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MUR550APF

产品描述Rectifiers 520V 5A UltraFast
产品类别分立半导体    二极管   
文件大小158KB,共8页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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MUR550APF概述

Rectifiers 520V 5A UltraFast

MUR550APF规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
包装说明PLASTIC, CASE 267-05, 2 PIN
针数2
制造商包装代码267-05
Reach Compliance Codenot_compliant
ECCN代码EAR99
Factory Lead Time1 week
其他特性LOW LEAKAGE CURRENT
应用ULTRA FAST RECOVERY
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型RECTIFIER DIODE
最大正向电压 (VF)0.98 V
JESD-30 代码O-PALF-W2
JESD-609代码e3
最大非重复峰值正向电流85 A
元件数量1
相数1
端子数量2
最高工作温度175 °C
最低工作温度-65 °C
最大输出电流5 A
封装主体材料PLASTIC/EPOXY
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)260
认证状态Not Qualified
最大重复峰值反向电压520 V
最大反向恢复时间0.095 µs
表面贴装NO
端子面层Tin (Sn)
端子形式WIRE
端子位置AXIAL
处于峰值回流温度下的最长时间40
Base Number Matches1

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MUR550APFG,
MURD550PFG,
MUR550PFG,
MURF550PFG,
NRVUD550PFT4G
SWITCHMODE
Power Rectifier
These state−of−the−art devices are designed for power factor
correction in discontinuous and critical conduction mode.
Features
http://onsemi.com
ULTRAFAST RECTIFIER
5.0 AMPERES, 520 VOLTS
MARKING DIAGRAMS
AXIAL LEAD
CASE 267
STYLE 1
520 V Rating Meets 80% Derating Requirements of Major OEMs
Low Forward Voltage Drop
Low Leakage
Ultrafast 95 Nanosecond Recovery Time
Reduces Forward Conduction Loss
AEC−Q101 Qualified and PPAP Capable
NRVUD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
Applications
A
MUR
550APF
YYWW
G
G
4
1 2
1
3
4
DPAK
CASE 369C
STYLE 8
DCM PFC Designs
Switching Power Supplies
Power Inverters
Mechanical Characteristics:
AYWW
U
550G
3
Pin 1: No Connect
4
TO−220AC
CASE 221B
STYLE 1
1
4
1
3
4
TO−220FP
CASE 221E
STYLE 1
1
4
1
3
A
YY, Y
WW
G
or G
KA
= Assembly Location
= Year
= Work Week
= Pb−Free Package
= Diode Polarity
3
AYWWG
MURF550PF
KA
3
AY WWG
MUR550PF
KA
Case: Epoxy, Molded
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: MUR550APFG: 1.1 Gram (Approximately)
MURD550PFG, NRVUD550PFT4G: 0.4 Gram
(Approximately)
MUR550PFG, MURF550PFG: 1.9 Gram
(Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
(Note: Microdot may be in either location)
Publication Order Number:
MUR550/D
January, 2012
Rev. 8
1

 
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