EEPROM 2.5 V to 5.5V 256k
| 参数名称 | 属性值 |
| Brand Name | STMicroelectronics |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 5 MHz |
| 数据保留时间-最小值 | 40 |
| 耐久性 | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 5.62 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.3 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.5 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.000005 A |
| 最大压摆率 | 0.005 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 5.62 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE/SOFTWARE |
| M95256-WMW6TG | M95256-DFMN6TP | M95256-RMC6TG | M95256-RMN6P | M95256-RCS6TP-A | M95256-WMW6G | |
|---|---|---|---|---|---|---|
| 描述 | EEPROM 2.5 V to 5.5V 256k | Buffers u0026 Line Drivers Trancvr Driver/Recvr | 256 Kbit SPI bus EEPROM with high-speed clock | EEPROM 256 Kbit Serial Bus EEPROM | EEPROM 256 Kbit SPI EEPROM 20 MHz High Speed | EEPROM 2.5 V to 5.5V 256k |
| Brand Name | STMicroelectronics | - | STMicroelectronics | STMicroelectronics | - | STMicroelectronics |
| 包装说明 | SOP, SOP8,.3 | - | HVSON, SOLCC8,.11,20 | SOP-8 | - | SOP, SOP8,.3 |
| Reach Compliance Code | unknown | - | compliant | compliant | - | unknown |
| 最大时钟频率 (fCLK) | 5 MHz | - | 20 MHz | 2 MHz | - | 5 MHz |
| 数据保留时间-最小值 | 40 | - | 200 | 40 | - | 40 |
| 耐久性 | 1000000 Write/Erase Cycles | - | 4000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | - | R-PDSO-N8 | R-PDSO-G8 | - | R-PDSO-G8 |
| JESD-609代码 | e3 | - | e4 | e4 | - | e3 |
| 长度 | 5.62 mm | - | 3 mm | 4.9 mm | - | 5.62 mm |
| 内存密度 | 262144 bit | - | 262144 bit | 262144 bit | - | 262144 bit |
| 内存集成电路类型 | EEPROM | - | EEPROM | EEPROM | - | EEPROM |
| 内存宽度 | 8 | - | 8 | 8 | - | 8 |
| 湿度敏感等级 | 1 | - | 1 | 1 | - | 1 |
| 功能数量 | 1 | - | 1 | 1 | - | 1 |
| 端子数量 | 8 | - | 8 | 8 | - | 8 |
| 字数 | 32768 words | - | 32768 words | 32768 words | - | 32768 words |
| 字数代码 | 32000 | - | 32000 | 32000 | - | 32000 |
| 工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | - | -40 °C |
| 组织 | 32KX8 | - | 32KX8 | 32KX8 | - | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | SOP | - | HVSON | SOP | - | SOP |
| 封装等效代码 | SOP8,.3 | - | SOLCC8,.11,20 | SOP8,.25 | - | SOP8,.3 |
| 封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | - | SQUARE |
| 封装形式 | SMALL OUTLINE | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | - | SMALL OUTLINE |
| 并行/串行 | SERIAL | - | SERIAL | SERIAL | - | SERIAL |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | - | 260 |
| 电源 | 3/5 V | - | 2/5 V | 2/5 V | - | 3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 2.5 mm | - | 0.6 mm | 1.75 mm | - | 2.5 mm |
| 串行总线类型 | SPI | - | SPI | SPI | - | SPI |
| 最大待机电流 | 0.000005 A | - | 0.000003 A | 0.000003 A | - | 0.000005 A |
| 最大压摆率 | 0.005 mA | - | 0.003 mA | 0.003 mA | - | 0.005 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | - | 1.8 V | 1.8 V | - | 2.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 2.5 V | - | 5 V |
| 表面贴装 | YES | - | YES | YES | - | YES |
| 技术 | CMOS | - | CMOS | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING | - | NO LEAD | GULL WING | - | GULL WING |
| 端子节距 | 1.27 mm | - | 0.5 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | - | 30 |
| 宽度 | 5.62 mm | - | 2 mm | 3.9 mm | - | 5.62 mm |
| 最长写入周期时间 (tWC) | 5 ms | - | 5 ms | 5 ms | - | 5 ms |
| 写保护 | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE |
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