Filtronic
Solid State
Features
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2.7dB Typical Noise Figure
23dB Typical Gain
12dBm Saturated Output Power
12dB Input/Output Return Loss Typical
0.5-6GHz Frequency Bandwidth
+8.5 Volts Dual Bias Supply
DC Decoupled RF Input and Output
Chip Size : 1.62
mm
X1.62
mm
(.064”X.064”)
Chip Thickness : 100µm
2
Pad Dimension : 100µm
.5-6 GHz MESFET Amplifier
LMA110A
Description
The Filtronic LMA110A is a GaAs monolithic distributive amplifier which operates from 0.5 to 6 GHz. This amplifier produces a typical gain of
23dB with a noise figure of 2.7dB. The LMA110A is suitable for wide-band low noise gain block, EW and commercial PCN applications. DC
decoupled input and output RF port. Ground is provided to the circuitry through vias to the backside metallization.
Electrical Specifications
at T
a
=25
°C
(V
DD
=+8.0V, Zin=Zout=50Ω)
Limit
Typ.
23
100
±0.4
2.7
-10
-10
-45
10
Symbol
BW
S21
Ids
∆S21
NF
RLin
RLout
S12
P-1dB
Parameter
Operating Bandwidth
Small Signal Gain
Drain Operating Current
Small Signal Gain Flatness
Noise Figure
Input Return Loss
Output Return Loss
Reverse Isolation
1-dB Gain Compression Power
Test Conditions
V
D
=8V, Vg=-.85V
Min.
0.5
20
60
Max.
6
150
±1
3.5
@ 50% Idss
-35
7
Units
GHz
dB
mA
dB
dB
dB
dB
dB
dBm
Absolute Maximum Ratings
Symbol
Vdd
Idd
Pin
Pt
Tch
Tstg
Tmax.
Parameter/Conditions
Drain Supply Voltage
Total Drain Current
RF Input Power
Power Dissipation
Operating Channel Temperature
Storage Temperature
Max. Assembly Temp.
(1 min. max.)
Min.
Max.
12
150
24
1.8
150
165
300
Units
Volts
mA
dBm
W
°C
°C
°C
-65
Note
s:
1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices.
2. Specifications subject to change without notice.
DSS 004 WD
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Filtronic
Solid State
Assembly Diagram
.5-6 GHz MESFET Amplifier
LMA110A
Notes:
1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond
tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended.
Ultrasonic bonding is not recommended.
2.) The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
3.) Bond on bond or stitch bond acceptable.
4.) Conductor over conductor acceptable. Conductors must not short.
DSS 004 WD
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Filtronic
Solid State
Mechanical Outline
.5-6 GHz MESFET Amplifier
LMA110A
Notes:
1.) Unless Otherwise specified.
2.) All units are in micron (µm).
3.) All bond pads are 100 X 100 µm
2
.
4.) Bias pad (V
DD
) size is 100 X 121.5 µm
2
.
DSS 004 WD
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
MEMS传感器
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