quad/x16/octal?T1/E1/J1 framers
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | CONEXANT |
| 零件包装代码 | BGA |
| 包装说明 | FBGA, |
| 针数 | 208 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | S-PBGA-B208 |
| 长度 | 15 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 8 |
| 端子数量 | 208 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 峰值回流温度（摄氏度） | 225 |
| 认证状态 | Not Qualified |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 电信集成电路类型 | FRAMER |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15 mm |
| CX28398-24 | CX28398-22 | CX28398 | CX28394-22 | CX28395 | CX28395-18 | CX28394 | CX28398-23 | CX28395-19 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | quad/x16/octal?T1/E1/J1 framers | quad/x16/octal?T1/E1/J1 framers | quad/x16/octal?T1/E1/J1 framers | quad/x16/octal?T1/E1/J1 framers | quad/x16/octal?T1/E1/J1 framers | quad/x16/octal?T1/E1/J1 framers | quad/x16/octal?T1/E1/J1 framers | quad/x16/octal?T1/E1/J1 framers | quad/x16/octal?T1/E1/J1 framers |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
| 零件包装代码 | BGA | QFP | - | QFP | - | BGA | - | BGA | BGA |
| 包装说明 | FBGA, | FQFP, | - | LFQFP, | - | BGA, | - | BGA, | BGA, |
| 针数 | 208 | 208 | - | 128 | - | 318 | - | 272 | 318 |
| Reach Compliance Code | compliant | compliant | - | compliant | - | compliant | - | compliant | compliant |
| JESD-30 代码 | S-PBGA-B208 | R-PQFP-G208 | - | R-PQFP-G128 | - | S-PBGA-B318 | - | S-PBGA-B272 | S-PBGA-B318 |
| 长度 | 15 mm | 28 mm | - | 20 mm | - | 27 mm | - | 27 mm | 27 mm |
| 湿度敏感等级 | 1 | 1 | - | 1 | - | 1 | - | 1 | 1 |
| 功能数量 | 8 | 8 | - | 4 | - | 16 | - | 8 | 16 |
| 端子数量 | 208 | 208 | - | 128 | - | 318 | - | 272 | 318 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | - | 70 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | - | - | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | FQFP | - | LFQFP | - | BGA | - | BGA | BGA |
| 封装形状 | SQUARE | RECTANGULAR | - | RECTANGULAR | - | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH | FLATPACK, FINE PITCH | - | FLATPACK, LOW PROFILE, FINE PITCH | - | GRID ARRAY | - | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | 225 | 225 | - | 225 | - | 225 | - | 225 | 225 |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
| 标称供电电压 | 3.3 V | 3.3 V | - | 3.3 V | - | 3.3 V | - | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | - | YES | - | YES | - | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | - | CMOS | - | CMOS | CMOS |
| 电信集成电路类型 | FRAMER | FRAMER | - | FRAMER | - | FRAMER | - | FRAMER | FRAMER |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | - | COMMERCIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | GULL WING | - | GULL WING | - | BALL | - | BALL | BALL |
| 端子节距 | 0.8 mm | 0.5 mm | - | 0.5 mm | - | 1.27 mm | - | 1.27 mm | 1.27 mm |
| 端子位置 | BOTTOM | QUAD | - | QUAD | - | BOTTOM | - | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15 mm | 28 mm | - | 14 mm | - | 27 mm | - | 27 mm | 27 mm |
| 座面最大高度 | - | 4.1 mm | - | 1.6 mm | - | 2.44 mm | - | 2.44 mm | 2.44 mm |
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