3-1/2 digit analog-TO-digitAL converters with hold
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | TelCom Semiconductor, Inc. (Microchip Technology) |
| 包装说明 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| 最大模拟输入电压 | 2 V |
| 最小模拟输入电压 | 0.2 V |
| 转换器类型 | ADC, DUAL-SLOPE |
| JESD-30 代码 | R-PDIP-T40 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0122% |
| 标称负供电电压 | -5 V |
| 模拟输入通道数量 | 1 |
| 位数 | 13 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | +-5 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 1.8 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| TC7117ACPL | TC7116CPL | TC7116ACKW | TC7117IJL | TC7117AIJL | TC7117 | TC7116A | TC7116 | TC7116ACLW | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 3-1/2 digit analog-TO-digitAL converters with hold | 3-1/2 digit analog-TO-digitAL converters with hold | 3-1/2 digit analog-TO-digitAL converters with hold | 3-1/2 digit analog-TO-digitAL converters with hold | 3-1/2 digit analog-TO-digitAL converters with hold | 3-1/2 digit analog-TO-digitAL converters with hold | 3-1/2 digit analog-TO-digitAL converters with hold | 3-1/2 digit analog-TO-digitAL converters with hold | 3-1/2 digit analog-TO-digitAL converters with hold |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | - | 不符合 |
| 厂商名称 | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | - | - | - | TelCom Semiconductor, Inc. (Microchip Technology) |
| 包装说明 | DIP, DIP40,.6 | DIP, DIP40,.6 | QFP, QFP44,.5SQ,32 | DIP, DIP40,.6 | DIP, DIP40,.6 | - | - | - | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | - | - | - | unknown |
| 最大模拟输入电压 | 2 V | 2 V | 2 V | 2 V | 2 V | - | - | - | 2 V |
| 最小模拟输入电压 | 0.2 V | 0.2 V | 0.2 V | 0.2 V | 0.2 V | - | - | - | 0.2 V |
| 转换器类型 | ADC, DUAL-SLOPE | ADC, DUAL-SLOPE | ADC, DUAL-SLOPE | ADC, DUAL-SLOPE | ADC, DUAL-SLOPE | - | - | - | ADC, DUAL-SLOPE |
| JESD-30 代码 | R-PDIP-T40 | R-PDIP-T40 | S-PQFP-G44 | R-GDIP-T40 | R-GDIP-T40 | - | - | - | S-PQCC-J44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | - | - | e0 |
| 最大线性误差 (EL) | 0.0122% | 0.0122% | 0.0122% | 0.0122% | 0.0122% | - | - | - | 0.0122% |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | - | - | - | 1 |
| 位数 | 13 | 13 | 13 | 13 | 13 | - | - | - | 13 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | - | - | 1 |
| 端子数量 | 40 | 40 | 44 | 40 | 40 | - | - | - | 44 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | - | - | - | 70 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | - | - | - | BINARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - | - | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QFP | DIP | DIP | - | - | - | QCCJ |
| 封装等效代码 | DIP40,.6 | DIP40,.6 | QFP44,.5SQ,32 | DIP40,.6 | DIP40,.6 | - | - | - | LDCC44,.7SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - | - | - | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | - | - | - | CHIP CARRIER |
| 电源 | +-5 V | 9 V | 9 V | +-5 V | +-5 V | - | - | - | 9 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - | Not Qualified |
| 最大压摆率 | 1.8 mA | 1.8 mA | 1.8 mA | 1.8 mA | 1.8 mA | - | - | - | 1.8 mA |
| 标称供电电压 | 5 V | 9 V | 9 V | 5 V | 5 V | - | - | - | 9 V |
| 表面贴装 | NO | NO | YES | NO | NO | - | - | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | OTHER | OTHER | - | - | - | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - | - | - | J BEND |
| 端子节距 | 2.54 mm | 2.54 mm | 0.8 mm | 2.54 mm | 2.54 mm | - | - | - | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | - | - | - | QUAD |
stm32/stm8
聊聊、笑笑、闹闹
ARM技术
淘e淘
FPGA/CPLD
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
