Freescale Semiconductor, Inc.
Data Sheet: Advance Information
KV11P64M75
Rev. 3, 06/2015
Kinetis V Series KV10 and KV11,
128/64 KB Flash
75 MHz Cortex-M0+ Based Microcontroller
The Kinetis V Series KV11x MCU family is built on ARM Cortex-
M0+ core and enabled by innovative 90nm thin film storage
(TFS) flash process technology. The KV11x is an extension of
the existing KV10x family providing increased memory, higher
pin count, additional FTMs and a FlexCAN serial interface.
KV11x is ideal for industrial motor control applications, inverters,
and low-end power conversion applications.
MKV11Z128VXX7
MKV11Z64VXX7
MKV10Z64VXX7
MKV10Z128VXX7
32 QFN
64 LQFP
5 x 5 x 1.23 mm Pitch 10 x 10 x 1.4 mm Pitch
0.5 mm
0.5 mm
32 LQFP
7 x 7 x 1.4 mm Pitch
0.8 mm
48 LQFP
7 x 7 x 1.4 mm Pitch
0.5 mm
Performance
• Up to 75 MHz ARM Cortex-M0+ based core
Memories and memory interfaces
• Up to 128 KB of program flash memory
• Up to 16 KB of RAM
System peripherals
• Nine low-power modes to provide power optimization
based on application requirements
• 8-channel DMA controller
• SWD interface and Micro Trace buffer
• Bit Manipulation Engine (BME)
• External watchdog timer
• Advanced independent clocked watchdog
• Memory Mapped Divide and Square Root (MMDVSQ)
module
Clocks
• 32-40 kHz or 4-32 MHz external crystal oscillator
• Multipurpose clock generator (MCG) with frequency-
locked loop referencing either internal or external
reference clock
Security and integrity modules
• 80-bit unique identification (ID) number per chip
• Hardware CRC module
1. Available only on KV11 parts
Communication interfaces
• One 16-bit SPI module
• One I2C module
• Two UART modules
• One FlexCAN module
1
Timers
• Programmable delay block
• Two 6-channel FlexTimers (FTM) for motor control/
general purpose applications
• Four 2-channel FlexTimers (FTM) with quadrature
decoder functionality
• 16-bit low-power timer (LPTMR)
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range (ambient): –40 to 105°C
Analog modules
• Two 16-bit SAR ADCs
• 12-bit DAC
• Two analog comparators (ACMP) containing a 6-bit
DAC and programmable reference input
Human-machine interface
• General-purpose I/O
This document contains information on a new product. Specifications and information
herein are subject to change without notice. © 2014 Freescale Semiconductor, Inc. All
rights reserved.
Ordering Information
1
Part Number
Flash (KB)
MKV11Z128VLH7
MKV11Z128VLF7
MKV11Z128VLC7
2
MKV11Z128VFM7
MKV11Z64VLH7
MKV11Z64VLF7
MKV11Z64VLC7
2
MKV11Z64VFM7
MKV10Z64VLH7
MKV10Z64VLF7
MKV10Z64VLC7
2
MKV10Z64VFM7
MKV10Z128VLH7
MKV10Z128VLF7
MKV10Z128VLC7
2
MKV10Z128VFM7
128
128
128
128
64
64
64
64
64
64
64
128
128
128
128
128
Memory
SRAM (KB)
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
No
No
No
FlexCAN
Maximum number of
I\O's
54
40
28
28
54
40
28
28
54
40
28
28
54
40
28
28
1. To confirm current availability of ordererable part numbers, go to
http://www.freescale.com
and perform a part number
search.
2. The 32-pin LQFP package supporting this part number is not yet available, however it is included in a Package Your
Way program for Kinetis MCUs. Please visit
http://www.freescale.com/KPYW
for more details.
Related Resources
Type
Selector Guide
Product Brief
Reference Manual
Data Sheet
Chip Errata
Package drawing
Description
The Freescale Solution Advisor is a web-based tool that features interactive application wizards and
a dynamic product selector.
The Product Brief contains concise overview/summary information to enable quick evaluation of a
device for design suitability.
The Reference Manual contains a comprehensive description of the structure and function
(operation) of a device.
The Data Sheet includes electrical characteristics and signal connections.
The chip mask set Errata provides additional or corrective information for a particular device mask
set.
Package dimensions are provided in package drawings.
2
Freescale Semiconductor, Inc.
Kinetis V Series KV10 and KV11, 128/64 KB Flash, Rev.3, 06/2015.
LEGEND
Available only on KV11 parts
Figure 1. KV11 block diagram
Kinetis V Series KV10 and KV11, 128/64 KB Flash, Rev.3, 06/2015.
3
Freescale Semiconductor, Inc.
Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings....................................................... 5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................7
2.2.1 Voltage and current operating requirements....... 7
2.2.2 LVD and POR operating requirements................8
2.2.3 Voltage and current operating behaviors.............9
2.2.4 Power mode transition operating behaviors........ 9
2.2.5 KV11x Power consumption operating behaviors.10
2.2.6 EMC radiated emissions operating behaviors..... 16
2.2.7 Designing with radiated emissions in mind..........17
2.2.8 Capacitance attributes.........................................17
2.3 Switching specifications...................................................17
2.3.1 Device clock specifications..................................17
2.3.2 General switching specifications......................... 18
2.4 Thermal specifications..................................................... 19
2.4.1 Thermal operating requirements......................... 19
2.4.2 Thermal attributes................................................19
3 Peripheral operating requirements and behaviors.................. 20
3.1 Core modules.................................................................. 20
3.1.1 SWD Electricals ..................................................20
3.2 System modules.............................................................. 21
3.3 Clock modules................................................................. 21
3.3.1 MCG specifications..............................................21
3.3.2 Oscillator electrical specifications........................23
3.4 Memories and memory interfaces................................... 25
3.4.1 Flash electrical specifications.............................. 25
3.5 Security and integrity modules........................................ 27
3.6 Analog............................................................................. 27
3.6.1
ADC electrical specifications............................... 27
3.6.2 CMP and 6-bit DAC electrical specifications....... 31
3.6.3 12-bit DAC electrical characteristics....................33
3.7 Timers..............................................................................36
3.8 Communication interfaces............................................... 36
3.8.1 DSPI switching specifications (limited voltage
range).................................................................. 36
DSPI switching specifications (full voltage
range).................................................................. 39
3.8.3 I2C....................................................................... 43
3.8.4 UART...................................................................43
Dimensions............................................................................. 43
4.1 Obtaining package dimensions....................................... 43
Pinout...................................................................................... 44
5.1 KV11 Signal Multiplexing and Pin Assignments.............. 44
5.2 KV11 Pinouts................................................................... 47
Ordering parts......................................................................... 50
6.1 Determining valid orderable parts....................................50
Part identification.....................................................................50
7.1 Description.......................................................................51
7.2 Format............................................................................. 51
7.3 Fields............................................................................... 51
7.4 Example...........................................................................51
Terminology and guidelines.................................................... 52
8.1 Definition: Operating requirement....................................52
8.2 Definition: Operating behavior......................................... 52
8.3 Definition: Attribute.......................................................... 52
8.4 Definition: Rating............................................................. 53
8.5 Result of exceeding a rating............................................ 53
8.6 Relationship between ratings and operating
requirements....................................................................54
8.7 Guidelines for ratings and operating requirements..........54
8.8 Definition: Typical value...................................................55
8.9 Typical Value Conditions................................................. 56
9 Revision history.......................................................................56
3.8.2
4
5
6
7
8
4
Freescale Semiconductor, Inc.
Kinetis V Series KV10 and KV11, 128/64 KB Flash, Rev.3, 06/2015.
Ratings
1 Ratings
1.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human-body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105 °C
Min.
-2000
-500
-100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
1.4 Voltage and current operating ratings
Kinetis V Series KV10 and KV11, 128/64 KB Flash, Rev.3, 06/2015.
5
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