fixed dip delay line TD/TR = 5
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Data Delay Devices |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| 其他特性 | MEETS MIL-D-23859C; IMPEDANCE TOL. 10% |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e3 |
| 逻辑集成电路类型 | PASSIVE DELAY LINE |
| 功能数量 | 1 |
| 抽头/阶步数 | 1 |
| 端子数量 | 16 |
| 输出阻抗标称值（Z0） | 50 Ω |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 可编程延迟线 | NO |
| 认证状态 | Not Qualified |
| 座面最大高度 | 7.747 mm |
| 表面贴装 | NO |
| 技术 | HYBRID |
| 端子面层 | Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总延迟标称（td） | 20 ns |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 1504-20A | PTXB2MFR07.0000MHZ | 1504-480F | 620-65R162-FB1290W | 1504-200B | 1504-200F | 1504-20B | |
|---|---|---|---|---|---|---|---|
| 描述 | fixed dip delay line TD/TR = 5 | Parallel - Fundamental Quartz Crystal, 7MHz Nom, ROHS COMPLIANT, HC-49/US, SMD, 4 PIN | fixed dip delay line TD/TR = 5 | Fixed Resistor, Wire Wound, 50W, 0.162ohm, 1250V, 1% +/-Tol, 90ppm/Cel, | fixed dip delay line TD/TR = 5 | fixed dip delay line TD/TR = 5 | fixed dip delay line TD/TR = 5 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | compliant | compliant |
| JESD-609代码 | e3 | e2 | e3 | e3 | e3 | e3 | e3 |
| 端子面层 | Tin (Sn) | Tin/Copper (Sn/Cu) | Tin (Sn) | Matte Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
| 厂商名称 | Data Delay Devices | - | Data Delay Devices | - | Data Delay Devices | Data Delay Devices | Data Delay Devices |
| 零件包装代码 | DIP | - | DIP | - | DIP | DIP | DIP |
| 包装说明 | DIP, | ROHS COMPLIANT, HC-49/US, SMD, 4 PIN | DIP, | - | DIP, | DIP, | DIP, |
| 针数 | 16 | - | 16 | - | 16 | 16 | 16 |
| Is Samacsys | N | - | N | - | N | N | N |
| 其他特性 | MEETS MIL-D-23859C; IMPEDANCE TOL. 10% | AT CUT | MEETS MIL-D-23859C; IMPEDANCE TOL. 10% | - | MEETS MIL-D-23859C; IMPEDANCE TOL. 10% | MEETS MIL-D-23859C; IMPEDANCE TOL. 10% | MEETS MIL-D-23859C; IMPEDANCE TOL. 10% |
| JESD-30 代码 | R-XDIP-T16 | - | R-XDIP-T16 | - | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| 逻辑集成电路类型 | PASSIVE DELAY LINE | - | PASSIVE DELAY LINE | - | PASSIVE DELAY LINE | PASSIVE DELAY LINE | PASSIVE DELAY LINE |
| 功能数量 | 1 | - | 1 | - | 1 | 1 | 1 |
| 抽头/阶步数 | 1 | - | 1 | - | 1 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 2 | 16 | 16 | 16 |
| 输出阻抗标称值（Z0） | 50 Ω | - | 400 Ω | - | 100 Ω | 400 Ω | 100 Ω |
| 输出极性 | TRUE | - | TRUE | - | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIP | - | DIP | - | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | Axial | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 可编程延迟线 | NO | - | NO | - | NO | NO | NO |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 7.747 mm | - | 7.747 mm | - | 7.747 mm | 7.747 mm | 7.747 mm |
| 表面贴装 | NO | YES | NO | - | NO | NO | NO |
| 技术 | HYBRID | - | HYBRID | WIRE WOUND | HYBRID | HYBRID | HYBRID |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 总延迟标称（td） | 20 ns | - | 480 ns | - | 200 ns | 200 ns | 20 ns |
| 宽度 | 7.62 mm | - | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | - | 1 | - | 1 | 1 | 1 |
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