2 LSB
±
1/2 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
Temperature
Range
0°C to +70°C
–40°C to +85°C
–55°C to +125°C
–40°C to +85°C
–55°C to +125°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package
Description
28-Pin Plastic DIP
28-Pin Cerdip
28-Pin Cerdip
28-Pin Cerdip
28-Pin Cerdip
28-Contact PLCC
28-Pin SOL
28-Pin Plastic DIP
GENERAL DESCRIPTION
The DAC8408 is a monolithic quad 8-bit multiplying digital-to-
analog CMOS converter. Each DAC has its own reference input,
feedback resistor, and onboard data latches that feature
read/write capability. The readback function serves as memory
for those systems requiring self-diagnostics.
NOTES
1
Burn-in is available on commercial and industrial temperature range parts
in cerdip, plastic DIP, and TO-can packages. For outline information see Pack-
age Information section.
2
For devices processed in total compliance to MIL-STD-883, add /883 after
part number. Consult factory for 883 data sheet.
3
For availability and burn-in information on SO and PLCC packages, contact
your local sales office.
FUNCTIONAL BLOCK DIAGRAM
DAC8408
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700
Fax: 617/326-8703
DAC8408
ELECTRICAL CHARACTERISTICS
Parameter
STATIC ACCURACY
Resolution
Nonlinearity
1, 2
Differential
Nonlinearity
Gain Error
Gain Tempco
3, 6
Power Supply Rejection
(∆V
DD
=
±
10%)
I
OUT 1A
,
B
,
C
,
D
Leakage Current
13
REFERENCE INPUT
Input Voltage Range
Input Resistance Match
4
Input Resistance
DIGITAL INPUTS
Digital Input Low
Digital Input High
Input Current
5
Input Capacitance
6
DATA BUS OUTPUTS
Digital Output Low
Digital Output High
Output Leakage Current
DAC OUTPUTS
6
Propagation Delay
7
Settling Time
11,12
Output Capacitance
AC Feedthrough
SWITCHING CHARACTERISTICS
6, 10
Write to Data Strobe Time
Data Valid to Strobe Set-Up Time
Data Valid to Strobe Hold Time
DAC Select to Strobe Set-Up Time
DAC Select to Strobe Hold Time
Write Select to Strobe Set-Up Time
Write Select to Strobe Hold Time
Read to Data Strobe Width
Data Strobe to Output Valid Time
Output Data to Deselect Time
Read Select to Strobe Set-Up Time
Read Select to Strobe Hold Time
Specifications subject to change without notice.
(@ V
DD
= +5 V; V
REF
= 10 V; V
OUT
A, B, C, D = 0 V; T
A
= –55 C to +125 C apply for
DAC8408AT/BT, T
A
= –40 C to +85 C apply for DAC8408ET/FT/FP/FPC/FS; T
A
= 0 C to +70 C apply for DAC8408GP, unless otherwise noted.
Specifications apply for DAC A, B, C, & D.)
Symbol
N
INL
DNL
G
FSE
TC
GFS
PSR
I
LKG
T
A
=+25°C
T
A
= Full Temperature Range
Conditions
DAC8408
Min
Typ
Max
8
DAC8408A/E/G
DAC8408B/F/H
DAC8408A/E/G
DAC8408B/F/H
(Using Internal R
FB
)
Units
Bits
LSB
LSB
LSB
LSB
LSB
ppm/°C
%FSR/%
nA
nA
V
%
kΩ
V
V
µA
µA
pF
V
V
µA
µA
ns
ns
pF
pF
dB
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
REV. A
±
2
±
1/4
±
1/2
±
1/2
±
1
±
1
±
40
0.001
±
30
±
100
±
20
±
1
14
0.8
R
A, B, C, D
R
IN
V
IL
V
IH
I
IN
C
IN
V
OL
V
OH
I
LKG
T
A
= +25°C
T
A
= Full Temperature Range
6
10
2.4
±
0.01
±
1.0
±
10.0
8
0.4
16 mA Sink
400
µA
Source
T
A
= +25°C
T
A
= Full Temperature Range
4
±
0.005
±
1.0
±
0.075
±
10.0
150
190
180
250
30
50
t
PD
t
S
C
OUT
FT
t
DS1
or
t
DS2
t
DSU
t
DH
t
AS
t
AH
t
WSU
t
WH
t
RDS
t
CO
t
OTD
t
RSU
t
RH
DAC Latches All “0s”
DAC Latches All “1s”
(20 V
p-p
@ F = 100 kHz)
T
A
= +25°C
T
A
= Full Temperature Range
T
A
= +25°C
T
A
= Full Temperature Range
54
90
145
150
175
10
0
0
0
0
220
350
320
430
200
270
0
0
T
A
= +25°C
T
A
= Full Temperature Range
T
A
= +25°C
T
A
= Full Temperature Range
T
A
= +25°C
T
A
= Full Temperature Range
–2–
DAC8408
@ V
DD
= +5 V; V
REF
= 10 V; V
OUT
A, B, C, D = 0 V; T
A
= –55 C to +125 C apply for
DAC8408AT/BT, T
A
= –40 C to +85 C apply for DAC8408ET/FT/FP/FPC/FS; T
A
= 0 C to +70 C apply for DAC8408GP, unless otherwise noted.
Specifications apply for DAC A, B, C, & D.
Continued
Parameter
POWER SUPPLY
Voltage Range
Supply Current
8
Supply Current
9
Symbol
V
DD
I
DD
I
DD
Conditions
DAC8408
Min
Typ
Max
4.5
T
A
= +25°C
T
A
= Full Temperature Range
7
8
ELECTRICAL CHARACTERISTICS
Units
V
µA
mA
mA
5.5
50
1.0
1.5
NOTES
1
This is an end-point linearity specification.
2
Guaranteed to be monotonic over the full operating temperature range.
3
ppm/°C of FSR (FSR = Full Scale Range = V
REF
-1 LSB.)
4
Input Resistance Temperature Coefficient = +300ppm/°C.
5
Logic Inputs are MOS gates. Typical input current at +25°C Is less than 10 nA.
6
Guaranteed by design.
From Digital Input to 90% of final analog output current.
All Digital Inputs “0” or V
DD
.
9
All Digital Inputs V
IH
or V
IL
.
10
See Timing Diagram.
11
Digital Inputs = 0 V to V
DD
or V
DD
to 0 V.
12
Extrapolated: t
S
(1/2 LSB) = t
PD
+ 6.2τ where
τ
= the measured first time con-
stant of the final RC decay.
13
All Digital Inputs = 0 V; V
REF
= +10 V.
Specifications subject to change without notice.
PIN CONNECTIONS
DAC8408
TOP VIEW
(Not to Scale)
ABSOLUTE MAXIMUM RATINGS
(T
A
= +25°C, unless otherwise noted.)
Package Type
28-Pin Hermetic DIP (T)
28-Pin Plastic DIP (P)
28-Pin SOL (S)
28-Contact PLCC (PC)
JA
*
JC
Units
°C/W
°C/W
°C/W
°C/W
V
DD
to I
OUT 2A
, I
OUT 2B
, I
OUT 2C
, I
OUT 2D
. . . . . . . . . . 0 V, +7 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +7 V
I
OUT 1A
, I
OUT 1B
,
I
OUT 1C
, I
OUT 1D
to DGND . . . . . . . . . –0.3 V to V
DD
+0.3 V
R
FB
A, R
FB
B, R
FB
C, R
FB
D to I
OUT
. . . . . . . . . . . . . . . . .
±
25 V
I
OUT 2A
, I
OUT 2B
,
I
OUT 2C
, I
OUT 2D
to DGND . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
DB0 through DB7 to DGND . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Control Logic
Input Voltage to DGND . . . . . . . . . . –0.3 V + V
DD
+ 0.3 V
V
REF
A, V
REF
B, V
REF
C, V
REF
D to
I
OUT 2A
, I
OUT 2B
, I
OUT 2C
, I
OUT 2D
. . . . . . . . . . . . . . . .
±
25 V
Operating Temperature Range
Commercial Grade (GP) . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial Grade (ET, FT, FP, FPC, FS) . –40°C to +85°C
Military Grade (AT, BT) . . . . . . . . . . . . . . –55°C to +125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300°C
55
53
68
66
10
27
23
29
*θ
JA
is specified for worst case mounting conditions, i.e.,
θ
JA
is specified for
device in socket for cerdip and P-DIP packages;
θ
JA
is specified for device
soldered to printed circuit board for SOL and PLCC packages.
CAUTION
1. Do not apply voltages higher than V
DD
+0.3 V or less than
–0.3 V potential on any terminal except V
REF
and R
FB
.
2. The digital control inputs are diode-protected; however,
permanent damage may occur on unconnected inputs from
high energy electrostatic fields. Keep in conductive foam at
all times until ready to use.
3. Use proper antistatic handling procedures.
4. Absolute Maximum Ratings apply to both packaged devices
and DICE. Stresses above those listed under Absolute Maxi-
mum Ratings may cause permanent damage to the device.
REV. A
–3–
DAC8408
Burn-in Circuit
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8408 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
DICE CHARACTERISTICS
1. V
DD
2. V
REF
A
3. R
FB
A
4. I
OUT 1A
5. I
OUT 2A
/I
OUT 2B
6. I
OUT 1B
7. R
FB
B
8. V
REF
B
9. DB0 (LSB)
10. DB1
11. DB2
12. DB3
13. DB4
14. DB5
15. DB6
16. DB7 (MSB)
17. A/B
18. R/W
19.
DS1
20.
DS2
21. V
REF
D
22. R
FB
D
23. I
OUT 1D
24. I
OUT 2C
/I
OUT 2D
25. I
OUT 1C
26. R
FB
C
27. V
REF
C
28. DGND
DIE SIZE 0.130
×
0.124 inch, 16,120 sq. mils
(3.30
×
3.15 mm, 10.4 sq. mm)
–4–
REV. A
嵌入式系统
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