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TC4467CPD

产品描述logic-input cmos quad drivers
产品类别模拟混合信号IC    驱动程序和接口   
文件大小113KB,共9页
制造商TelCom Semiconductor, Inc. (Microchip Technology)
官网地址http://www.telcom-semi.com/
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TC4467CPD概述

logic-input cmos quad drivers

TC4467CPD规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称TelCom Semiconductor, Inc. (Microchip Technology)
包装说明DIP, DIP14,.3
Reach Compliance Codeunknown
高边驱动器NO
输入特性SCHMITT TRIGGER
接口集成电路类型NAND GATE BASED MOSFET DRIVER
JESD-30 代码R-PDIP-T14
JESD-609代码e0
功能数量4
端子数量14
最高工作温度70 °C
最低工作温度
输出特性TOTEM-POLE
标称输出峰值电流1.2 A
输出极性INVERTED
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP14,.3
封装形状RECTANGULAR
封装形式IN-LINE
电源4.5/18 V
认证状态Not Qualified
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
断开时间0.1 µs
接通时间0.1 µs

TC4467CPD相似产品对比

TC4467CPD TC4469MJD TC4469EJD TC4469CPD TC4468MJD TC4468CPD TC4468COE TC4467MJD TC4467EJD TC4467COE
描述 logic-input cmos quad drivers logic-input cmos quad drivers logic-input cmos quad drivers logic-input cmos quad drivers logic-input cmos quad drivers logic-input cmos quad drivers logic-input cmos quad drivers logic-input cmos quad drivers logic-input cmos quad drivers logic-input cmos quad drivers
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology)
包装说明 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 SO-16 DIP, DIP14,.3 DIP, DIP14,.3 SOP, SOP16,.4
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
高边驱动器 NO NO NO NO NO NO NO NO NO NO
输入特性 SCHMITT TRIGGER SCHMITT TRIGGER SCHMITT TRIGGER SCHMITT TRIGGER SCHMITT TRIGGER SCHMITT TRIGGER SCHMITT TRIGGER SCHMITT TRIGGER SCHMITT TRIGGER SCHMITT TRIGGER
接口集成电路类型 NAND GATE BASED MOSFET DRIVER AND GATE BASED MOSFET DRIVER AND GATE BASED MOSFET DRIVER AND GATE BASED MOSFET DRIVER AND GATE BASED MOSFET DRIVER AND GATE BASED MOSFET DRIVER AND GATE BASED MOSFET DRIVER NAND GATE BASED MOSFET DRIVER NAND GATE BASED MOSFET DRIVER NAND GATE BASED MOSFET DRIVER
JESD-30 代码 R-PDIP-T14 R-GDIP-T14 R-GDIP-T14 R-PDIP-T14 R-GDIP-T14 R-PDIP-T14 R-PDSO-G16 R-GDIP-T14 R-GDIP-T14 R-PDSO-G16
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
功能数量 4 4 4 4 4 4 4 4 4 4
端子数量 14 14 14 14 14 14 16 14 14 16
最高工作温度 70 °C 125 °C 85 °C 70 °C 125 °C 70 °C 70 °C 125 °C 85 °C 70 °C
输出特性 TOTEM-POLE TOTEM-POLE TOTEM-POLE TOTEM-POLE TOTEM-POLE TOTEM-POLE TOTEM-POLE TOTEM-POLE TOTEM-POLE TOTEM-POLE
标称输出峰值电流 1.2 A 1.2 A 1.2 A 1.2 A 1.2 A 1.2 A 1.2 A 1.2 A 1.2 A 1.2 A
输出极性 INVERTED TRUE TRUE TRUE TRUE TRUE TRUE INVERTED INVERTED INVERTED
封装主体材料 PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY
封装代码 DIP DIP DIP DIP DIP DIP SOP DIP DIP SOP
封装等效代码 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 SOP16,.4 DIP14,.3 DIP14,.3 SOP16,.4
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE
电源 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 NO NO NO NO NO NO YES NO NO YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL MILITARY INDUSTRIAL COMMERCIAL MILITARY COMMERCIAL COMMERCIAL MILITARY INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
断开时间 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs
接通时间 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs 0.1 µs

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