4,194,304-word x 4-bit dynamic ram
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Hitachi （Renesas ） |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, SOJ24/26,.34 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE |
| 最长访问时间 | 70 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-J24 |
| JESD-609代码 | e0 |
| 长度 | 16.9 mm |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | FAST PAGE DRAM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 24 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 4MX4 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ24/26,.34 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 4096 |
| 座面最大高度 | 3.76 mm |
| 自我刷新 | YES |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.07 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| HM51W16400LS-7 | HM51W17400TS-6 | HM51W17400LS-7 | HM51W17400LS-6 | HM51W17400TS-5 | HM51W17400LS-5 | HM51W17400S-7 | HM51W17400S-5 | HM51W16400 | HM51W16400S-5 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 4,194,304-word x 4-bit dynamic ram | 4,194,304-word x 4-bit dynamic ram | 4,194,304-word x 4-bit dynamic ram | 4,194,304-word x 4-bit dynamic ram | 4,194,304-word x 4-bit dynamic ram | 4,194,304-word x 4-bit dynamic ram | 4,194,304-word x 4-bit dynamic ram | 4,194,304-word x 4-bit dynamic ram | 4,194,304-word x 4-bit dynamic ram | 4,194,304-word x 4-bit dynamic ram |
| 厂商名称 | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | - | Hitachi （Renesas ） |
| 零件包装代码 | SOJ | TSOP2 | SOJ | SOJ | TSOP2 | SOJ | SOJ | SOJ | - | SOJ |
| 包装说明 | SOJ, SOJ24/26,.34 | TSOP2, TSOP24/26,.36 | SOJ, SOJ24/26,.34 | SOJ, SOJ24/26,.34 | TSOP2, | SOJ, | SOJ, SOJ24/26,.34 | SOJ, | - | SOJ, |
| 针数 | 24 | 26 | 24 | 24 | 26 | 24 | 24 | 24 | - | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | - | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | - | FAST PAGE |
| 最长访问时间 | 70 ns | 60 ns | 70 ns | 60 ns | 50 ns | 50 ns | 70 ns | 50 ns | - | 50 ns |
| JESD-30 代码 | R-PDSO-J24 | R-PDSO-G24 | R-PDSO-J24 | R-PDSO-J24 | R-PDSO-G24 | R-PDSO-J24 | R-PDSO-J24 | R-PDSO-J24 | - | R-PDSO-J24 |
| 长度 | 16.9 mm | 17.14 mm | 16.9 mm | 16.9 mm | 17.14 mm | 16.9 mm | 16.9 mm | 16.9 mm | - | 16.9 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | - | 16777216 bit |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | - | FAST PAGE DRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | - | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | - | 24 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | - | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | - | 4000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | 70 °C |
| 组织 | 4MX4 | 4MX4 | 4MX4 | 4MX4 | 4MX4 | 4MX4 | 4MX4 | 4MX4 | - | 4MX4 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | SOJ | TSOP2 | SOJ | SOJ | TSOP2 | SOJ | SOJ | SOJ | - | SOJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 3.76 mm | 1.2 mm | 3.76 mm | 3.76 mm | 1.2 mm | 3.76 mm | 3.76 mm | 3.76 mm | - | 3.76 mm |
| 自我刷新 | YES | NO | YES | YES | - | YES | NO | - | - | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| 端子形式 | J BEND | GULL WING | J BEND | J BEND | GULL WING | J BEND | J BEND | J BEND | - | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | - | 7.62 mm |
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