®
TN2540-G
SCR
FEATURES
HIGH SURGE CAPABILITY
HIGH ON-STATE CURRENT
HIGH STABILITY AND RELIABILITY
DESCRIPTION
The TN2540 series of Silicon Controlled Rectifiers
uses a high performance glass passivated tech-
nology.
This SCR is designed for power supplies up to
400Hz on resistive or inductive load.
A
A
K
G
D
2
PAK
ABSOLUTE MAXIMUM RATINGS
Symbol
I
T(RMS)
I
T(AV)
I
TSM
Parameter
RMS on-state current
(180° conduction angle)
Average on-state current
(180° conduction angle)
Non repetitive surge peak on-state current
(Tj initial = 25°C)
I
2
t
dI/dt
T
stg
T
j
Tl
I
2
t Value for fusing
Critical rate of rise of on-state current
dI
G
/dt = 1 A/µs.
I
G
= 100 mA
Storage junction temperature range
Operating junction temperature range
Maximum temperature for soldering during 10s
Tc= 100°C
Tc= 100°C
tp = 8.3 ms
tp = 10 ms
tp = 10ms
Value
25
16
314
300
450
100
- 40 to + 150
- 40 to + 125
260
A
2
s
A/µs
°C
°C
Unit
A
A
A
Symbol
V
DRM
V
RRM
Parameter
Repetitive peak off-state voltage
Tj = 125°C
TN2540-
600G
600
800G
800
Unit
V
May 1998 - Ed: 5
1/5
TN2540-G
THERMAL RESISTANCES
Symbol
Rth(j-a)
Rth(j-c)
Parameter
Junction to ambient (S=1cm
2
)
Junction to case for D.C
Value
45
1.0
Unit
°C/W
°C/W
GATE CHARACTERISTICS
P
G (AV)
= 1W P
GM
= 10 W (tp = 20
µs)
ELECTRICAL CHARACTERISTICS
Symbol
I
GT
Test Conditions
V
D
= 12V (DC) R
L
= 33Ω
Tj= 25°C
Type
MIN
MAX
V
GT
V
GD
I
H
I
L
V
TM
I
DRM
I
RRM
dV/dt
V
D
= 12V (DC) R
L
= 33Ω
V
D
= V
DRM
R
L
= 3.3kΩ
I
T
= 200mA
I
G
= 1.2 I
GT
I
TM
= 50A tp= 380µs
V
D
= V
DRM
V
R
= V
RRM
V
D
=67%V
DRM
Gate open
Gate open
Tj= 25°C
Tj= 125°C
Tj= 25°C
Tj= 25°C
Tj= 25°C
Tj= 25°C
Tj= 125°C
Tj= 125°C
MAX
MIN
MAX
MAX
MAX
MAX
MAX
MIN
Value
3
40
1.3
0.2
50
90
1.5
5
4
500
V
V
mA
mA
V
µA
mA
V/µs
Unit
mA
I
GM
= 4 A (tp = 20
µs)
V
RGM
= 5 V
ORDERING INFORMATION
Add "-TR" suffix for Tape & Reel shipment
TN
SCR
CURRENT
25
40 - 600
SENSITIVITY
G
PACKAGES :
G: D
2
PAK
VOLTAGE
2/5
TN2540-G
Fig. 1:
Maximum average power dissipation ver-
sus average on-state current .
Fig. 2 :
Correlation between maximum average
power dissipation and maximum allowable
tem-
peratures (T
amb
and T
case
) for different thermal
resistances heatsink+contact.
P(W)
α=180°
D.C.
P(W)
25
20
15
10
5
I
T(AV)
(A)
0
0
5
10
15
20
25
α=30°
α=60°
α=120°
α=90°
Tcase (°C)
Rth=3°C/W
Rth=2°C/W
Rth=1°C/W
Rth=0°C/W
25
20
100
105
15
10
5
0
0
110
115
α=180°
120
Tamb(°C)
40
60
80
100
120
140
125
20
Fig. 3:
Average and D.C. on-state current versus
case temperature.
Fig. 4:
Relative variation of thermal impedance
versus pulse duration.
I
T(AV)
(A)
30
D.C.
K=[Zth/Rth]
1.00
Zth(j-c)
25
20
α=180°
Zth(j-a)
15
10
5
0
0
25
Tcase(°C)
50
75
100
125
0.10
tp(s)
0.01
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2 5E+2
Fig. 5:
Relative variation of gate trigger current and
holding current versus junction temperature.
Fig. 6:
Non repetitive surge peak on-state current
versus number of cycles.
I
GT
,I
H
[Tj]/I
GT
,I
H
[Tj=25°C]
2.5
2.0
1.5
1.0
0.5
Tj(°C)
0.0
-40
-20
0
20
40
60
80
100 120 140
I
H
I
GT
I
TSM
(A)
320
280
240
200
160
120
80
40
0
1
Number of cycles
10
100
1000
3/5
Tj initial=25°C
F=50Hz
TN2540-G
Fig. 7:
Non repetitive surge peak on-state current
for a sinusoidal pulse with width tp<10ms, and cor-
responding value of I
2
t.
I
TSM
(A),I²t(A²s)
1000
I
TSM
Tj initial=25°C
Fig. 8:
On-state characteristics (maximum values).
I
TM
(A)
300
100
500
I²t
Tj=Tj max.
Tj max.:
Vto=0.77V
Rt=14mΩ
10
200
tp(ms)
100
1
2
5
10
Tj=25°C
V
TM
(V)
1
0
1
2
3
4
5
Fig. 9:
Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
0
4
8
12
S(Cu) (cm²)
16
20
24
28
32
36
40
Fig. 10:
Typical reflow soldering heat profile, either
for mounting on FR4 or metal-backed boards.
T (°C)
250
200
150
100
50
0
Metal-backed
board
Epoxy FR4
board
245°C
215°C
t (s)
0
40
80
120
160 200 240 280 320 360
4/5
TN2540-G
PACKAGE MECHANICAL DATA
D
2
PAK
DIMENSIONS
A
E
L2
C2
REF.
A
A1
D
Millimeters
4.30
2.49
0.03
0.70
1.25
0.45
1.21
8.95
10.00
4.88
15.00
1.27
1.40
0.40
0°
8°
0°
1.40
4.60 0.169
2.69 0.098
0.23 0.001
0.93 0.027
Inches
0.181
0.106
0.009
0.037
0.024
0.054
0.368
0.405
0.208
0.624
0.055
0.069
0.016
8°
Min. Typ. Max. Min. Typ. Max.
L
L3
A1
B2
B
G
A2
2.0 MIN.
FLAT ZONE
V2
C
R
A2
B
B2
C
C2
D
E
G
L
L2
L3
R
V2
0.048 0.055
0.60 0.017
1.36 0.047
9.35 0.352
10.28 0.393
5.28 0.192
15.85 0.590
1.40 0.050
1.75 0.055
FOOT PRINT DIMENSIONS
(in millimeters)
16.90
MARKING:
TN2540
x00G
10.30
1.30
5.08
3.70
8.90
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
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