TSSOP
and
MSOP
Small Outline Packages
• Wide range of body sizes
• 8 to 56 lead counts
• Thermally enhanced versions
available (TSSOP-ep and
MSOP-ep)
FEATURES
TSSOP
•
Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
•
Lead Count: 8L to 56L
•
Lead Pitch: 0.50mm & 0.65mm
•
Package Height: 1.20mm max.
•
JEDEC standard compliant (MO-153)
•
Lead-free (Pb-free) and Green
•
Thermal Enhancements: ep (exposed pad)
MSOP
•
Body Size: 3 x 3mm
•
Lead Count: 8L & 10L
•
Lead Pitch: 0.65mm (8L) and 0.50mm (10L)
•
JEDEC standard compliant
•
Lead-free (Pb-free) and Green
•
Thermal enhancements: ep (exposed pad)
DESCRIPTION
STATS ChipPAC offers a complete line of Small Outline
Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.
STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is
suitable for applications requiring a thin profile. TSSOP is a
leadframe based, plastic encapsulated package with gull wing
shaped leads on two sides with lead count ranging from 8 to
56 leads. The ultra thin TSSOP is made possible by optimal wire
looping control during the wire bonding process as well as
optimal package warpage control during the molding process.
TSSOP is designed to fill the niche of low pin count devices
where low profile and small footprint are key design consider-
ations. The TSSOP features 0.5 and 0.65mm lead pitch, and is
ideal for low pin count analog and mixed signal devices in
handheld applications such as PDAs and mobile / cellular
phones.
Taking the reliability of Small Outline Packages (SOP) one
step further, STATS ChipPAC offers a Micro Small Outline
Package (MSOP) for applications requiring thin, small, and
high reliability. This smaller package offers a smaller footprint,
shorter wires for improved electrical connections, and better
moisture reliability (MRT/MSL).
In addition to standard TSSOP and MSOP, STATS ChipPAC
offers thermally enhanced “ep” versions featuring an exposed
die paddle for efficient heat dissipation. The exposed die
attach pad design of the TSSOP package can provide excellent
thermal dissipation by soldering the copper die attach pad
directly onto the PCB, and is ideal for low pin count analog and
mixed signal devices.
STATS ChipPAC uses the latest leadframe technology and
state of the art design and simulation tools to achieve
optimum electrical and thermal performance. STATS ChipPAC’s
state of the art assembly facility and proven materials assure
high yield manufacturing and long term reliability.
APPLICATIONS
• Analog and Operation Amplifiers
• Controllers and Drivers
• Logic, Memory, and RF/Wireless
• Disk drives, video/audio and consumer electronics/
appliances
www.statschippac.com
TSSOP
and
MSOP
Small Outline Packages
SPECIFICATIONS (TSSOP)
Die Thickness
Gold Wire
Lead Finish
Marking
Packing Options
9-11mil range preferred (TSSOP)
6-16mil range preferred (TSSOP-ep)
20µm (0.8mils) diameter, 99.99% Au
Sn/Pb (85/15%) or Matte Tin
Laser
Tube
RELIABILITY (all)
Temperature Cycling
Temp/Humidity Test
Pressure Cooker Test
Condition C, -65°C/150°C, 1000 cycles
85°C/85% RH, 1000 hrs
121°C, 100% RH, 2 atm, 250 hrs
SPECIFICATIONS (MSOP)
Die Thickness
Gold Wire
Lead Finish
Marking
Packing Options
6-9mil range preferred
20µm (0.8mils) diameter, 99.99% Au
Sn/Pb (85/15%) or Matte Tin
Laser
Tube
THERMAL PERFORMANCE,
θ
ja (°C/W)
Package
30L TSSOP
30L TSSOP-ep
Body Size (mm)
4.4 x 7.8 x 0.9
4.4 x 7.8 x 0.9
Pad Size
3.0 x 3.0
3.0 x 3.0
Die Size
2.54 x 2.54
2.54 x 2.54
PCB Vias
0
9
Thermal Performance
θ
ja (°C/W)
74.0
49.5
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-5) under natural convection as defined in JESD51.2.
ELECTRICAL PERFORMANCE:
4.4 x 9.7 x 0.9 (38L)
Conductor
Component
Lead
Wire
TOTALS
Note: Results are simulated values at 100MHz.
Pad Size
(mm)
185 x 113
Lead/Wire
(mm)
0.6-3.09
1.65
Resistance
(mOhm)
5-25
99
104-124
Inductance
Self (nH)
Mutual (nH)
0.30-1.70
1.36
1.66-3.06
0.14-0.77
0.37-0.65
0.51-1.42
Capacitance
Self (pF)
Mutual (pF)
0.09-0.46
0.08
0.17-0.54
0.04-0.21
0.01-0.02
0.05-0.23
CROSS-SECTION
TSSOP
TSSOP-ep
PACKAGE CONFIGURATIONS
Package
TSSOP
Body Size (mm)
3.0 x 4.4
5.0 x 4.4
6.5 x 4.4
7.8 x 4.4
9.7 x 4.4
7.8 x 4.4
Lead Count
8
14, 16
20
24
38
30
48
56
8, 10
MSOP
MSOP
12.5 x 6.1
14.0 x 6.1
3.0 x 3.0
Corporate Office
Global Offices
10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
USA 510-979-8000
JAPAN 81-43-351-3320
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565
CHINA 86-21-5976-5858
UK 44-1483-413-700
MALAYSIA 603-4257-6222
NETHERLANDS 31-38-333-2023
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
©Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005
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