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HCPL-900J-000E: 产品描述EEPROM 2K, 256x8 1.8V Serial EE; 产品类别模拟混合信号IC 驱动程序和接口; 文件大小315KB，共14页; 制造商Broadcom(博通); 标准

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HCPL-900J-000E在线购买

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HCPL-900J-000E概述

EEPROM 2K, 256x8 1.8V Serial EE

HCPL-900J-000E规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Broadcom(博通)
包装说明	,
Reach Compliance Code	compliant
ECCN代码	EAR99
Samacsys Confidence	4
Samacsys Status	Released
Samacsys PartID	534149
Samacsys Pin Count	16
Samacsys Part Category	Integrated Circuit
Samacsys Package Category	Small Outline Packages
Samacsys Footprint Name	Wide Body SOIC-16 Package
Samacsys Released Date	2016-11-13 01:02:45
Is Samacsys	N
JESD-609代码	e3
湿度敏感等级	1
端子面层	Matte Tin (Sn)
Base Number Matches	1

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HCPL-9000/-0900, -9030/-0930,

HCPL-9031/-0931, -900J/-090J,

HCPL-901J/-091J, -902J/-092J

High Speed Digital Isolators

Data Sheet

Lead (Pb) Free

RoHS 6 fully

compliant

RoHS 6 fully compliant options available;

-xxxE denotes a lead-free product

Description

The HCPL-90xx and HCPL-09xx CMOS digital isolators

feature high speed performance and excellent transient

immunity specifications. The symmetric magnetic

coupling barrier gives these devices a typical pulse width

distortion of 2 ns, a typical propagation delay skew of

4 ns and 100 Mbaud data rate, making them the indus-

try’s fastest digital isolators.

The single channel digital isolators (HCPL-9000/

-0900) features an active-low logic output enable.

The dual channel digital isolators are configured as

unidirectional (HCPL-9030/-0930) and bi-directional

(HCPL-9031/-0931), operating in full duplex mode making

it ideal for digital fieldbus applications.

The quad channel digital isolators are configured as

unidirectional (HCPL-900J/-090J), two channels in one

direction and two channels in opposite direction (HCPL-

901J/-091J), and one channel in one direction and

three channels in opposite direction (HCPL-902J/-092J).

These high channel density make them ideally suited

to isolating data conversion devices, parallel buses and

peripheral interfaces.

They are available in 8-pin PDIP, 8-pin Gull Wing, 8-pin

SOIC packages, and 16–pin SOIC narrow-body and

wide-body packages. They are specified over the tem-

perature range of -40°C to +100°C.

Features

•

+3.3V and +5V TTL/CMOS compatible

•

3 ns max. pulse width distortion

•

6 ns max. propagation delay skew

•

15 ns max. propagation delay

•

High speed: 100 MBd

•

15 kV/µs min. common mode rejection

•

Tri-state output (HCPL-9000/-0900)

•

2500 V RMS isolation

•

UL1577 and IEC 61010-1 approved

Applications

•

Digital fieldbus isolation

•

Multiplexed data transmission

•

Computer peripheral interface

•

High speed digital systems

•

Isolated data interfaces

•

Logic level shifting

CAUTION:

It is advised that normal static precautions be taken in handling and assembly

of this component to prevent damage and/or degradation which may be induced by ESD.

HCPL-900J-000E相似产品对比

	HCPL-900J-000E	HCPL-0900-000E	HCPL-0930-500E	HCPL-9030-300E	HCPL-091J-000E	HCPL-9030-000E
描述	EEPROM 2K, 256x8 1.8V Serial EE	Transistor Output Optocouplers Phototransistor Out Dual CTR 100-200%	Digital Isolators Digital Isolator 100MBd	Digital Isolators Digital Isolator (100MBd)	Non-Isolated DC/DC Converters 7.5W 24Vin 5Vout1 1.5A SIP Non-Iso	Digital Isolators Digital Isolator (100MBd)
是否Rohs认证	符合	符合	符合	符合	符合	符合
厂商名称	Broadcom(博通)	Broadcom(博通)	Broadcom(博通)	Broadcom(博通)	Broadcom(博通)	Broadcom(博通)
包装说明	,	SOP,	SOP,	DIP,	SOIC-16	DIP,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-609代码	e3	e3	e3	e3	e3	e3
湿度敏感等级	1	1	1	1	1	1
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Base Number Matches	1	-	-	1	1	1
模拟集成电路 - 其他类型	-	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	-	ANALOG CIRCUIT
JESD-30 代码	-	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	-	R-PDIP-T8
长度	-	4.9 mm	4.9 mm	9.58 mm	-	9.58 mm
功能数量	-	1	1	1	-	1
端子数量	-	8	8	8	-	8
最高工作温度	-	100 °C	100 °C	100 °C	-	100 °C
最低工作温度	-	-40 °C	-40 °C	-40 °C	-	-40 °C
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
封装代码	-	SOP	SOP	DIP	-	DIP
封装形状	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
封装形式	-	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	-	IN-LINE
峰值回流温度（摄氏度）	-	260	260	NOT SPECIFIED	-	260
认证状态	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
座面最大高度	-	1.75 mm	1.75 mm	4.699 mm	-	4.699 mm
最大供电电压 (Vsup)	-	5.5 V	5.5 V	5.5 V	-	5.5 V
最小供电电压 (Vsup)	-	3 V	3 V	3 V	-	3 V
标称供电电压 (Vsup)	-	3.3 V	3.3 V	3.3 V	-	3.3 V
表面贴装	-	YES	YES	NO	-	NO
技术	-	CMOS	CMOS	CMOS	-	CMOS
温度等级	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL
端子形式	-	GULL WING	GULL WING	THROUGH-HOLE	-	THROUGH-HOLE
端子节距	-	1.27 mm	1.27 mm	2.54 mm	-	2.54 mm
端子位置	-	DUAL	DUAL	DUAL	-	DUAL
处于峰值回流温度下的最长时间	-	40	NOT SPECIFIED	NOT SPECIFIED	-	40
宽度	-	3.9 mm	3.9 mm	7.62 mm	-	7.62 mm

HCPL-900J-000E

HCPL-900J-000E在线购买

HCPL-900J-000E概述

HCPL-900J-000E规格参数

文档预览

HCPL-900J-000E相似产品对比

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