Gore-Shield
supersoft smt emi gaskets
and grounding pads
®
Unique Surface-
Mountable Solution
Technical Summary
GORE-SHIELD
®
Supersoft SMT EMI Gaskets and Grounding Pads
are highly compressible and resilient electrically conductive pads
that are compatible with standard surface mount technology
(SMT) installation processes.
GORE-SHIELD
®
Supersoft SMT EMI Gaskets and Grounding Pads
are comprised of a conductive silver-coated hollow silicone
extrusion bonded to a solderable silver-plated metal support
layer. Parts are packaged in EIA 481 standard tape-and-reel
format for automated placement and reflow soldering using
standard SMT processes. Parts are soldered to the ground trace
on the PCB like any other SMT-compatible component.
By piecing a series of parts of identical or varying lengths on a
PCB ground trace, a simple and efficient EMI seal can be formed
between the PCB and corresponding shield housing. This enables
users to create a low cost, custom EMI gasket at the board level
without special tooling or custom installation equipment.
Individual parts can be used to create reliable discrete electrical
contact points on the printed circuit board for grounding
purposes.
GORE-SHIELD
®
Supersoft SMT EMI Gasket
Nominal Properties
Part# 25SMT-4442
Property
–01
–03
–04
Length (mm)
Width (mm)
Thickness (mm)
Recommended
Compression
Stop, RCS (mm)
Force Required
to Compress to
RCS (N)
DC Resistance at
RCS (Ohms)
Compression
Set {ambient}
(percent of
original height)
Compression
Set {dry heat}
(percent of
original height)
Compression
Set {moist heat}
(percent of
original height)
3.6
1.7
1.6
1.2
3.6
2.5
2.4
1.9
8.0
Benefits
•
•
•
•
•
•
•
Highly compressible and resilient
Extremely cost effective
Highly conductive at low pressures
No curing required
Repairable
Survives multiple solder reflow operations
Compatible with standard and lead-free solder reflow
2.0
3.2
8.9
0.018
0.030
0.009
Design Suggestions
• Replacements for die-cut, form-in-place or stamped metal
spring-finger gaskets
• RF and DC grounding pads
• Conductive walls for cavity-to-cavity shielding
• Board-to-board interconnects
• Use as primary shielding method or to supplement existing
shielding methods
• Flex circuit grounding
4%
1,000 hours @ 20C
5%
1,000 hours @ 85C
14%
1,000 hours @ 85C
and 85% RH
Applications
• Mobile phones, PDAs, PCMCIAs, WLAN, base-stations,
power amplifiers, laptop computers
• Anywhere high electrical conductivity is needed in a
compressible, resilient form
Covered by Patent No.: US 6,255,581 B1
US 7,129,421 B2
Corresponding Foreign Patents issued and pending
Gore-Shield
supersoft smt emi gaskets
and grounding pads
20.0
18.0
16.0
Compression Force (N)
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
0.8
0.9
1.0
RCS
®
Compression/DC Resistance Performance
0.20
25SMT-4442-01
Force (N)
DC Resistance (Ohms)
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
1.1
1.2
1.3
1.4
Compressed Height (mm)
1.5
0.00
1.6
DC Resistance (Ohms)
RoHS Status
RoHS Material*
Pass/Fail
Lead (Pb) Content
Cadmium (Cd) Content
Hexavalent Chromium (Cr6) Content
Mercury (Hg) Content
Bromine Compounds
Pass
Pass
Pass
Pass
Pass
*W. L. Gore & Associates declares that we do not intentionally add substances listed
in Directive 2002/95/EU to GORE-SHIELD
®
Supersoft SMT EMI Gasket material.
Independent lab tests have been performed and results are available upon request.
20.0
18.0
16.0
Compression Force (N)
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
1.4
1.5
1.6
1.7 1.8 1.9 2.0 2.1
Compressed Height (mm)
2.2
2.3
RCS
25SMT-4442-03
Force (N)
DC Resistance (Ohms)
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
2.4
DC Resistance (Ohms)
DC Resistance (Ohms)
20.0
18.0
16.0
Compression Force (N)
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
1.4
1.5
1.6
1.7
1.8 1.9 2.0 2.1 2.2
Compressed Height (mm)
2.3 2.4
RCS
25SMT-4442-04
Force (N)
DC Resistance (Ohms)
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
2.5
GORE and designs are trademarks of W. L. Gore & Associates, Inc. ©2006 W. L. Gore & Associates, Inc.
North America
1 (800) 445-GORE (4673)
gore.com/emi
More international phone
numbers can be found at
gore.com/phone
Japan
+81 3 3570 8712
Korea
+82 2 393-3411
Taiwan
+886 2 8771 7799
Singapore
+65 6 733 2882
JK051220-03
Europe
+49 9144 6010
+44 1382 561511
International
1 (302) 292-5100
China: Beijing
+86 10 6510 2980
China: Shanghai
+86 21 6247 1999
China: Shenzhen
+86 755 8359 8262
Rev. 8-21-07
W. L. Gore & Associates, Inc.
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