• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
APPLICATIONS
• Load Switch
PowerPAK SC-70-6L-Single
Marking Code
1
D
2
D
3
6
D
5
D
S
4
S
2.05 mm
G
Part # code
AKX
XXX
Lot Traceability
and Date code
D
G
2.05 mm
Ordering Information:
SiA430DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
SiA430DJ-T4-GE3 (Lead (Pb)-free and Halogen-free)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain Current
T
C
= 25 °C
T
A
= 25 °C
T
C
= 25 °C
T
C
= 70 °C
Maximum Power Dissipation
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Continuous Source-Drain Diode Current
Soldering Recommendations (Peak Temperature)
d, e
Symbol
V
DS
V
GS
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
I
D
I
DM
I
S
P
D
T
J
, T
stg
Limit
20
± 20
12
a
12
a
12
a, b, c
10.1
b, c
40
12
a
2.9
b, c
19.2
12.3
3.5
b, c
2.2
b, c
- 55 to 150
260
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
b, f
Maximum Junction-to-Ambient
°C/W
Maximum Junction-to-Case (Drain)
Steady State
Notes:
a. Package limited
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (
www.vishay.com/doc?73257
). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
Document Number: 68685
S13-0116-Rev. B, 21-Jan-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
1
t
5s
Symbol
R
thJA
R
thJC
Typical
28
5.3
Maximum
36
6.5
Unit
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiA430DJ
Vishay Siliconix
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 5 A, V
GS
½0
V
0.8
18
7
8
10
T
C
= 25 °C
12
40
1.2
30
15
A
V
ns
nC
ns
C
iss
C
oss
C
rss
V
DS
= 10 V, V
GS
= 10 V, I
D
= 12 A
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 10 V, R
L
= 1
I
D
10 A, V
GEN
= 10 V, R
g
= 1
V
DD
= 10 V, R
L
= 1
I
D
10 A, V
GEN
= 4.5 V, R
g
= 1
f = 1 MHz
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 12 A
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
800
200
90
12
5.3
2
1.4
2.5
16
10
15
10
10
8
17
8
25
15
25
15
15
15
30
15
ns
18
9
nC
pF
V
DS
V
DS
/T
J
V
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 20 V, V
GS
= 0 V
V
DS
= 20 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
5
V, V
GS
= 10 V
V
GS
½10
V, I
D
= 7 A
V
GS
½4.5
V, I
D
= 5 A
V
DS
= 10 V, I
D
= 7 A
20
0.0108
0.0146
16
0.0135
0.0185
1
20
24
- 5.6
3
± 100
1
10
µA
A
S
V
mV/°C
V
nA
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
300 µs, duty cycle
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
For technical questions, contact:
pmostechsupport@vishay.com
Document Number: 68685
S13-0116-Rev. B, 21-Jan-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiA430DJ
Vishay Siliconix
TYPICAL CHARACTERISTIC
(25 °C, unless otherwise noted)
40
V
GS
= 10
V
thru 5
V
32
I
D
- Drain Current (A)
I
D
- Drain Current (A)
5
V
GS
= 4
V
4
T
C
= - 55 °C
24
3
T
C
= 125 °C
2
16
V
GS
= 3
V
8
1
T
C
= 25 °C
0
0.0
0.5
1.0
1.5
2.0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.025
1000
Transfer Characteristics
C
iss
R
DS(on)
- On-Resistance (Ω)
800
0.020
V
GS
= 4.5
V
0.015
V
GS
= 10
V
0.010
200
C - Capacitance (pF)
600
400
C
oss
C
rss
0.005
0
8
16
24
32
40
0
0
5
10
15
20
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage
10
R
DS(on)
- On-Resistance (Normalized)
1.6
Capacitance
I
D
= 12 A
V
GS
- Gate-to-Source
Voltage
(V)
8
V
DS
= 10
V
V
DS
= 5
V
6
V
DS
= 15
V
I
D
= 7 A
1.4
V
GS
= 10
V
1.2
4
1.0
2
0.8
0
0
3
6
9
12
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 68685
S13-0116-Rev. B, 21-Jan-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiA430DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
100
0.055
I
D
= 5 A
R
DS(on)
- On-Resistance (Ω)
10
I
S
- Source Current (A)
T
J
= 150 °C
1
T
J
= 25 °C
0.045
0.035
0.1
0.025
T
J
= 125 °C
0.015
T
J
= 25 °C
0
1
2
3
4
5
6
7
8
9
10
0.01
T
J
= - 50 °C
0.001
0.0
0.005
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.3
30
0.1
25
V
GS(th)
Variance
(V)
20
- 0.1
I
D
= 1 mA
- 0.3
I
D
= 250
µA
- 0.5
5
Power (W)
150
15
10
- 0.7
- 50
- 25
0
25
50
75
100
125
0
0.001
0.01
0.1
T
J
- Temperature (°C)
1
Time (s)
10
100
1000
Threshold Voltage
100
Limited
by
R
DS(on)
*
10
I
D
- Drain Current (A)
Single Pulse Power (Junction-to-Ambient)
10
µs
100
µs
1 ms
1
10 ms
100 ms
0.1
T
A
= 25 °C
Single Pulse
0.01
0.1
BVDSS
Limited
1
10
DC
100
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
For technical questions, contact:
pmostechsupport@vishay.com
Document Number: 68685
S13-0116-Rev. B, 21-Jan-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiA430DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
35
25
28
20
I
D
- Drain Current (A)
Power (W)
21
15
14
Package Limited
10
7
5
0
0
25
50
75
100
125
150
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
J
- Temperature (°C)
Current Derating*
Power Derating
* The power dissipation P
D
is based on T
J(max.)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 68685
S13-0116-Rev. B, 21-Jan-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
5
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
主题：自备终端(BYOD)发展趋势;用员工自己的移动设备来控制对工作设施及设备的使用，会对信息安全产生怎样的影响;在不使公司有安全风险或不损害员工隐私的前提下，有哪些方式能安全地实现这样的设施及设备使用。 自备终端(Bring Your Own Device，简称BYOD)，即企业允许员工离职时保留自己的手机，这种做法正日益流行。如今智能手机功能也越来越多，我们不仅能用自己的手机访问电脑、网...[详细]
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