The MIC5335 is a high current density, dual Ultra-Low
Dropout (ULDO) linear regulator. The MIC5335 is
ideally suited for portable electronics that demand
overall high performance in a very small form factor.
The MIC5335 is offered in the ultra-small 1.6 mm x
1.6 mm x 0.55 mm 6-lead Thin DFN package, which is
only 2.56 mm
2
in area. The MIC5335 has an
exceptional thermal performance for applications that
demand higher power dissipation in a very small
footprint. In addition, the MIC5335 integrates two
high-performance 300 mA LDOs with independent
enable functions and offers high PSRR, eliminating the
need for a bypass capacitor.
The MIC5335 is a µCap design that enables operation
with very small output capacitors for stability, thereby
reducing required board space and component cost.
The MIC5335 is available in fixed-output voltages.
Additional voltages are available upon customer
request.
Applications
•
•
•
•
•
•
Mobile Phones
PDAs
GPS Receivers
Portable Electronics
Portable Media Players
Digital Still and Video Cameras
Package Type
MIC5335
TDFN-6 (MT)
(Top View)
VIN
GND
EN2
1
2
3
EPAD
6
5
4
VOUT1
VOUT2
EN1
2018 Microchip Technology Inc.
DS20006039A-page 1
MIC5335
Typical Application Circuit
MIC5335-x.xYMT
VIN
EN1
1μF
EN2
GND
1μF
1μF
VOUT1
VOUT2
RX/SYNTH
TX
RF
Receiver
Functional Block Diagram
Current
Limit 1
VIN
LDO1
LDO2
Enable
Current
Limit 2
VOUT1
EN 1
EN 2
VOUT2
Reference
Thermal
Shutdown
GND
DS20006039A-page 2
2018 Microchip Technology Inc.
MIC5335
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (V
IN
) ......................................................................................................................................... 0V to +6V
Enable Input Voltage (V
EN
) ............................................................................................................................... 0V to +6V
Power Dissipation ..................................................................................................................... Internally Limited,
Note 1
Lead Temperature (Soldering, 3 sec.)................................................................................................................... +260°C
Storage Temperature (T
S
)...................................................................................................................... –65°C to +150°C
嵌入式系统
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