SMT power inductors
ERU 13, helically wound
Series/Type:
Date:
B82559*A013
November 2012
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© EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
SMT power inductors
Helically wound
Rated inductance 0.5 ... 3.9 µH
Saturation current 12 ... 30 A
Construction
■
■
■
■
B82559*A013
ERU 13
Ferrite core
Magnetically shielded
Winding: enamel copper flat wire
Self-leaded construction under body termination
Features
■
■
■
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Very high rated current
Extremely low DC resistance
Very low profile and smallest possible footprint
Suitable for pick and place processes
Applications
Energy storage chokes for
■
DC/DC converters
■
VRM modules
■
POL converters
Terminals
Lead-free tinned
Marking
Manufacturer, middle block of ordering code,
inductance, date code (YYWW)
Delivery mode and packing units
■
24-mm blister tape, wound on 330-mm dia. reel
■
4.95 mm height = 750 pcs./reel
5.95/6.00 mm height = 500 pcs./reel
Please read
Cautions and warnings
and
Important notes
at the end of this document.
2
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SMT power inductors
Helically wound
Dimensional drawing and layout recommendation
B82559*A013
ERU 13
Dimensions in mm
Taping and packing
Blister tape
4±0.1
Component
B-B
B
_
0
1.5
+0.1
Reel
22.4 max.
13±0.2
2±0.1
1.7±0.1
11.5±0.1
24±0.3
11.2
_
0
16.4
+1.5
_
2
330
+0
62±1.5
IND0351-A
B
5.95 max.
1)
1)
12.8
16±0.1
1.5 min.
Direction of unreeling
6.95 max. for component height = 5.95 mm
IND0398-P-E
Dimensions in mm
Please read
Cautions and warnings
and
Important notes
at the end of this document.
3
11/12
SMT power inductors
Helically wound
Technical data and measuring conditions
Rated inductance L
R
Inductance tolerance
Saturation current I
sat
B82559*A013
ERU 13
Measured with Wayne-Kerr 3260A/3265B at 10 kHz, 0.1 V, +20 °C
10%
Current that will result in approx. 20% drop in inductance value.
Temperature response needs to be verified in specific applications.
Test results on request.
Measured at +20 °C, tolerance
10%
(closer tolerances on request), typical values
+235 °C, 5 s, wetting >90% (IEC 60068-2-58)
To JEDEC J-STD 020D
40
°C … +130 °C
2.2 g (height = 4.95 mm), 2.6 g (height = 5.95/6.00 mm)
DC resistance R
typ
Solderability
Resistance to soldering heat
Operating temperature
Weight
Storage conditions (packaged) –25 °C … +40 °C,
75%
RH
Characteristics and ordering codes
L
R
H
0.50
0.95
1.1
1.4
2.15
2.4
3.0
3.9
I
sat
A
30
25
20
22
15
16.5
13
12
R
typ
m
0.78
1.12
1.72
1.50
3.20
2.76
4.00
4.80
Height h max. Ordering code
mm
4.95
5.95
4.95
6.00
4.95
5.95
4.95
5.95
B82559A0501A013
B82559A0951A013
B82559A0112A013
B82559A0142A013
B82559A0222A013
B82559A0242A013
B82559A0302A013
B82559A0392A013
Sample kit available. Ordering code: B82559X001
For more information refer to chapter “Sample kits”.
Please read
Cautions and warnings
and
Important notes
at the end of this document.
4
11/12
Cautions and warnings
■
Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■
If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■
The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
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Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■
Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read
Cautions and warnings
and
Important notes
at the end of this document.
5
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嵌入式系统
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