DRAM 32M (2Mx16) 166Mhz MDDR 1.8v
参数名称 | 属性值 |
产品种类 Product Category | DRAM |
制造商 Manufacturer | ISSI(芯成半导体) |
RoHS | Details |
类型 Type | SDRAM Mobile - LPDDR1 |
Data Bus Width | 16 bit |
Organization | 2 M x 16 |
封装 / 箱体 Package / Case | TFBGA-60 |
Memory Size | 32 Mbit |
Maximum Clock Frequency | 166 MHz |
Access Time | 6 ns |
电源电压-最大 Supply Voltage - Max | 1.95 V |
电源电压-最小 Supply Voltage - Min | 1.7 V |
Supply Current - Max | 80 mA |
最小工作温度 Minimum Operating Temperature | 0 C |
最大工作温度 Maximum Operating Temperature | + 70 C |
系列 Packaging | Reel |
安装风格 Mounting Style | SMD/SMT |
工作电源电压 Operating Supply Voltage | 1.8 V |
工厂包装数量 Factory Pack Quantity | 2000 |
IS43LR16200C-6BL-TR | IS43LR16200C | IS43LR16200C-6BLI-TR | |
---|---|---|---|
描述 | DRAM 32M (2Mx16) 166Mhz MDDR 1.8v | DRAM 32M, 1.8V, MDDR, 2Mx16 | DRAM 32M (2Mx16) 166Mhz MDDR 1.8v |
产品种类 Product Category |
DRAM | DRAM | DRAM |
制造商 Manufacturer |
ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) |
类型 Type |
SDRAM Mobile - LPDDR1 | SDRAM - DDR1 | SDRAM Mobile - LPDDR1 |
Data Bus Width | 16 bit | 16 bit | 16 bit |
Organization | 2 M x 16 | 2 M x 16 | 2 M x 16 |
封装 / 箱体 Package / Case |
TFBGA-60 | BGA-60 | TFBGA-60 |
Memory Size | 32 Mbit | 32 Mbit | 32 Mbit |
电源电压-最大 Supply Voltage - Max |
1.95 V | 1.95 V | 1.95 V |
电源电压-最小 Supply Voltage - Min |
1.7 V | 1.7 V | 1.7 V |
安装风格 Mounting Style |
SMD/SMT | SMD/SMT | SMD/SMT |
工作电源电压 Operating Supply Voltage |
1.8 V | 1.8 V | 1.8 V |
RoHS | Details | - | Details |
Maximum Clock Frequency | 166 MHz | - | 166 MHz |
Access Time | 6 ns | - | 6 ns |
Supply Current - Max | 80 mA | - | 80 mA |
最小工作温度 Minimum Operating Temperature |
0 C | - | - 40 C |
最大工作温度 Maximum Operating Temperature |
+ 70 C | - | + 85 C |
系列 Packaging |
Reel | - | Reel |
工厂包装数量 Factory Pack Quantity |
2000 | - | 2000 |
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