Si4856ADY_RC
Vishay Siliconix
R-C Thermal Model Parameters
DESCRIPTION
The parametric values in the R-C thermal model have
been derived using curve-fitting techniques. These
techniques are described in "A Simple Method of
Generating Thermal Models for a Power MOSFET"[1].
When implemented in P-Spice, these values have
matching characteristic curves to the Single Pulse
Transient Thermal Impedance curves for the
MOSFET.
R-C values for the electrical circuit in the Foster/Tank
configuration are included. The corresponding values
for the Cauer/Filter configuration are available upon
request.
Note:
For a detailed explanation of implementing these values in
P-SPICE, refer to Application Note AN609 Thermal Simulations Of
Power MOSFETs on P-SPICE Platform.
R-C THERMAL MODEL FOR TANK CONFIGURATION
R-C VALUES FOR TANK CONFIGURATION
Thermal Resistance (°C/W)
Junction to
RT1
RT2
RT3
RT4
Junction to
CT1
CT2
CT3
CT4
Ambient
2.0053
20.8011
28.2729
28.8060
Ambient
1.6405 m
24.4894 m
358.8053 m
2.5583
Case
N/A
N/A
N/A
N/A
Case
N/A
N/A
N/A
N/A
Foot
468.2017 m
4.8276
7.4177
5.9020
Foot
2.0074 m
39.9180 m
189.7165 m
11.7115 m
Thermal Capacitance (Joules/°C)
This document is intended as a SPICE modeling guideline and does not constitute a commercial product data sheet. Designers should refer to the appropriate data
sheet of the same number for guaranteed specification limits.
Document Number:74114
Revision 14-Nov-05
www.vishay.com
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Si4856ADY_RC
Vishay Siliconix
R-C THERMAL MODEL FOR FILTER CONFIGURATION
R-C VALUES FOR FILTER CONFIGURATION
Thermal Resistance (°C/W)
Junction to
RF1
RF2
RF3
RF4
Junction to
CF1
CF2
CF3
CF4
Note: NA indicates not applicable
Ambient
1.3054
24.3531
34.9946
19.2364
Ambient
263.0147 µ
19.8868 m
325.1676 m
3.6944
Case
N/A
N/A
N/A
N/A
Case
N/A
N/A
N/A
N/A
Foot
3.1425
8.7149
3.5588
3.1301
Foot
4.8377 m
7.2041 m
168.4432 m
17.9200 m
Thermal Capacitance (Joules/°C)
Reference:
[1] "A Simple Method of Generating Thermal Models for a Power MOSFET" by Wharton McDaniel and Kandarp Pandya, IEEE / SEMITHERM 2002
www.vishay.com
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Document Number:74114
Revision 14-Nov-05