MH203A uses patented techniques to realize +34 dBm
Input IP3 at an LO drive level of +17 dBm and can be used
for upconverting or downconverting high-side LO
applications. This single monolithic integrated circuit does
not require any external baluns or bias elements.
Typical applications include frequency up/down
conversion, modulation and demodulation for receivers and
transmitters used in 2.5G and 3G GSM/CDMA/wCDMA
mobile infrastructure in the cellular frequency band.
Functional Diagram
MH203A
1
2
3
4
8
7
6
5
Applications
•
2.5G and 3G GSM/CDMA/
wCDMA Mobile Infrastructure
Function
LO
IF & RF
*
GND
N/C or GND
Pin No.
2
7
1, 3, 4, 6, 8
5
* External components (inductors & capacitors) are
required to diplex the signal
Specifications
Parameters
RF Frequency Range
LO Frequency Range
IF Frequency Range
SSB Conversion Loss
Noise Figure
Input IP3
Input IP3
Input P1dB
2*LO – RF Isolation
LO – RF Isolation
LO – IF Isolation
RF – IF Isolation
Return Loss: RF Port
Return Loss: IF Port
Return Loss: LO Port
LO Drive Level
Units
MHz
MHz
MHz
dB
dB
dBm
dBm
dBm
dB
dB
dB
dB
dB
dB
dB
dBm
Min
Typ
800 – 960
1000 – 1310
70 – 350
7.3
7.8
+31.5
+34
+17.5
35
30
60
25
20
23
15
+17
Max
Comments
8.5
9.0
+28
+30
See note 1
See note 2
RF=900-960MHz, IF>300MHz, See note 3
All other RF/IF combinations, See notes 1 and 3
Referenced to the LO level at the RF port
25
50
10
10
10
See note 4
See note 4
LO=1064-1089MHz, See note 5
1. Test conditions unless otherwise noted: RF / IF = 803 / 200, 963 / 200, and 963 / 350 MHz with a high-side LO at +17 dBm in a downconverting application at 25 °C.
The diplexer shown on the application circuit is used in the test fixture.
2. Assumes LO injection noise is filtered at the thermal noise floor, -174 dBm/Hz, at the RF, IF, and Image frequencies.
3. IIP3 is measured with
Δf
= 1 MHz with RFin = 0 dBm / tone.
4. The return loss is measured after the diplexer which splits the RF and IF signals from the mixer.
5. The minimum LO port return loss is 9 dB for LO=1000-1064MHz and LO=1089-1310MHz.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
LO Power
Input IF / RF Power
-40 to +85
°C
-65 to +100 °C
+21 dBm
+20 dBm
Rating
Ordering Information
Part No.
MH203A-G
MH203A-PCB
Description
High Dynamic Range Cellular-band MMIC Mixer
(lead-free/green/RoHS-compliant SOIC-8 package)
Fully-Assembled Mixer Application Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 1 of 4 April 2006
MH203A
MH203A
LO
PIN 2
PIN 7
The Communications Edge
TM
Product Information
High Linearity Cellular-Band MMIC Mixer
Typical Upconversion Performance Plots
Performance using the circuitry on the MH203A-PCB Evaluation Board
L1
23 nH
L3
7.5 nH
IF
C2
3.6 pF
C1
8.2 pF
L2
10 nH
C3
7.5 pF
RF
Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness
All passive components are 0402 size.
All other pins on mixer are grounded.
Input IP3 vs RF Frequency vs IF Frequency
High-side Upconversion, LO = +17 dBm, 25 °C
Input IP3 vs RF Frequency vs Temperature
High-side Upconversion, LO = +17 dBm, IF = 326 MHz
Input IP3 vs RF Frequency vs LO Power
High-side Upconversion, IF = 326 MHz, 25 °C
38
36
In p u t IP 3 (d B m )
In p u t IP 3 (d B m )
34
32
30
28
26
750
38
36
34
32
30
28
26
900
950
1000
750
38
36
In p u t IP 3 (d B m )
34
32
30
28
26
850
900
950
1000
750
800
850
900
LO = 15 dBm
LO = 17 dBm
LO = 19 dBm
IF = 312 MHz
IF = 326 MHz
IF = 340 MHz
800
850
-20 °C
+25 °C
+85 °C
800
950
1000
RF Frequency (MHz)
Conv. Loss vs RF Frequency vs IF Frequency
High-side Upconversion, LO = +17 dBm, 25 °C
RF Frequency (MHz)
Conv. Loss vs RF Frequency vs Temperature
High-side Upconversion, LO = +17 dBm, IF = 326 MHz
RF Frequency (MHz)
Conv. Loss vs RF Frequency vs LO Power
High-side Upconversion, IF = 326 MHz, 25 °C
9
C o n v e rs io n L o s s (d B )
C o n v e rs io n L o s s (d B )
8
7
6
5
4
750
800
850
900
950
1000
9
8
7
6
5
4
750
800
850
900
950
1000
9
C o n v e rs io n L o s s (d B )
8
7
6
5
4
750
800
850
900
950
1000
IF = 312 MHz
IF = 326 MHz
IF = 340 MHz
-20 °C
+25 °C
+85 °C
LO = 15 dBm
LO = 17 dBm
LO = 19 dBm
RF Frequency (MHz)
L-R Isolation vs Temperature
High-side Upconversion
RF Frequency (MHz)
L-I Isolation
High-side Upconversion
RF Frequency (MHz)
50
L -R Is o la tio n (d B )
40
30
20
-20°C
10
1000
+25°C
+85°C
1400
L -I Is o la tio n (d B )
70
60
50
40
-20°C
30
1000
+25°C
+85°C
1400
1100
1200
1300
LO Frequency (MHz)
1100
1200
1300
LO Frequency (MHz)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 2 of 4 April 2006
MH203A
Input IP3 vs RF Frequency
High-side Downconversion, LO = +17 dBm, 25 °C
The Communications Edge
TM
Product Information
High Linearity Cellular-Band MMIC Mixer
Typical Downconversion Performance Plots
Performance using the circuitry on the MH203A-PCB Evaluation Board
Input IP3 vs RF Frequency vs Temperature
High-side Downconversion, LO = +17 dBm, IF = 240 MHz
Input IP3 vs RF Frequency vs LO Power
High-side Downconversion, IF = 240 MHz, 25 °C
44
In p u t IP 3 (d B m )
40
36
32
28
750
800
850
In p u t IP 3 (d B m )
36
34
32
30
28
In p u t IP 3 (d B m )
IF = 100 MHz
IF = 200 MHz
IF = 300 MHz
IF = 400 MHz
IF = 150 MHz
IF = 250 MHz
IF = 350 MHz
40
38
-20 °C
+25 °C
+85 °C
40
38
36
34
32
30
28
LO = 15 dBm
LO = 17 dBm
LO = 19 dBm
900
950
1000
750
800
850
900
950
1000
750
800
850
900
950
1000
RF Frequency (MHz)
Conversion Loss vs RF Frequency
High-side Downconversion, LO = +17 dBm, 25 °C
RF Frequency (MHz)
Conv. Loss vs RF Frequency vs Temperature
High-side Downconversion, LO = +17 dBm, IF = 240 MHz
RF Frequency (MHz)
Conv. Loss vs RF Frequency vs LO Power
High-side Downconversion, IF = 240 MHz, 25 °C
9
C o n v e rs io n L o s s (d B )
C o n v e rs io n L o s s (d B )
8
7
6
5
4
750
800
850
900
950
1000
IF = 100 MHz
IF = 200 MHz
IF = 300 MHz
IF = 400 MHz
IF = 150 MHz
IF = 250 MHz
IF = 350 MHz
9
8
7
6
5
4
750
800
850
900
950
1000
9
C o n v e rs io n L o s s (d B )
8
7
6
5
4
750
800
850
900
950
1000
-20 °C
+25 °C
+85 °C
LO = 15 dBm
LO = 17 dBm
LO = 19 dBm
RF Frequency (MHz)
L-R Isolation vs Temperature
High-side Downconversion
RF Frequency (MHz)
L-I Isolation
High-side Downconversion
RF Frequency (MHz)
50
L -R Is o la tio n (d B )
40
30
20
-20°C
10
900
1000
+25°C
+85°C
1400
L -I Is o la tio n (d B )
70
60
50
40
30
900
-20°C
+25°C
+85°C
1100
1200
1300
LO Frequency (MHz)
1000
1100
1200
1300
LO Frequency (MHz)
1400
LO Return Loss
LO = +17 dBm, 25 °C
IF Return Loss
LO = +17 dBm, 25 °C
RF Return Loss
LO = +17 dBm, 25 °C
0
L O R e tu rn L o s s (d B )
-5
-10
-15
-20
-25
900
IF R e tu rn L o s s (d B )
0
-5
-10
-15
-20
-25
200
R F R e tu rn L o s s (d B )
250
300
IF Frequency (MHz)
350
0
-5
-10
-15
-20
-25
750
1000
1100
1200
1300
LO Frequency (MHz)
1400
800
850
900
950
RF Frequency (MHz)
1000
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 3 of 4 April 2006
MH203A
The Communications Edge
TM
Product Information
High Linearity Cellular-Band MMIC Mixer
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260
°C
reflow
temperature) and lead (maximum 245
°C
reflow temperature) soldering processes.
MH203A-G (Lead-Free/Green SOIC-8 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“MH203A-G” designator with an alphanumeric
lot code on the top surface of the package. The
obsolete tin-lead package is marked with an
“M203A” designator with an alpha numeric lot
code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class III
Passes 500 V to <1000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Land Pattern / Mounting Configuration
MSL Rating: Level 2 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Pin Layout
MH203A
1
2
3
4
8
7
6
5
Pin
Function
1
Ground
2
LO Port
3
Ground
4
Ground
5
No Connect / Ground
6
Ground
7
RF / IF Port*
8
Ground
* External components (inductors & capacitors) are
required to diplex the signal
Specifications and information are subject to change without notice
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