XA 16-bit microcontroller 32 K/1 K OTP/ROM/ROMless, 8-channel 8-bit A/D, low voltage 2.7 V.5.5 V, I2C, 2 UARTs, 16 MB address range
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | QCCJ, LDCC68,1.0SQ |
Reach Compliance Code | unknown |
位大小 | 16 |
CPU系列 | XA |
JESD-30 代码 | S-PQCC-J68 |
JESD-609代码 | e0 |
端子数量 | 68 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC68,1.0SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 3/5 V |
认证状态 | Not Qualified |
RAM(字节) | 1024 |
ROM(单词) | 16384 |
ROM可编程性 | UVPROM |
速度 | 30 MHz |
最大压摆率 | 80 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
PXAS37KBA | XA-S3 | PXAS37KBBE | PXAS30KBA | PXAS30KFBE | PXAS30KBBE | PXAS30 | PXAS33KBA | PXAS30KFA | |
---|---|---|---|---|---|---|---|---|---|
描述 | XA 16-bit microcontroller 32 K/1 K OTP/ROM/ROMless, 8-channel 8-bit A/D, low voltage 2.7 V.5.5 V, I2C, 2 UARTs, 16 MB address range | XA 16-bit microcontroller 32 K/1 K OTP/ROM/ROMless, 8-channel 8-bit A/D, low voltage 2.7 V.5.5 V, I2C, 2 UARTs, 16 MB address range | XA 16-bit microcontroller 32 K/1 K OTP/ROM/ROMless, 8-channel 8-bit A/D, low voltage 2.7 V.5.5 V, I2C, 2 UARTs, 16 MB address range | XA 16-bit microcontroller 32 K/1 K OTP/ROM/ROMless, 8-channel 8-bit A/D, low voltage 2.7 V.5.5 V, I2C, 2 UARTs, 16 MB address range | XA 16-bit microcontroller 32 K/1 K OTP/ROM/ROMless, 8-channel 8-bit A/D, low voltage 2.7 V.5.5 V, I2C, 2 UARTs, 16 MB address range | XA 16-bit microcontroller 32 K/1 K OTP/ROM/ROMless, 8-channel 8-bit A/D, low voltage 2.7 V.5.5 V, I2C, 2 UARTs, 16 MB address range | XA 16-bit microcontroller 32 K/1 K OTP/ROM/ROMless, 8-channel 8-bit A/D, low voltage 2.7 V.5.5 V, I2C, 2 UARTs, 16 MB address range | XA 16-bit microcontroller 32 K/1 K OTP/ROM/ROMless, 8-channel 8-bit A/D, low voltage 2.7 V.5.5 V, I2C, 2 UARTs, 16 MB address range | XA 16-bit microcontroller 32 K/1 K OTP/ROM/ROMless, 8-channel 8-bit A/D, low voltage 2.7 V.5.5 V, I2C, 2 UARTs, 16 MB address range |
是否Rohs认证 | 不符合 | - | 符合 | 不符合 | 不符合 | 符合 | - | 不符合 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | QCCJ, LDCC68,1.0SQ | - | QFP, QFP80,.55SQ,20 | QCCJ, LDCC68,1.0SQ | QFP, QFP80,.55SQ,20 | QFP, QFP80,.55SQ,20 | - | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ |
Reach Compliance Code | unknown | - | unknown | unknow | unknow | unknow | - | unknow | unknown |
位大小 | 16 | - | 16 | 16 | 16 | 16 | - | 16 | 16 |
CPU系列 | XA | - | XA | XA | XA | XA | - | XA | XA |
JESD-30 代码 | S-PQCC-J68 | - | S-PQFP-G80 | S-PQCC-J68 | S-PQFP-G80 | S-PQFP-G80 | - | S-PQCC-J68 | S-PQCC-J68 |
JESD-609代码 | e0 | - | e3 | e0 | e0 | e3 | - | e0 | e0 |
端子数量 | 68 | - | 80 | 68 | 80 | 80 | - | 68 | 68 |
最高工作温度 | 70 °C | - | 70 °C | 70 °C | 85 °C | 70 °C | - | 70 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | - | QFP | QCCJ | QFP | QFP | - | QCCJ | QCCJ |
封装等效代码 | LDCC68,1.0SQ | - | QFP80,.55SQ,20 | LDCC68,1.0SQ | QFP80,.55SQ,20 | QFP80,.55SQ,20 | - | LDCC68,1.0SQ | LDCC68,1.0SQ |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | - | FLATPACK | CHIP CARRIER | FLATPACK | FLATPACK | - | CHIP CARRIER | CHIP CARRIER |
电源 | 3/5 V | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - | 3/5 V | 3/5 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
RAM(字节) | 1024 | - | 1024 | 1024 | 1024 | 1024 | - | 1024 | 1024 |
速度 | 30 MHz | - | 30 MHz | 30 MHz | 30 MHz | 30 MHz | - | 30 MHz | 30 MHz |
最大压摆率 | 80 mA | - | 80 mA | 80 mA | 80 mA | 80 mA | - | 80 mA | 80 mA |
表面贴装 | YES | - | YES | YES | YES | YES | - | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | - | GULL WING | J BEND | GULL WING | GULL WING | - | J BEND | J BEND |
端子节距 | 1.27 mm | - | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm | - | 1.27 mm | 1.27 mm |
端子位置 | QUAD | - | QUAD | QUAD | QUAD | QUAD | - | QUAD | QUAD |
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