high performance stepper motor drive circuit
| 参数名称 | 属性值 |
| 厂商名称 | Ericsson |
| 零件包装代码 | QLCC |
| 包装说明 | QCCJ, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | STEPPER MOTOR CONTROLLER |
| JESD-30 代码 | S-PQCC-J28 |
| 长度 | 11.5062 mm |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最大输出电流 | 1.8 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.5062 mm |
| Base Number Matches | 1 |
| PBL3770AQNS | PBL3770ASOT | PBL3770AQNT | PBL3770A | PBL3770ASOS | PBL3770ANS | |
|---|---|---|---|---|---|---|
| 描述 | high performance stepper motor drive circuit | high performance stepper motor drive circuit | high performance stepper motor drive circuit | high performance stepper motor drive circuit | high performance stepper motor drive circuit | high performance stepper motor drive circuit |
| 厂商名称 | Ericsson | Ericsson | Ericsson | Ericsson | Ericsson | Ericsson |
| 零件包装代码 | QLCC | SOIC | QLCC | SOIC | SOIC | DIP |
| 包装说明 | QCCJ, | SOP, | QCCJ, | SOP, | SOP, | DIP, |
| 针数 | 28 | 20 | 28 | 20 | 20 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | STEPPER MOTOR CONTROLLER | STEPPER MOTOR CONTROLLER | STEPPER MOTOR CONTROLLER | STEPPER MOTOR CONTROLLER | STEPPER MOTOR CONTROLLER | STEPPER MOTOR CONTROLLER |
| JESD-30 代码 | S-PQCC-J28 | R-PDSO-G20 | S-PQCC-J28 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T16 |
| 长度 | 11.5062 mm | 12.8 mm | 11.5062 mm | 12.8 mm | 12.8 mm | 20.13 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 20 | 28 | 20 | 20 | 16 |
| 最大输出电流 | 1.8 A | 1.8 A | 1.8 A | 1.8 A | 1.8 A | 1.8 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | SOP | QCCJ | SOP | SOP | DIP |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 2.65 mm | 4.57 mm | 2.65 mm | 2.65 mm | 5.33 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 端子形式 | J BEND | GULL WING | J BEND | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL |
| 宽度 | 11.5062 mm | 7.5 mm | 11.5062 mm | 7.5 mm | 7.5 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
嵌入式系统
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