1/31/13
T E C onnec tivity
M8134-HC-8P2 Product Details - TE
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M8134-HC-8P2 Product Details
Discrete Sockets
Always EU RoHS/ELV Compliant
(
Statement of
Compliance
)
Quick Links
C hec k P ric ing & A vailability
Searc h for T ooling
P roduc t Feature Selec tor
C ontac t U s A bout T his P roduc t
Product Highlights:
TE Internal Number: 8-1437514-2
M8134-HC-8P2
(M83505/6-003)
A c tive
V iew 3 D P D F
H O L T I T E P roduc t L ine
Board- to- D evic e
A pplies T o P rinted C irc uit Board
C ontac t - Rated C urrent = 5 A
M ating P in D ia. Range = .6 4 - .8 9 mm
V iew all Features
A dd to M y P art L is t
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Documentation & A dditional Inf ormation
Product Drawings:
H O L T I T E C O N T A C T S
(P D F, E nglis h)
Catalog Pages/Data Sheets:
N one A vailable
Product Specif ications:
A U G A T H O L T I T E Soc kets
(P D F, E nglis h)
A pplication Specif ications:
A U G A T H O L T I T E Soc kets
(P D F, E nglis h)
Instruction Sheets:
N one A vailable
CA D Files: (C
A D Format & C ompres s ion I nformation)
2 D D rawing
(D XF, V ers ion C )
3 D M odel
(I G E S, V ers ion C )
A dditional Inf ormation:
P roduc t L ine I nformation
Related Products:
T ooling
www.te.com/catalog/pn/en/8-1437514-2?RQPN=M83505%2F6-003
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1/31/13
3 D M odel
(ST E P , V ers ion C )
M8134-HC-8P2 Product Details - TE
L is t all D oc uments
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
P roduc t L ine = H O L T I T E
Soc ket L ength (mm [in])
= 3 .4 5 [0 .1 3 6 ]
Rec ommended H ole Size (mm [in]) = 1 .4 7 [0 .0 5 8 ]
Sealant
= Without
P rofile = Zero
Electrical Characteristics:
C ontac t - Rated C urrent (A ) = 5
Termination Features:
I ns ertion M ethod
= H and/Semi- A utomatic
Body Features:
M ating P in D ia. Range (mm [in])
= 0 .6 4 – 0 .8 9 [0 .0 2 5 –
0 .0 3 5 ]
Contact Features:
C ontac t P lating, M ating A rea, M aterial = G old
C ontac t P lating, M ating A rea, T hic knes s (µm [μin]) =
0 .0 0 0 7 6 [0 .0 3 ]
C ontac t T ype = Soc ket
C ontac t Bas e M aterial = Beryllium C opper
Industry Standards:
G overnment/I ndus try Q ualific ation = Y es
G overnment/I ndus try P art N umber = M 8 3 5 0 5 /6 - 0 0 3
RoH S/E L V C omplianc e
= RoH S c ompliant, E L V c ompliant
L ead Free Solder P roc es s es
= N ot relevant for lead free
proc es s
RoH S/E L V C omplianc e H is tory = A lways was RoH S
c ompliant
Conditions f or Usage:
A pplies T o = P rinted C irc uit Board
Operation/A pplication:
A pplic ation U s e = Board- to- D evic e
C ontac t T rans mits (T ypic al A pplic ation) = Signal
(D ata)/P ower
Packaging Features:
P ac kaging M ethod = L oos e P iec e
Other:
Brand = A M P
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