DRAM 256M (16Mx16) 333MHz Commercial Temp
参数名称 | 属性值 |
产品种类 Product Category | DRAM |
制造商 Manufacturer | ISSI(芯成半导体) |
RoHS | No |
类型 Type | SDRAM - DDR1 |
Data Bus Width | 32 bit |
Organization | 8 M x 32 |
封装 / 箱体 Package / Case | FBGA-144 |
Memory Size | 256 Mbit |
Maximum Clock Frequency | 166 MHz |
Access Time | 0.7 ns |
电源电压-最大 Supply Voltage - Max | 2.7 V |
电源电压-最小 Supply Voltage - Min | 2.3 V |
Supply Current - Max | 360 mA |
最小工作温度 Minimum Operating Temperature | 0 C |
最大工作温度 Maximum Operating Temperature | + 70 C |
系列 Packaging | Reel |
高度 Height | 0.9 mm |
长度 Length | 12 mm |
安装风格 Mounting Style | SMD/SMT |
工作电源电压 Operating Supply Voltage | 2.5 V |
工厂包装数量 Factory Pack Quantity | 1500 |
宽度 Width | 12 mm |
IS43R32800B-6B-TR | IS43R83200B-6TLI-TR | IS43R83200B-6TLI | |
---|---|---|---|
描述 | DRAM 256M (16Mx16) 333MHz Commercial Temp | DRAM 256M (32Mx8) 333MHz DDR 2.5v | DRAM 256M (32Mx8) 333MHz DDR 2.5v |
产品种类 Product Category |
DRAM | DRAM | DRAM |
制造商 Manufacturer |
ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) |
RoHS | No | Details | Details |
类型 Type |
SDRAM - DDR1 | SDRAM - DDR1 | SDRAM - DDR1 |
Data Bus Width | 32 bit | 8 bit | 8 bit |
Organization | 8 M x 32 | 32 M x 8 | 32 M x 8 |
封装 / 箱体 Package / Case |
FBGA-144 | TSOP-66 | TSOP-66 |
Memory Size | 256 Mbit | 256 Mbit | 256 Mbit |
Maximum Clock Frequency | 166 MHz | 166 MHz | 166 MHz |
Access Time | 0.7 ns | 0.7 ns | 0.7 ns |
电源电压-最大 Supply Voltage - Max |
2.7 V | 2.7 V | 2.7 V |
电源电压-最小 Supply Voltage - Min |
2.3 V | 2.3 V | 2.3 V |
Supply Current - Max | 360 mA | 250 mA | 250 mA |
最小工作温度 Minimum Operating Temperature |
0 C | - 40 C | - 40 C |
最大工作温度 Maximum Operating Temperature |
+ 70 C | + 85 C | + 85 C |
系列 Packaging |
Reel | Reel | Tray |
安装风格 Mounting Style |
SMD/SMT | SMD/SMT | SMD/SMT |
工作电源电压 Operating Supply Voltage |
2.5 V | 2.5 V | 2.5 V |
工厂包装数量 Factory Pack Quantity |
1500 | 1500 | 108 |
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