Switch ICs - Various 1A Dual-Slot PC Card Pwr Sw
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP |
包装说明 | HTSSOP, TSSOP32,.3 |
针数 | 32 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
其他特性 | ALSO REQUIRES A SUPPLY OF 3 TO 5.5V & 7 TO 13.5V |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G32 |
JESD-609代码 | e4 |
长度 | 11 mm |
湿度敏感等级 | 3 |
信道数量 | 3 |
功能数量 | 1 |
端子数量 | 32 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HTSSOP |
封装等效代码 | TSSOP32,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3,5,12 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 6.1 mm |
TPS2206ADAPG4 | TPS2206ADBRG4 | TPS2206ADBG4 | TPS2204APWPG4 | |
---|---|---|---|---|
描述 | Switch ICs - Various 1A Dual-Slot PC Card Pwr Sw | Switch ICs - Various PC Card Power-Ifc Switch | Switch ICs - Various 1A Dual-Slot PC Card Pwr Sw | Switch ICs - Various 1A Dual-Slot PC Card Pwr Sw |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP | SSOP | SSOP | TSSOP |
包装说明 | HTSSOP, TSSOP32,.3 | SSOP, SSOP30,.3 | SSOP, SSOP30,.3 | HTSSOP, TSSOP24,.25 |
针数 | 32 | 30 | 30 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | ALSO REQUIRES A SUPPLY OF 3 TO 5.5V & 7 TO 13.5V | ALSO REQUIRES A SUPPLY OF 3 TO 5.5V & 7 TO 13.5V | ALSO REQUIRES A SUPPLY OF 3 TO 5.5V & 7 TO 13.5V | ALSO REQUIRES A SUPPLY OF 3 TO 5.5V & 7 TO 13.5V |
可调阈值 | NO | NO | NO | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G32 | R-PDSO-G30 | R-PDSO-G30 | R-PDSO-G24 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 11 mm | 10.2 mm | 10.2 mm | 7.8 mm |
湿度敏感等级 | 3 | 1 | 1 | 2 |
信道数量 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 30 | 30 | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HTSSOP | SSOP | SSOP | HTSSOP |
封装等效代码 | TSSOP32,.3 | SSOP30,.3 | SSOP30,.3 | TSSOP24,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
电源 | 3.3,5,12 V | 3.3,5,12 V | 3.3,5,12 V | 3.3,5,12 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 2 mm | 2 mm | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 6.1 mm | 5.3 mm | 5.3 mm | 4.4 mm |
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