CM6400
EMI Filter with ESD
Protection for Data Line
Applications
Product Description
The CM6400 is a 24−bump EMI filter with ESD protection device
for data line application in a 0.4 mm pitch, 5 x 5 CSP form factor. It is
fully compliant with IEC 61000−4−2 Level 4. The CM6400 is
RoHS
II
compliant.
Features
http://onsemi.com
•
24−Bump, 2.06 mm X 2.06 mm Footprint Chip Scale Package
•
These Devices are Pb−Free and are RoHS Compliant
WLCSP24
CASE 567CH
ELECTRICAL SCHEMATIC
R
L
Level 4
Level 4
GND
1 of 10 Filter Channels
MARKING DIAGRAM
+
6400
WWYY
XXXX
6400
WWYY
XXXX
= CM6400
= Date Code
= Last four digits of lot#
ORDERING INFORMATION
Device
CM6400
Package
CSP−24
(Pb−Free)
Shipping
†
5000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2011
April, 2011
−
Rev. 3
1
Publication Order Number:
CM6400/D
CM6400
PACKAGE / PINOUT DIAGRAMS
Orientation
Marking
A
B
C
D
E
Top View
(Bumps Down View)
Bottom View
(Bumps Up View)
5
A
B
4
3
2
1
+
1
2
3
4
5
A1 Corner
Indicator
6400
C
D
E
Table 1. PIN DESCRIPTIONS
Pin
A2
−
A5
A4
−
A1
B2
−
B5
B4
−
B1
C2
−
C5
A3, D3, C3, E3
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
GND
Description
Pin
C4
−
C1
D2
−
D5
D4
−
D1
E2
−
E5
E4
−
E1
Channel 6
Channel 7
Channel 8
Channel 9
Channel 10
Description
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Storage Temperature Range
Operating Temperature Range
Rating
–55 to +150
–40 to +85
Units
°C
°C
Table 3. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
R
L
C
Resistance
Inductance
Capacitance per channel
(Note 2)
At 1 MHz, V
IN
= 0 V
At 1 MHz, V
IN
= 2.5 V
Att(5)
F
C
V
BR
I
LEAK
V
ESD
Passband attenuation at 5 MHz
Cut−off frequency
Breakdown voltage
Leakage current per channel
Leakage current per chip
ESD Peak Discharge Voltage Protection at all pins:
a) Contact Discharge per IEC 61000−4−2
standard AND
b) Air Discharge per IEC 61000−4−2 standard
Z
SOURCE
= 50
W,
Z
LOAD
= 50
W
I
LOAD
=
±10
mA
V
IN
= +3.0 V
V
IN
=
−3.0
V
(Note 2)
−2.0
±15
±15
±6
23.3
14.2
Parameter
Conditions
Min
100
Typ
125
24
29.2
17.8
−7
200
±6.8
0.01
−0.1
±20
0.10
35
21.4
Max
150
Units
W
nH
pF
pF
dB
MHz
V
mA
mA
kV
1. All parameters specified at T
A
= 25°C unless otherwise noted.
2. Standard IEC 61000−4−2 (C
Discharge
= 150 pF, R
Discharge
= 330
W).
http://onsemi.com
2
CM6400
PACKAGE DIMENSIONS
WLCSP24, 2.06x2.06
CASE 567CH−01
ISSUE O
D
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
DIM
A
A1
A2
b
D
E
e
MILLIMETERS
MIN
MAX
0.63
0.57
0.17
0.24
0.40 REF
0.24
0.29
2.06 BSC
2.06 BSC
0.40 BSC
PIN A1
REFERENCE
2X
2X
0.05 C
0.05 C
TOP VIEW
A2
0.05 C
A
0.05 C
NOTE 3
A1
b
E
D
C
B
A
1
2
24X
0.05 C A B
0.03 C
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
È
SIDE VIEW
e
3
4
5
E
RECOMMENDED
SOLDERING FOOTPRINT*
C
SEATING
PLANE
A1
PACKAGE
OUTLINE
e
0.40
PITCH
0.40
PITCH
24X
0.25
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
4
CM6400/D
模拟与混合信号
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