1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
Symbol
R
qJL
R
qJA
Max
24
80
Unit
°C/W
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
see Figure 2
Maximum Instantaneous Reverse Current (Note 3)
see Figure 4
3. Pulse Test: Pulse Width
≤
250
ms,
Duty Cycle
≤
2.0%.
(V
R
= 40 V)
(V
R
= 20 V)
I
R
(i
F
= 1.0 A)
(i
F
= 2.0 A)
Symbol
v
F
T
J
= 25°C
0.5
0.6
T
J
= 25°C
0.4
0.02
T
J
= 125°C
0.425
0.58
T
J
= 100°C
10
5.0
mA
Unit
V
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2
MBRS140LT3
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
100
100
10
10
1.0
T
J
= 125°C
100°C
1.0
T
J
= 125°C
100°C
25°C
25°C
−40
°C
0.1
0.1
0.3
0.1
0.1
0.3
0.5
0.7
0.9
V
F
, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0.5
0.7
0.9
v
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
IR , MAXIMUM REVERSE CURRENT (AMPS)
100E−3
IR , REVERSE CURRENT (AMPS)
10E−3
T
J
= 125°C
100°C
100E−3
T
J
= 125°C
10E−3
1.0E−3
25°C
100°C
1.0E−3
100E−6
10E−6
25°C
1.0E−6
0
10
20
30
100E−6
10E−6
1.0E−6
40
0
10
20
30
40
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
dc
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
25
45
65
85
105
125
T
L
, LEAD TEMPERATURE (°C)
SQUARE WAVE
Ipk/Io =
p
Ipk/Io = 5.0
Ipk/Io = 10
Ipk/Io = 20
FREQ = 20 kHz
PFO , AVERAGE POWER DISSIPATION (WATTS)
IO , AVERAGE FORWARD CURRENT (AMPS)
1.6
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
I
O
, AVERAGE FORWARD CURRENT (AMPS)
Ipk/Io =
p
Ipk/Io = 5.0
Ipk/Io = 10
Ipk/Io = 20
SQUARE WAVE
dc
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
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3
MBRS140LT3
TJ , DERATED OPERATING TEMPERATURE (
°
C)
1000
T
J
= 25°C
C, CAPACITANCE (pF)
125
115
105
95
85
75
65
24°C/W
44°C/W
63°C/W
80°C/W
R
tja
= 94°C/W
100
10
0
5.0
10
15
20
25
30
35
40
V
R
, REVERSE VOLTAGE (VOLTS)
0
5.0
10
15
20
25
30
35
40
V
R
, DC REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
Figure 8. Typical Operating Temperature Derating*
R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-
verse voltage conditions. Calculations of T
J
therefore must include forward and reverse power effects. The allowable operating
T
J
may be calculated from the equation:
T
J
= T
Jmax
− r(t)(Pf + Pr) where
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable T
J
due to reverse bias under DC conditions only and is calculated as T
J
= T
Jmax
− r(t)Pr,
where r(t) = Rthja. For other power applications further calculations must be performed.
50%
20%
10%
5.0%
2.0%
1.0%
1.0E+00
1.0E−01
1.0E−02
1.0E−03
R
tjl(t)
= R
tjl*r(t)
1.0E−04
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 9. Thermal Response, Junction−to−Lead
50%
20%
10%
5.0%
2.0%
1.0%
1.0E+00
1.0E−01
1.0E−02
1.0E−03
R
tjl(t)
= R
tjl*r(t)
1.0E−04
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 10. Thermal Response, Junction−to−Ambient
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4
MBRS140LT3
PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A−03
ISSUE F
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.90
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.13
2.45
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.084
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.096
0.008
0.087
0.012
0.156
0.181
0.220
0.063
b
D
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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