ARM Microcontrollers - MCU 32Bit MCU with Flash STR73xF ARM7TDMI
参数名称 | 属性值 |
Brand Name | STMicroelectronics |
是否Rohs认证 | 符合 |
厂商名称 | ST(意法半导体) |
零件包装代码 | BGA |
包装说明 | 10 X 10 MM, 1.70 MM HEIGHT, LFBGA-144 |
针数 | 144 |
Reach Compliance Code | unknown |
Is Samacsys | N |
具有ADC | YES |
地址总线宽度 | |
位大小 | 32 |
CPU系列 | ARM7 |
最大时钟频率 | 8 MHz |
DAC 通道 | NO |
DMA 通道 | YES |
外部数据总线宽度 | |
JESD-30 代码 | S-PBGA-B144 |
JESD-609代码 | e1 |
长度 | 10 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 112 |
端子数量 | 144 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFBGA |
封装等效代码 | BGA144,12X12,32 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字节) | 16384 |
ROM(单词) | 262144 |
ROM可编程性 | FLASH |
座面最大高度 | 1.7 mm |
速度 | 36 MHz |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
Base Number Matches | 1 |
STR735FZ2H6 | STR735FZ1T6 | STR731FV2T7 | STR735FZ2T7 | STR736FV2T7 | STR731FV2T6 | STR736FV1T6 | STR731FV0T6 | STR731FV0T7 | STR735FZ1H7 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | ARM Microcontrollers - MCU 32Bit MCU with Flash STR73xF ARM7TDMI | JTAG Debuggers DEBUG ADAPTER ULINK2 | JTAG Debuggers DEBUG ADAPTER ULINK2 | JTAG Debuggers DEBUG ADAPTER ULINK2 | ARM Microcontrollers - MCU 32Bit MCU with Flash STR73xF ARM7TDMI | Non-Isolated DC/DC Converters 8-32Vin 5Vout 2A SIP Switching Reg. | JTAG Debuggers DEBUG ADAPTER ULINK2 | JTAG Debuggers DEBUG ADAPTER ULINK2 | JTAG Debuggers DEBUG ADAPTER ULINK2 | ARM Microcontrollers - MCU 32Bit MCU with Flash STR73xF ARM7TDMI |
Brand Name | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | BGA | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | BGA |
包装说明 | 10 X 10 MM, 1.70 MM HEIGHT, LFBGA-144 | LFQFP, QFP144,.87SQ,20 | LFQFP, QFP100,.63SQ,20 | LFQFP, QFP144,.87SQ,20 | LFQFP, QFP100,.63SQ,20 | LFQFP, QFP100,.63SQ,20 | LFQFP, QFP100,.63SQ,20 | LFQFP, QFP100,.63SQ,20 | LFQFP, QFP100,.63SQ,20 | 10 X 10 MM, 1.70 MM HEIGHT, LFBGA-144 |
针数 | 144 | 144 | 100 | 144 | 100 | 100 | 100 | 100 | 100 | 144 |
Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | unknown |
具有ADC | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
CPU系列 | ARM7 | ARM7 | ARM7 | ARM7 | ARM7 | ARM7 | ARM7 | ARM7 | ARM7 | ARM7 |
最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PBGA-B144 | S-PQFP-G144 | S-PQFP-G100 | S-PQFP-G144 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PBGA-B144 |
JESD-609代码 | e1 | e3 | e4 | e3 | e4 | e4 | e4 | e4 | e4 | e1 |
长度 | 10 mm | 20 mm | 14 mm | 20 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 10 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
I/O 线路数量 | 112 | 112 | 72 | 112 | 72 | 72 | 72 | 72 | 72 | 112 |
端子数量 | 144 | 144 | 100 | 144 | 100 | 100 | 100 | 100 | 100 | 144 |
最高工作温度 | 85 °C | 85 °C | 105 °C | 105 °C | 105 °C | 85 °C | 85 °C | 85 °C | 105 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFBGA | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFBGA |
封装等效代码 | BGA144,12X12,32 | QFP144,.87SQ,20 | QFP100,.63SQ,20 | QFP144,.87SQ,20 | QFP100,.63SQ,20 | QFP100,.63SQ,20 | QFP100,.63SQ,20 | QFP100,.63SQ,20 | QFP100,.63SQ,20 | BGA144,12X12,32 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 250 | 260 | 250 | 250 | 250 | 250 | 250 | 260 |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 |
ROM(单词) | 262144 | 131072 | 262144 | 262144 | 262144 | 262144 | 131072 | 65536 | 65536 | 131072 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 1.7 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.7 mm |
速度 | 36 MHz | 36 MHz | 36 MHz | 36 MHz | 36 MHz | 36 MHz | 36 MHz | 36 MHz | 36 MHz | 36 MHz |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | BALL |
端子节距 | 0.8 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.8 mm |
端子位置 | BOTTOM | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10 mm | 20 mm | 14 mm | 20 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 10 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | 符合 | - | 符合 | 符合 | 符合 |
Is Samacsys | N | N | N | N | - | N | - | N | N | N |
Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | - | 1 | 1 | 1 |
ECCN代码 | - | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | - |
Factory Lead Time | - | 20 weeks | 20 weeks | 20 weeks | - | 20 weeks | 20 weeks | 20 weeks | 20 weeks | - |
片上程序ROM宽度 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
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