versatile single chip telephone
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | SAMES |
包装说明 | DIP, DIP28,.6 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDIP-T28 |
JESD-609代码 | e0 |
端子数量 | 28 |
最高工作温度 | 70 °C |
最低工作温度 | -25 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP28,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 2.5 V |
认证状态 | Not Qualified |
最大压摆率 | 5 mA |
标称供电电压 | 2.5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
SA2532UP | SA2532AP | SA2532 | SA2532AS | SA2532CP | SA2532CS | SA2532US | |
---|---|---|---|---|---|---|---|
描述 | versatile single chip telephone | versatile single chip telephone | versatile single chip telephone | versatile single chip telephone | versatile single chip telephone | versatile single chip telephone | versatile single chip telephone |
是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | SAMES | SAMES | - | SAMES | SAMES | SAMES | SAMES |
包装说明 | DIP, DIP28,.6 | DIP, DIP28,.6 | - | SOP, SOP28,.3 | DIP, DIP28,.6 | SOP, SOP28,.3 | SOP, SOP28,.3 |
Reach Compliance Code | unknown | unknown | - | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | - | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 |
JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 |
端子数量 | 28 | 28 | - | 28 | 28 | 28 | 28 |
最高工作温度 | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -25 °C | -25 °C | - | -25 °C | -25 °C | -25 °C | -25 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | - | SOP | DIP | SOP | SOP |
封装等效代码 | DIP28,.6 | DIP28,.6 | - | SOP28,.3 | DIP28,.6 | SOP28,.3 | SOP28,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
电源 | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 5 mA | 5 mA | - | 5 mA | 5 mA | 5 mA | 5 mA |
标称供电电压 | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | NO | NO | - | YES | NO | YES | YES |
技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | - | OTHER | OTHER | OTHER | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
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