cmos extended voltage calling number identification circuit (ecnic)
MT88E41 | MT88E41AN | MT88E41AE | MT88E41AS | |
---|---|---|---|---|
描述 | cmos extended voltage calling number identification circuit (ecnic) | cmos extended voltage calling number identification circuit (ecnic) | cmos extended voltage calling number identification circuit (ecnic) | cmos extended voltage calling number identification circuit (ecnic) |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
厂商名称 | - | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) |
包装说明 | - | SOP, SSOP20,.3 | DIP, DIP16,.3 | SOP, SOP16,.4 |
Reach Compliance Code | - | unknown | unknown | unknown |
JESD-30 代码 | - | R-PDSO-G20 | R-PDIP-T16 | R-PDSO-G16 |
JESD-609代码 | - | e0 | e0 | e0 |
长度 | - | 7.2 mm | 20.065 mm | 10.2997 mm |
功能数量 | - | 1 | 1 | 1 |
端子数量 | - | 20 | 16 | 16 |
最高工作温度 | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | SOP | DIP | SOP |
封装等效代码 | - | SSOP20,.3 | DIP16,.3 | SOP16,.4 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 |
电源 | - | 3/5 V | 3/5 V | 3/5 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 2 mm | 5.33 mm | 2.6416 mm |
最大压摆率 | - | 0.005 mA | 0.005 mA | 0.005 mA |
表面贴装 | - | YES | NO | YES |
技术 | - | CMOS | CMOS | CMOS |
电信集成电路类型 | - | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT |
温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | - | 0.635 mm | 2.54 mm | 1.27 mm |
端子位置 | - | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 5.3 mm | 7.62 mm | 7.493 mm |
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