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MBRM2H100T3G

产品类别分立半导体    二极管   
文件大小101KB,共5页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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MBRM2H100T3G规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
零件包装代码DO-216AA
包装说明LEAD FREE, MICRO MINIATURE, PLASTIC, CASE 457-04, POWERMITE-2
针数2
制造商包装代码457-04
Reach Compliance Codenot_compliant
ECCN代码EAR99
Factory Lead Time5 weeks
应用EFFICIENCY
外壳连接CATHODE
配置SINGLE
二极管元件材料SILICON
二极管类型RECTIFIER DIODE
最大正向电压 (VF)0.84 V
JEDEC-95代码DO-216AA
JESD-30 代码R-PSSO-G1
JESD-609代码e3
湿度敏感等级1
最大非重复峰值正向电流50 A
元件数量1
相数1
端子数量1
最高工作温度175 °C
最低工作温度-65 °C
最大输出电流2 A
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
最大重复峰值反向电压100 V
最大反向电流20 µA
表面贴装YES
技术SCHOTTKY
端子面层Tin (Sn)
端子形式GULL WING
端子位置SINGLE
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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MBRM2H100T3G,
NRVBM2H100T3G
Surface Mount
Schottky Power Rectifier
POWERMITE
®
Power Surface Mount Package
The Schottky Powermite
®
employs the Schottky Barrier principle
with a barrier metal and epitaxial construction that produces optimal
forward voltage drop−reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the Powermite
®
has the same thermal performance as the SMA while
being 50% smaller in footprint area. Because of its small size, it is
ideal for use in portable and battery powered products such as cellular
and cordless phones, chargers, notebook computers, printers, PDAs
and PCMCIA cards. Typical applications are AC−DC and DC−DC
converters, reverse battery protection, and “ORing” of multiple supply
voltages and any other application where performance and size are
critical.
Features
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 100 VOLTS
CATHODE
ANODE
POWERMITE
CASE 457
MARKING DIAGRAM
M
B2HG
Low Profile
Maximum Height of 1.1 mm
Small Footprint
Footprint Area of 8.45 mm
2
Low V
F
Provides Higher Efficiency and Extends Battery Life
Supplied in 12 mm Tape and Reel
Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
This is a Pb−Free Device
Mechanical Characteristics:
1
2
M
B2H
G
= Date Code
= Device Code
= Pb−Free Package
ORDERING INFORMATION
Device
MBRM2H100T3G
Package
Powermite
(Pb−Free)
Powermite
(Pb−Free)
Shipping
12000/Tape &
Reel
12000/Tape &
Reel
Powermite
®
is JEDEC Registered as D0−216AA
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 16.3 mg (Approximately)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
NRVBM2H100T3G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2014
January, 2014
Rev. 2
1
Publication Order Number:
MBRM2H100/D

 
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