controlled by a highly efficient GaAIAs infrared LED.
The PLA110 can be used to replace mechanical
relays, and offers the superior reliability associated
with semiconductor devices. Because it has no
moving parts, it offers faster, bounce-free switching
in a more compact surface mount or thru-hole
package.
Features
•
3750V
rms
Input to Output Isolation
•
Small 6-Pin Package
•
Low Drive Power Requirements
(TTL/CMOS Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
FCC Compatible
•
VDE Compatible
•
Machine Insertable, Wave Solderable
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, PocketSize)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
PLA110
PLA110S
PLA110STR
Description
6-Lead DIP (50/Tube)
6-Lead Surface Mount (50/Tube)
6-Lead Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
1
2
3
6
5
4
+ Control
- Control
NC
Load
Do Not Use
Load
DC Only Configuration
1
2
3
6
5
4
+ Control
- Control
NC
+ Load
- Load
Switching Characteristics of
Normally Open Devices
Form-A
I
F
90%
Pb
RoHS
2002/95/EC
e
3
www.clare.com
I
LOAD
t
on
10%
t
off
DS-PLA110-R06
1
PLA110
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Package Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
Min
-
-
-
-
-
-
3750
-40
-40
Max
400
5
50
1
150
800
-
+85
+125
Units
V
P
V
mA
A
mW
mW
V
rms
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate Linearly 1.33 mW / ºC
Derate Linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current
Continuous, AC/DC Configuration
Continuous, DC Configuration
Peak
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current
Input Dropout Current
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
-
-
t=10ms
I
L
=150mA
I
L
=250mA
V
L
=400V
P
I
L
I
LPK
-
-
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
-
-
-
-
-
-
25
-
0.7
1.2
-
3
150
250
400
22
7
1
1
0.5
-
5
-
1.4
10
-
mA
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
Ω
μA
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=150mA
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
μA
pF
2
www.clare.com
R06
PLA110
PERFORMANCE DATA*
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA
DC
, T
A
=25ºC)
25
20
15
10
5
0
0.23
0.26
0.29
0.32
0.35
0.38
Turn-Off (ms)
25
20
15
10
5
0
0.12
0.17
0.22
0.27
0.32
0.37
Turn-Off (ms)
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA
DC
, T
A
=25ºC)
35
30
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=150mA
DC
, T
A
=25ºC)
Device Count (N)
Device Count (N)
15
16
17
18
19
20
On-Resistance (Ω)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=150mA
DC
, TA=25ºC)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, T
A
=25ºC)
35
30
Device Count (N)
25
20
15
10
5
0
Typical Blocking Voltage Distribution
(N=50, T
A
=25ºC)
Device Count (N)
Device Count (N)
0.75
1.05
1.35
1.65
1.95
2.25
0.75
1.05
1.35
1.65
1.95
2.25
441.5 450.5
459.5
468.5
477.5
486.5
LED Current (mA)
LED Current (mA)
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA, T
A
=25ºC)
35
30
Device Count (N)
Turn-On (ms)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
0.40
0.35
Typical Turn-On
vs. LED Forward Current
(I
L
=150mA
DC
)
0.12
0.10
Turn-Off (ms)
0.08
0.06
0.04
0.02
0
Typical Turn-Off
vs. LED Forward Current
(I
L
=150mA
DC
)
0.30
0.25
0.20
0.15
0.10
0.05
0
0
5
10
15
20
25
30
35
40
45
50
Forward Current (mA)
0
5
10
15
20
25
30
35
40
45
50
Forward Current (mA)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
1.6
Turn-On (ms)
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
0.6
0.5
0.4
Typical Turn-On vs. Temperature
(I
L
=100mA
DC
)
I
F
=5mA
Turn-Off (ms)
Typical Turn-Off vs. Temperature
(I
F
=5mA, I
L
=100mA
DC
)
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
I
F
=10mA
0.3
0.2
0.1
0
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
I
F
=50mA
I
F
=10mA
I
F
=5mA
-40
-20
0
20
40
60
80
100
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R06
www.clare.com
3
PLA110
PERFORMANCE DATA*
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=100mA
DC
)
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=100mA
DC
)
Typical Load Current vs. Load Voltage
(I
F
=5mA, T
A
=25ºC)
3.0
2.5
LED Current (mA)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
-40
150
Load Current (mA)
100
50
0
-50
-100
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
-20
0
20
40
60
80
100
-150
-2.5 -2.0 -1.5 -1.0 -0.5
0
0.5 1.0 1.5 2.0 2.5
Temperature (ºC)
Load Voltage (V)
25
On-Resistance (Ω)
20
15
10
Typical On-Resistance vs. Temperature
AC/DC Configuration
(I
L
=150mA
DC
)
I
F
=5mA
On-Resistance (Ω)
I
F
=10mA
10
9
8
7
6
5
0
Typical On-Resistance
vs. Temperature - DC Configuration
(I
L
=150mA
DC
)
25
I
F
=5mA
On-Resistance (Ω)
20
15
10
5
0
-40
Typical On Resistance
vs. Temperature
(I
F
=5mA; I
L
=100mA Instantaneous)
I
F
=10mA
5
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
-40
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100
120
Temperature (ºC)
Temperature (ºC)
Typical Load Current vs. Temperature
(N=50, T
A
=25ºC)
300
Blocking Voltage (V
P
)
Load Current (mA)
250
200
150
100
50
0
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
AC/DC Configuration
DC Configuration
Typical Blocking Voltage
vs. Temperature
480
475
470
465
460
455
450
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Leakage (μA)
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-40
Typical Leakage vs. Temperature
Measured across Pins 4&6
I
F
=10mA
I
F
=5mA
I
F
=10mA
I
F
=5mA
-20
0
20
40
60
80
100
Temperature (ºC)
Energy Rating Curve
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
0
10μs 100μs 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
www.clare.com
R06
PLA110
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all
of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry
standard,
IPC/JEDEC J-STD-020,
in force at the time of product evaluation. We test all of our products to
the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled
according to the limitations and information in that standard as well as to any limitations set forth in the information or
standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA110 / PLA110S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLA110 / PLA110S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated
products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes.
Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy
FPGA/CPLD
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