UL Listed Under Recognized Component Index, File Number
156346
Lead Free Finish/RoHS Compliant (Note 1)
B
Dim
A
SMB
Min
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
A
C
B
C
D
E
G
H
J
Mechanical Data
·
·
·
·
·
·
·
·
Case: SMB
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
Polarity: None; Bi-Directional Devices Have No Polarity Indicator
Marking: Date Code and Marking Code (See Page 4)
Ordering Information: See Page 4
Weight: 0.093 grams (approximate)
D
J
H
G
E
All Dimensions in mm
Maximum Ratings
@ T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Non-Repetitive Peak Impulse Current
Non-Repetitive Peak On-State Current
Junction Temperature Range
Storage Temperature Range
Thermal Resistance, Junction to Lead
Thermal Resistance, Junction to Ambient
Typical Positive Temperature Coefficient for Breakdown Voltage
@10/1000us
@8.3ms (one-half cycle)
Symbol
I
pp
I
TSM
T
j
T
STG
R
qJL
R
qJA
DVBR/DT
j
Value
50
30
-40 to +150
-55 to +150
20
100
0.1
Unit
A
A
°C
°C
°C/W
°C/W
%/°C
Maximum Rated Surge Waveform
Waveform
2/10 us
8/20 us
10/160 us
10/700 us
10/560 us
10/1000 us
Standard
GR-1089-CORE
IEC 61000-4-5
FCC Part 68
ITU-T, K.20/K.21
FCC Part 68
GR-1089-CORE
Ipp (A)
300
250
150
100
75
50
I
PP
, PEAK PULSE CURRENT (%)
100
Peak Value (I
pp
)
t
r
= rise time to peak value
t
p
= decay time to half value
Half Value
50
0
0
t
r
t
p
TIME
DS30361 Rev. 7 - 2
1 of 4
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TB0640M - TB3500M
ã
Diodes Incorporated
Electrical Characteristics
@ T
A
= 25°C unless otherwise specified
On-State
Voltage
@ I
T
= 1A
V
T
(V)
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
NEW PRODUCT
Part Number
Rated
Repetitive
Off-State
Voltage
V
DRM
(V)
Off-State
Leakage
Current @
V
DRM
I
DRM
(uA)
5
5
5
5
5
5
5
5
5
5
5
Breakover
Voltage
V
BO
(V)
77
88
98
130
160
180
220
265
300
350
400
Breakover
Current
I
BO
Min
(mA)
50
50
50
50
50
50
50
50
50
50
50
Max
(mA)
800
800
800
800
800
800
800
800
800
800
800
Holding Current
I
H
Min
(mA)
150
150
150
150
150
150
150
150
150
150
150
Max (mA)
800
800
800
800
800
800
800
800
800
800
800
Off-State
Capacitance
C
O
(pF)
140
140
140
90
90
90
90
60
60
60
60
Marking Code
TB0640M
TB0720M
TB0900M
TB1100M
TB1300M
TB1500M
TB1800M
TB2300M
TB2600M
TB3100M
TB3500M
58
65
75
90
120
140
160
190
220
275
320
T064M
T072M
T090M
T110M
T130M
T150M
T180M
T230M
T260M
T310M
T350M
Symbol
V
DRM
I
DRM
V
BR
I
BR
V
BO
I
BO
I
H
V
T
I
PP
C
O
Notes:
Parameter
Stand-off Voltage
Leakage current at stand-off voltage
Breakdown voltage
Breakdown current
Breakover voltage
Breakover current
Holding current
On state voltage
Peak pulse current
Off-state capacitance
NOTE: 3
NOTE: 2
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
2.
I
H
> (V
L
/R
L
) If this criterion is not obeyed, the TSPD triggers but does not return correctly to high-resistance state. The surge
recovery time does not exceed 30ms.
3. Off-state capacitance measured at f = 1.0MHz, 1.0V
RMS
signal, V
R
= 2V
DC
bias.
I
I
PP
I
BO
I
H
I
BR
I
DRM
V
T
V
DRM
V
BR
V
BO
V
DS30361 Rev. 7 - 2
2 of 4
www.diodes.com
TB0640M - TB3500M
100
NORMALIZED BREAKDOWN VOLTAGE
1.2
NEW PRODUCT
I
(DRM)
, OFF-STATE CURRENT (uA)
1.15
V
BR
= (T
J
)
V
BR
= (T
J
= 25°C)
10
1.1
1
1.05
0.1
V
DRM
= 50V
1
0.01
0.95
0.001
-25
0
25
50
75
100
125
150
T
J
, JUNCTION TEMPERATURE (°C)
Fig. 1 Off-State Current vs. Junction Temperature
0.9
-50
-25
0
25
50
75
100 125 150 175
T
J
, JUNCTION TEMPERATURE (°C)
Fig. 2 Relative Variation of Breakdown Voltage
vs. Junction Temperature
1.1
100
NORMALIZED BREAKDOWN VOLTAGE
1.05
V
BO
= (T
J
= 25°C)
I
T
, ON-STATE CURRENT (A)
V
BO
= (T
J
)
10
1
T
j
= 25°C
0.95
-50 -25
0
25
50
75
100 125 150 175
1
1
1.5
2
2.5
3
3.5
4
4.5
5
V
T
, ON-STATE VOLTAGE (V)
Fig. 4 On-State Current vs. On-State Voltage
1
T
J
, JUNCTION TEMPERATURE (ºC)
Fig. 3 Relative Variation of Breakover Voltage
vs. Junction Temperature
1.4
1.3
NORMALIZED HOLDING CURRENT
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
-50
-25
0
25
50
75
100
125
I
H
= (T
J
)
I
H
= (T
J
= 25°C)
NORMALIZED CAPACITANCE
C
O
= (V
R
)
C
O
= (V
R
= 1V)
T
j
= 25°C
f = 1 Mhz
V
RMS
= 1V
0.1
1
10
100
T
J
, JUNCTION TEMPERATURE (°C)
Fig. 5 Relative Variation of Holding Current vs.
Junction Temperature
V
R
, REVERSE VOLTAGE (V)
Fig. 6 Relative Variation of Junction Capacitance
vs. Reverse Voltage Bias
DS30361 Rev. 7 - 2
3 of 4
www.diodes.com
TB0640M - TB3500M
Ordering Information
(Note 4)
Packaging
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
Shipping
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
NEW PRODUCT
Device
TB0640M-13-F
TB0720M-13-F
TB0900M-13-F
TB1100M-13-F
TB1300M-13-F
TB1500M-13-F
TB1800M-13-F
TB2300M-13-F
TB2600M-13-F
TB3100M-13-F
TB3500M-13-F
Notes:
4. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
XXXXX = Product Type Marking Code (See Table on Page 2)
YWW = Date Code Marking
Y = Year ex: 2 = 2002
WW = Week Code 01 to 52
YWW
XXXXX
Date Code Key
Year
Code
2002
2
2003
3
2004
4
2005
5
2006
6
2007
7
2008
8
2009
9
IMPORTANT NOTICE
Diodes, Inc. and its subsidiaries reserve the right to make changes without further notice to any product herein to make corrections, modifications, enhance-
ments, improvements, or other changes. Diodes, Inc. does not assume any liability arising out of the application or use of any product described herein;
neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such
use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.
LIFE SUPPORT
The products located on our website at
www.diodes.com
are not recommended for use in life support systems where a failure or malfunction of the
component may directly threaten life or cause injury without the express written approval of Diodes Incorporated.
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