EMX1DXV6T1G,
EMX1DXV6T5G
Dual NPN General Purpose
Amplifier Transistor
This NPN transistor is designed for general purpose amplifier
applications. This device is housed in the SOT-563 package which is
designed for low power surface mount applications, where board
space is at a premium.
Features
www.onsemi.com
•
•
•
•
Reduces Board Space
High h
FE
, 210 −460 (Typical)
Low V
CE(sat)
, < 0.5 V
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
DUAL NPN GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT
(6)
(5)
(4)
MAXIMUM RATINGS
(T
A
= 25°C)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current − Continuous
Symbol
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
C
Value
60
50
7.0
100
Unit
Vdc
Vdc
Vdc
mAdc
6
Symbol
P
D
357 (Note 1)
2.9 (Note 1)
R
qJA
350 (Note 1)
mW
mW/°C
°C/W
Max
Unit
1
SOT−563
CASE 463A
STYLE 1
(1)
(2)
Tr
1
Tr
2
(3)
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance −
Junction-to-Ambient
Characteristic
(Both Junctions Heated)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance −
Junction-to-Ambient
Junction and Storage
Temperature Range
MARKING DIAGRAM
Symbol
P
D
500 (Note 1)
4.0 (Note 1)
R
qJA
T
J
, T
stg
250 (Note 1)
−55 to +150
mW
mW/°C
°C/W
°C
1
3X = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
Max
Unit
3X MG
G
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 @ Minimum Pad
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2016
1
April, 2016 − Rev. 2
Publication Order Number:
EMX1DXV6T1/D
EMX1DXV6T1G, EMX1DXV6T5G
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C)
Characteristic
Collector-Base Breakdown Voltage
(I
C
= 50
mAdc,
I
E
= 0)
Collector-Emitter Breakdown Voltage
(I
C
= 1.0 mAdc, I
B
= 0)
Emitter-Base Breakdown Voltage
(I
E
= 50
mAdc,
I
E
= 0)
Collector-Base Cutoff Current
(V
CB
= 60 Vdc, I
E
= 0)
Emitter-Base Cutoff Current
(V
EB
= 7.0 Vdc, I
B
= 0)
Collector-Emitter Saturation Voltage (Note 2)
(I
C
= 50 mAdc, I
B
= 5.0 mAdc)
DC Current Gain (Note 3)
(V
CE
= 6.0 Vdc, I
C
= 1.0 mAdc)
Transition Frequency
(V
CE
= 12 Vdc, I
C
= 2.0 mAdc, f = 30 MHz)
Output Capacitance
(V
CB
= 12 Vdc, I
C
= 0 Adc, f = 1 MHz)
Symbol
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
I
EBO
V
CE(sat)
−
h
FE
120
f
T
C
OB
−
−
−
180
2.0
560
−
−
MHz
pF
−
0.4
−
Min
60
50
7.0
−
−
Typ
−
−
−
−
−
Max
−
−
−
0.5
0.5
Unit
Vdc
Vdc
Vdc
mA
mA
Vdc
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
3. Pulse Test: Pulse Width
≤
300
ms,
D.C.
≤
2%.
ORDERING INFORMATION
Device
EMX1DXV6T1G
EMX1DXV6T5G
Package
SOT−563
(Pb−Free)
SOT−563
(Pb−Free)
Shipping
†
4000 Units / Tape & Reel
8000 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
2
EMX1DXV6T1G, EMX1DXV6T5G
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
D
−X−
A
L
4
6
5
1
2
3
E
−Y−
H
E
b
e
5
6 PL
M
C
X Y
0.08 (0.003)
DIM
A
b
C
D
E
e
L
H
E
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
STYLE 1:
PIN 1. EMITTER 1
2. BASE 1
3. COLLECTOR 2
4. EMITTER 2
5. BASE 2
6. COLLECTOR 1
1.35
0.0531
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
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Email:
orderlit@onsemi.com
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800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
www.onsemi.com
4
EMX1DXV6T1/D
嵌入式系统
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