(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FSM
T
J
Value
200
Unit
V
3.0
100
−65
to +175
A
A
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 2)
Symbol
R
qJL
R
qJA
Value
13
62
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3)
(I
F
= 3.0 A, T
J
= 25°C)
(I
F
= 4.0 A, T
J
= 25°C)
(I
F
= 3.0 A, T
J
= 150°C)
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, T
J
= 25°C)
(Rated dc Voltage, T
J
= 150°C)
1. Minimum pad size (0.108
×
0.085 inch) for each lead on FR4 board.
2. 1 inch square pad size (1
×
0.5 inch) for each lead on FR4 board.
3. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
V
F
0.84
0.86
0.59
1.0
5.0
V
I
R
mA
mA
100
I
F
, FORWARD CURRENT (A)
T
A
= 150°C
T
A
= 175°C
T
A
= 100°C
I
F
, FORWARD CURRENT (A)
100
T
A
= 150°C
T
A
= 175°C
T
A
= 100°C
10
T
A
= 25°C
10
T
A
= 25°C
1
1
0.1
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
V
F
, FORWARD VOLTAGE (V)
0.1
0.2 0.3 0.4
0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
V
F
, FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
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2
MBRS3200T3G, NRVBS3200T3G
1.0E−02
I
R
, REVERSE CURRENT (A)
1.0E−03
1.0E−04
1.0E−05
1.0E−06
1.0E−07
1.0E−08
1.0E−09
0
T
A
= 25°C
20
40
60
80
100
T
A
= 100°C
T
A
= 175°C
T
A
= 150°C
1.0E−02
I
R
, REVERSE CURRENT (A)
1.0E−03
1.0E−04
1.0E−05
1.0E−06
1.0E−07
1.0E−08
20
40
60
80
100
120 140 160 180 200
T
A
= 25°C
T
A
= 100°C
T
A
= 175°C
T
A
= 150°C
120 140 160 180 200
1.0E−09
0
V
R
, REVERSE VOLTAGE (V)
V
R
, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
1000
T
C
= 25°C
f = 1 MHz
Typical Capacitance
at 0 V = 209 V
100
I
F
, AVERAGE FORWARD CURRENT (A)
7
6
5
4
3
2
1
0
80
90
100 110 120 130 140 150 160 170 180
T
L
, LEAD TEMPERATURE (°C)
SQUARE WAVE
R
qJL
= 13°C/W
dc
C, CAPACITANCE (pF)
10
0
20
40
60
80
100
120 140 160 180 200
V
R
, REVERSE VOLTAGE (V)
Figure 5. Typical Capacitance
Figure 6. Current Derating
−
Lead
P
fo
, AVERAGE POWER DISSIPATION (W)
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
SQUARE WAVE
dc
0
1
2
3
4
5
6
I
O
, AVERAGE FORWARD CURRENT (A)
Figure 7. Forward Power Dissipation
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3
MBRS3200T3G, NRVBS3200T3G
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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