Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK10DN128VLF5R

MK10DN128VLF5R: 产品描述FLASH, 50MHz, RISC MICROCONTROLLER, PQFP48; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共59页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

下载文档详细参数选型对比全文预览文档解析

MK10DN128VLF5R在线购买

供应商	器件名称	价格	最低购买	库存
	MK10DN128VLF5R	-	-	点击查看	点击购买

MK10DN128VLF5R概述

FLASH, 50MHz, RISC MICROCONTROLLER, PQFP48

MK10DN128VLF5R规格参数

参数名称	属性值
是否Rohs认证	符合
Objectid	4000166765
包装说明	7 X 7 MM, LQFP-48
Reach Compliance Code	compliant
Country Of Origin	Mainland China
ECCN代码	3A991.A.2
Factory Lead Time	13 weeks
Samacsys Manufacturer	NXP
Samacsys Modified On	2022-12-27 12:55:46
YTEOL	11.3
具有ADC	YES
地址总线宽度
位大小	32
CPU系列	CORTEX-M4
最大时钟频率	50 MHz
DAC 通道	NO
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PQFP-G48
JESD-609代码	e3
长度	7 mm
湿度敏感等级	3
I/O 线路数量	33
端子数量	48
片上程序ROM宽度	8
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	LFQFP
封装等效代码	QFP48,.35SQ,20
封装形状	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
RAM（字节）	16384
ROM（单词）	131072
ROM可编程性	FLASH
座面最大高度	1.6 mm
速度	50 MHz
最大压摆率	18.2 mA
最大供电电压	3.6 V
最小供电电压	3.3 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	40
宽度	7 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC

文档解析

这份文档是关于K10系列微控制器的数据手册，包含了大量的技术信息，以下是一些值得关注的要点：

微控制器家族: K10 Sub-Family，这表明文档涉及的是一个特定的微控制器系列。
支持的型号: 列出了多种型号，例如MK10DN32VLF5、MK10DX32VLF5等，这些型号具有不同的特性和存储容量。
操作特性:
- 电压范围：1.71至3.6伏特。
- Flash写入电压范围：同上。
- 温度范围：-40至105摄氏度。
性能:
- 基于ARM Cortex-M4核心，具有DSP指令，最高频率可达50 MHz，提供1.25 Dhrystone MIPS每MHz。
存储器和存储器接口:
- 程序Flash高达128 KB。
- FlexNVM设备上高达32 KB的FlexNVM。
- FlexMemory设备上2 KB的FlexRAM。
- 高达16 KB的RAM。
时钟:
- 3至32 MHz的晶振。
- 32 kHz的晶振。
- 多用途时钟发生器。
系统外设:
- 多种低功耗模式。
- 4通道DMA控制器。
- 外部看门狗监视器。
- 软件看门狗。
- 低泄漏唤醒单元。
安全和完整性模块:
- 硬件CRC模块。
- 每个芯片128位唯一识别号。
模拟模块:
- 16位SAR ADC。
- 包含6位DAC和可编程参考输入的两个模拟比较器(CMP)。
- 电压参考。
定时器:
- 可编程延迟块。
- 八通道电机控制/通用/PWM定时器。
- 双通道正交解码器/通用定时器。
- 周期性中断定时器。
- 16位低功耗定时器。
- 载波调制发射器。
- 实时时钟。
通信接口:
- SPI模块。
- I2C模块。
- 三个UART模块。
- I2S模块。
订购信息: 提供了如何确定可订购部件号码的指南。
部件识别: 解释了芯片部件号码的格式和字段。
术语和指南: 定义了操作要求、操作行为、属性、等级等术语。
电气特性: 提供了详细的AC电气特性和非开关电气规格。
外设操作要求和行为: 包括核心模块、系统模块、时钟模块、存储器和存储器接口、安全和完整性模块、模拟模块、定时器以及通信接口的详细规格。
尺寸: 提供了获取封装尺寸的信息。
引脚排列: 展示了不同封装类型的引脚排列和信号复用。
修订历史: 记录了文档的修订历史。
联系方式: 提供了Freescale Semiconductor的联系方式和支持信息。

文档预览

下载PDF文档

全文
预览

Freescale Semiconductor

Data Sheet: Technical Data

Document Number: K10P48M50SF0

Rev. 4 5/2012

K10 Sub-Family

K10P48M50SF0

Supports the following:

MK10DN32VLF5, MK10DX32VLF5,

MK10DN64VLF5, MK10DX64VLF5,

MK10DN128VLF5, MK10DX128VLF5,

MK10DN32VFT5, MK10DX32VFT5,

MK10DN64VFT5, MK10DX64VFT5,

MK10DN128VFT5, MK10DX128VFT5

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– 128-bit unique identification (ID) number per chip

• Analog modules

– 16-bit SAR ADC

– Two analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two-channel quadrature decoder/general purpose

timer

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

• Communication interfaces

– SPI module

– I2C module

– Three UART modules

– I2S module

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 50 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 128 KB program flash.

– Up to 32 KB FlexNVM on FlexMemory devices

– 2 KB FlexRAM on FlexMemory devices

– Up to 16 KB RAM

– Serial programming interface (EzPort)

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– Multiple low-power modes to provide power

optimization based on application requirements

– 4-channel DMA controller, supporting up to 41

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts...........................................................................3

1.1 Determining valid orderable parts......................................3

2 Part identification......................................................................3

2.1 Description.........................................................................3

2.2 Format...............................................................................3

2.3 Fields.................................................................................3

2.4 Example............................................................................4

3 Terminology and guidelines......................................................4

3.1 Definition: Operating requirement......................................4

3.2 Definition: Operating behavior...........................................5

3.3 Definition: Attribute............................................................5

3.4 Definition: Rating...............................................................6

3.5 Result of exceeding a rating..............................................6

3.6 Relationship between ratings and operating

requirements......................................................................6

3.7 Guidelines for ratings and operating requirements............7

3.8 Definition: Typical value.....................................................7

3.9 Typical value conditions....................................................8

4 Ratings......................................................................................9

4.1 Thermal handling ratings...................................................9

4.2 Moisture handling ratings..................................................9

4.3 ESD handling ratings.........................................................9

4.4 Voltage and current operating ratings...............................9

5 General.....................................................................................10

5.1 AC electrical characteristics..............................................10

5.2 Nonswitching electrical specifications...............................10

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

5.2.8

Voltage and current operating requirements.........10

LVD and POR operating requirements.................11

Voltage and current operating behaviors..............12

Power mode transition operating behaviors..........13

Power consumption operating behaviors..............14

EMC radiated emissions operating behaviors.......18

Designing with radiated emissions in mind...........19

Capacitance attributes..........................................19

6.8.2

6.8.3

6.8.4

6.8.5

5.3.2

General switching specifications...........................20

5.4 Thermal specifications.......................................................21

5.4.1

5.4.2

Thermal operating requirements...........................21

Thermal attributes.................................................21

6 Peripheral operating requirements and behaviors....................22

6.1 Core modules....................................................................22

6.1.1

JTAG electricals....................................................22

6.2 System modules................................................................25

6.3 Clock modules...................................................................25

6.3.1

6.3.2

6.3.3

MCG specifications...............................................25

Oscillator electrical specifications.........................27

32 kHz Oscillator Electrical Characteristics...........29

6.4 Memories and memory interfaces.....................................30

6.4.1

6.4.2

Flash electrical specifications................................30

EzPort Switching Specifications............................34

6.5 Security and integrity modules..........................................35

6.6 Analog...............................................................................35

6.6.1

6.6.2

6.6.3

ADC electrical specifications.................................35

CMP and 6-bit DAC electrical specifications.........40

Voltage reference electrical specifications............43

6.7 Timers................................................................................44

6.8 Communication interfaces.................................................44

6.8.1

DSPI switching specifications (limited voltage

range)....................................................................44

DSPI switching specifications (full voltage range).46

I2C switching specifications..................................48

UART switching specifications..............................48

I2S/SAI Switching Specifications..........................48

6.9 Human-machine interfaces (HMI)......................................52

6.9.1

TSI electrical specifications...................................52

7 Dimensions...............................................................................54

7.1 Obtaining package dimensions.........................................54

8 Pinout........................................................................................54

8.1 K10 Signal Multiplexing and Pin Assignments..................54

8.2 K10 Pinouts.......................................................................56

9 Revision History........................................................................57

5.3 Switching specifications.....................................................19

5.3.1

Device clock specifications...................................19

K10 Sub-Family Data Sheet, Rev. 4 5/2012.

Freescale Semiconductor, Inc.

MK10DN128VLF5R相似产品对比

	MK10DN128VLF5R	MK10DN64VFT5
描述	FLASH, 50MHz, RISC MICROCONTROLLER, PQFP48	Headers u0026 Wire Housings HDR VERT DOUBLE 10P low profile

MK10DN128VLF5R