IRFZ44S, IRFZ44L, SiHFZ44S, SiHFZ44L
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
()
Q
g
(Max.) (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
67
18
25
Single
D
FEATURES
60
0.028
•
Halogen-free According to IEC 61249-2-21
Definition
• Advanced Process Technology
• Surface Mount (IRFZ44S, SiHFZ44S)
• Low-Profile Through-Hole (IRFZ44L, SiHFZ44L)
• 175 °C Operating Temperature
• Fast Switching
• Compliant to RoHS Directive 2002/95/EC
Third generation Power MOSFETs from Vishay utilize
advanced processing techniques to achieve extermely low
on resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
power MOSFETs are well known for, provides the designer
with an extermely efficient reliabel deviece for use in a wide
variety of applications.
The D
2
PAK is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and lowest possible on-resistance
in any existing surface mount package. The D
2
PAK is
suitable for high current applications because of its low
internal connection resistance and can dissipate up to 2.0 W
in a typical surface mount application.
The through-hole version (IRFZ44L, SiHFZ44L) is available
for low profile applications.
D
2
PAK (TO-263)
SiHFZ44STRR-GE3
a
IRFZ44STRRPbF
a
SiHFZ44STR-E3
a
D
2
PAK (TO-263)
SiHFZ44STRL-GE3
a
IRFZ44STRLPbF
a
SiHFZ44STL-E3
a
I
2
PAK (TO-262)
-
IRFZ44LPbF
SiHFZ44L-E3
DESCRIPTION
I
2
PAK
(TO-262)
D
2
PAK (TO-263)
G
G
D
S
G
D
S
S
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
Note
a. See device orientation.
D
2
PAK (TO-263)
SiHFZ44S-GE3
IRFZ44SPbF
SiHFZ44S-E3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
f
Gate-Source Voltage
f
Continuous Drain Current
e
Continuous Drain Current
Pulsed Drain Current
a, e
Linear Derating Factor
Single Pulse Avalanche Energy
b
Maximum Power Dissipation
Peak Diode Recovery dV/dt
c, f
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature
d
)
Notes
a.
b.
c.
d.
e.
Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
V
DD
= 25 V; starting T
J
= 25 °C, L = 44 μH, R
g
= 25
,
I
AS
= 51 A (see fig. 12).
I
SD
51 A, dI/dt
250 A/μs, V
DD
V
DS
, T
J
175 °C.
1.6 mm from case.
Calculated continuous current based on maximum allowable junction temperature.
SYMBOL
V
DS
V
GS
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
I
D
I
DM
E
AS
T
A
= 25 °C
T
C
= 25 °C
P
D
dV/dt
T
J
, T
stg
for 10 s
LIMIT
60
± 20
50
36
200
1.0
100
3.7
150
4.5
- 55 to + 175
300
UNIT
V
A
W/°C
mJ
W
V/ns
°C
f. Uses IRFZ44, SiHFZ44 data and test conditions.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91293
S11-1063-Rev. C, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRFZ44S, IRFZ44L, SiHFZ44S, SiHFZ44L
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
(PCB Mounted, steady-state)
a
Maximum Junction-to-Case
SYMBOL
R
thJA
R
thJC
TYP.
-
-
MAX.
40
1.0
UNIT
°C/W
Note
a. When mounted on 1” square PCB (FR-4 or G-10 material).
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
Current
a
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DS
V
DS
/T
J
V
GS(th)
I
GSS
I
DSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
S
V
GS
= 0, I
D
= 250 μA
Reference to 25 °C, I
D
= 1 mA
V
DS
= V
GS
, I
D
= 250 μA
V
GS
= ± 20 V
V
DS
= 60 V, V
GS
= 0 V
V
DS
= 48 V, V
GS
= 0 V, T
J
= 150 °C
V
GS
= 10 V
I
D
= 31 A
b
V
DS
= 25 V, I
D
= 31 A
b
60
-
2.0
-
-
-
-
15
-
0.06
-
-
-
-
-
-
-
-
4.0
± 100
25
250
0.028
-
V
V/°C
V
nA
μA
S
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz, see fig. 5
d
-
-
-
-
1900
920
170
-
-
-
14
110
45
92
7.5
-
-
-
67
18
25
-
-
-
-
-
nH
ns
nC
pF
V
GS
= 10 V
I
D
= 51 A, V
DS
= 48 V,
see fig. 6 and 13
b
-
-
-
V
DD
= 30 V, I
D
= 51 A,
R
g
= 9.1
,
R
D
= 0,55
,
see fig. 10
b
Between lead, and center of die contact
-
-
-
-
-
-
-
-
-
-
-
-
120
530
50
d
A
200
2.5
180
800
V
ns
nC
G
S
T
J
= 25 °C, I
S
= 51 A, V
GS
= 0 V
b
T
J
= 25 °C, I
F
= 51 A, dI/dt = 100 A/μs
b, d
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width
300 μs; duty cycle
2 %.
c. Uses IRFZ44, SiHFZ44 data and test conditions.
d. Calculated continuous current based on maximum allowable junction temperature.
www.vishay.com
2
Document Number: 91293
S11-1063-Rev. C, 30-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRFZ44S, IRFZ44L, SiHFZ44S, SiHFZ44L
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
Fig. 1 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
Fig. 2 - Typical Output Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91293
S11-1063-Rev. C, 30-May-11
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRFZ44S, IRFZ44L, SiHFZ44S, SiHFZ44L
Vishay Siliconix
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Fig. 7 - Typical Source-Drain Diode Forward Voltage
’
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 8 - Maximum Safe Operating Area
www.vishay.com
4
Document Number: 91293
S11-1063-Rev. C, 30-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRFZ44S, IRFZ44L, SiHFZ44S, SiHFZ44L
Vishay Siliconix
r
D
V
DS
V
GS
R
g
D.U.T.
+
-
V
DD
10 V
Pulse width
≤
1 µs
Duty factor
≤
0.1 %
Fig. 10a - Switching Time Test Circuit
V
DS
90 %
10 %
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10b - Switching Time Waveforms
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
Document Number: 91293
S11-1063-Rev. C, 30-May-11
www.vishay.com
5
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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