SML-P11 Series
PICOLED
TM
-eco
Data
Sheet
lOutline
lFeatures
• Ultra compact, thin size 1.0×0.6mm, t=0.2mm
• Accomplishes low power consuming application
specification assured at I
F
=1mA
lSize
1006 (0402)
1006 (0402)
1.0×0.6mm (t=0.2mm)
1.0×0.6mm (t=0.2mm)
lDimensions
Color
Type
V
M
U
D
Y
lRecommended
Solder Pattern
Tolerance :
±0.05
(unit : mm)
(unit : mm)
lSpecifications
PICOLED
TM
-eco
Absolute Maximum Ratings (Ta=25ºC)
Part No.
Chip
Structure
Emitting
Electrical and Optical Characteristics (Ta=25ºC)
Forward Voltag V
F
Reverse Current I
R
Color
Reverse
Operating Temp.
Storage Temp.
Dissipation
Current
Current
Voltage
P
D
(mW)
I
F
(mA) I
FP
(mA) V
R
(V)
Topr(ºC)
Tstg(ºC)
Peak Forward
Power
Forward
Typ.
(V)
I
F
(mA)
Max.
(mA)
V
R
(V)
Dominant Wavelength
lD
Luminous Intensity I
V
I
F
Min. Typ.
Min.*
2
Typ.
Max.*
2
I
F
(nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
SML-P11VT(R)
Red
SML-P11UT(R)
SML-P11DT(R)
SML-P11YT(R)
SML-P11MT(R)
AIGaInP
on GaAs
Orange
621
50
1.8
616
20
52
Yellow
Yellowish
Green
626
621
605
586
569
631
626
608
589
572
1
1.6
1.0
4.0
2.5
7.3
1
100*
1
5
-40
to
+85 -40
to
+100
1.9
1
10
4
602
583
566
4.0
7.6
1.0
2.1
54
*1
: Duty 1/10, 1kHz
*2
: Reference
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© 2015 ROHM Co., Ltd. All rights reserved.
1/7
2016.03 - Rev.C
SML-P11 Series
lElectrical
Characteristics Curves
Data Sheet
Fig.1 Forward Current - Forward Voltages
SML-P11VT
SML-P11UT
SML-P11DT
SML-P11YT
SML-P11MT
Fig.2 Luminous Intensity -
Atmosphere Temperature
RELATIVE LUMINOUS INTENSITY [a.u.]
1.6
I
F
=1mA
100.0
Ta=25ºC
FORWARD CURRENT : I
F
[mA]
1.4
10.0
1.2
1.0
1.0
0.8
0.6
0.4
- 40
SML-P11VT
SML-P11UT
SML-P11DT
SML-P11YT
SML-P11MT
0.1
1.5
2.0
2.5
-20
0
20
40
60
80
100
FORWARD VOLTAGE : V
F
[V]
ATMOSPHERE TEMPERATURE : Ta [ºC]
Fig.3 Luminous Intensity - Forward Current
1.2
Fig.4 Derating
MAXIMUM FORWARD CURRENT : [mA]
30
SML-P11VT
SML-P11UT
SML-P11DT
SML-P11YT
SML-P11MT
RELATIVE LUMINOUS INTENSITY
1.0
SML-P11VT
SML-P11UT
SML-P11DT
SML-P11YT
SML-P11MT
Ta=25ºC
0.8
20
0.6
0.4
10
0.2
0
0
5
10
15
20
0
- 40
-20
0
20
40
60
80
100
FORWARD CURRENT : I
F
[mA]
AMBIENT TEMPERATURE : Ta [ºC]
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© 2015 ROHM Co., Ltd. All rights reserved.
2/7
2016.03 - Rev.C
SML-P11 Series
l
Precaution (Surface Mount Device)
Data Sheet
1.Storage
If the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand
which will influence the performance of the product. Therefore, the package is waterproof. Please use the
product following the conditions:
・
Using Conditions
Classification
①Before
using
②After
opening
package
Temperature
5 to 30ºC
5 to 30ºC
Humidity
30 to 70%RH
Below 70%RH
Expiration Date
Remark
Within 1 year
Storage with waterproof package
from Receiving
Within 168h
Please storing in the airtight container with
our desiccant (silica gel)
Baking
・
Bake the product in case of below:
①The
expiration date is passed.
②The
color of indicator (silica gel) turned from blue to colorless or from green to pink. (Even if the product is
within the expiration date.)
Baking Conditions
・
Temperature
60±3ºC
Remark
Time
12 to 24h
Humidity
Below 20%RH
・
Bake products in reel.
・
Reel and embossed tape are easy to be deformed when baking, so please try not to apply
stress on it.
・
Recommend bake once.
2.Application Methods
2-1. Precaution for Drive System and Off Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that applies on the
products. If drive by constant voltage, it may cause current deviation of the LED and result in deviation of
luminous intensity, so we recommend to drive by constant current. (Deviation of VF Value will cause deviation of
current in LED.) Furthermore, for off mode, please do not apply voltage neither forward nor reverse. Especially,
for the products with the Ag-paste used in the die bonding, there’ high possibility to cause electro migration
s
and result in function failure.
2-2. Operation Life Span
There’ possibility for intensity of light drop according to working conditions and environments (applied
s
current, surrounding temperature and humidity, corrosive gases), please call our Sales staffs for inquiries about
the concerned application below.
①Longtime
intensity of light life
②On
mode all the time
2-3.Applied Stress on Product
The top of the LED is very soft, which the silicon resin is used as sealing resin. Therefore, please pay attention
to the overstress on it which may influence its reliability.
2-4.Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip, Rectifier,
Switching and so on.
3. Others
3-1. Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it
may result in low soldering ability (caused by the change in quality of the plating surface ) or optical
characteristics changes (light intensity, chrominance) and change in quality of die bonding (Ag-paste) materials.
All of the above will cause function failure of the products.
Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of
the surrounding parts of the products and the atmospheric environment).
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© 2015 ROHM Co., Ltd. All rights reserved.
5/7
2016.03 - Rev.C
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