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74AC32MTC

产品描述Phase Locked Loops - PLL WB Synthesizer w/ Intg VCO
产品类别逻辑    逻辑   
文件大小456KB,共11页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
标准
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74AC32MTC概述

Phase Locked Loops - PLL WB Synthesizer w/ Intg VCO

74AC32MTC规格参数

参数名称属性值
Brand NameFairchild Semiconductor
是否无铅不含铅
是否Rohs认证符合
厂商名称Fairchild
零件包装代码TSSOP
包装说明TSSOP, TSSOP14,.25
针数14
制造商包装代码14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys DescriptionQuad 2-Input OR Gate
系列AC
JESD-30 代码R-PDSO-G14
JESD-609代码e4
长度5 mm
负载电容(CL)50 pF
逻辑集成电路类型OR GATE
最大I(ol)0.012 A
湿度敏感等级1
功能数量4
输入次数2
端子数量14
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP14,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法RAIL
峰值回流温度(摄氏度)260
电源3.3/5 V
Prop。Delay @ Nom-Sup10 ns
传播延迟(tpd)10 ns
认证状态Not Qualified
施密特触发器NO
座面最大高度1.2 mm
最大供电电压 (Vsup)6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度4.4 mm
Base Number Matches1

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74AC32MTC相似产品对比

74AC32MTC 74AC32SC_Q 74AC32MTCX 74AC32SC
描述 Phase Locked Loops - PLL WB Synthesizer w/ Intg VCO Logic Gates Quad 2-Input OR Gate Headers u0026 Wire Housings VERT PCB HDR 8P TIN FRICTION LOCK Logic Gates Quad 2-Input OR Gate
Brand Name Fairchild Semiconductor - Fairchild Semiconductor Fairchild Semiconductor
是否无铅 不含铅 - 不含铅 不含铅
是否Rohs认证 符合 - 符合 符合
厂商名称 Fairchild - Fairchild Fairchild
零件包装代码 TSSOP - TSSOP SOIC
包装说明 TSSOP, TSSOP14,.25 - TSSOP, TSSOP14,.25 SOP, SOP14,.25
针数 14 - 14 14
制造商包装代码 14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE - 14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE 14LD,SOIC,JEDEC MS-012, .150\", NARROW BODY
Reach Compliance Code compliant - compliant compliant
ECCN代码 EAR99 - EAR99 EAR99
系列 AC - AC AC
JESD-30 代码 R-PDSO-G14 - R-PDSO-G14 R-PDSO-G14
JESD-609代码 e4 - e4 e3
长度 5 mm - 5 mm 8.625 mm
负载电容(CL) 50 pF - 50 pF 50 pF
逻辑集成电路类型 OR GATE - OR GATE OR GATE
最大I(ol) 0.012 A - 0.012 A 0.012 A
湿度敏感等级 1 - 1 1
功能数量 4 - 4 4
输入次数 2 - 2 2
端子数量 14 - 14 14
最高工作温度 85 °C - 85 °C 85 °C
最低工作温度 -40 °C - -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP - TSSOP SOP
封装等效代码 TSSOP14,.25 - TSSOP14,.25 SOP14,.25
封装形状 RECTANGULAR - RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
包装方法 RAIL - TAPE AND REEL RAIL
峰值回流温度(摄氏度) 260 - 260 NOT SPECIFIED
电源 3.3/5 V - 3.3/5 V 3.3/5 V
Prop。Delay @ Nom-Sup 10 ns - 10 ns 10 ns
传播延迟(tpd) 10 ns - 10 ns 10 ns
认证状态 Not Qualified - Not Qualified Not Qualified
施密特触发器 NO - NO NO
座面最大高度 1.2 mm - 1.2 mm 1.75 mm
最大供电电压 (Vsup) 6 V - 6 V 6 V
最小供电电压 (Vsup) 2 V - 2 V 2 V
标称供电电压 (Vsup) 3.3 V - 3.3 V 3.3 V
表面贴装 YES - YES YES
技术 CMOS - CMOS CMOS
温度等级 INDUSTRIAL - INDUSTRIAL INDUSTRIAL
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn)
端子形式 GULL WING - GULL WING GULL WING
端子节距 0.65 mm - 0.65 mm 1.27 mm
端子位置 DUAL - DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
宽度 4.4 mm - 4.4 mm 3.9 mm
Base Number Matches 1 - 1 1
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