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JAN1N3029C

产品描述1 watt metal case zener diodes
产品类别分立半导体    二极管   
文件大小187KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
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JAN1N3029C概述

1 watt metal case zener diodes

JAN1N3029C规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Microsemi
零件包装代码DO-13
包装说明O-MALF-W2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
其他特性HIGH RELIABILITY
外壳连接CATHODE
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-202AA
JESD-30 代码O-MALF-W2
JESD-609代码e0
湿度敏感等级1
元件数量1
端子数量2
最高工作温度175 °C
最低工作温度-65 °C
封装主体材料METAL
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1 W
认证状态Not Qualified
参考标准MIL-19500/115
标称参考电压24 V
表面贴装NO
技术ZENER
端子面层TIN LEAD
端子形式WIRE
端子位置AXIAL
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差2%
工作测试电流10.5 mA
Base Number Matches1

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1N3016B thru 1N3051B
1 WATT METAL CASE ZENER DIODES
SCOTTSDALE DIVISION
DESCRIPTION
This well established zener diode series for the 1N3016 thru 1N3051
JEDEC registration in the metal case DO-13 package provides a glass
hermetic seal for 6.8 to 200 volts. It is also well suited for high-reliability
applications where it is available in JAN, JANTX, and JANTXV military
qualifications. Lower voltages are also available in the 1N3821 thru
1N3830 series (3.3 V to 7.5 V) in the same package (see separate data
sheet). Microsemi also offers numerous other Zener diode products for a
variety of other packages including surface mount.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-13
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
Zener Voltage Range: 6.8V to 200V
Hermetically sealed DO-13 metal package
Internally solder-bonded construction.
Also available in JAN, JANTX, JANTXV
qualifications per MIL-PRF19500/115 by adding the
JAN, JANTX, or JANTXV prefixes to part numbers
for desired level of screening, e.g. JANTX1N3016B,
JANTXV1N3051B, etc.
Surface mount also available with 1N3016BUR-1
thru 1N3051BUR-1 series on separate data sheet
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 6.8 to 200 V
Tight voltage tolerances available
Low reverse (leakage) currents
Nonsensitive to ESD
Hermetically sealed metal package
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
Operating Junction and Storage Temperatures:
-65
o
C to +175
o
C
THERMAL RESISTANCE: 50
o
C/W* junction to lead
at 0.375 inches (10 mm) from body or 110
o
C/W
junction to ambient when leads are mounted on FR4
PC board with 4 mm
2
copper pads (1 oz) and track
width 1 mm, length 25 mm
DC Power Dissipation
*
: 1.0 Watt at T
L
< +125
o
C 3/8”
(10 mm) from body or 1.0 Watts at T
L
< +65
o
C when
mounted on FR4 PC board as described for thermal
resistance above (also see Fig 1)
Forward Voltage @ 200 mA: 1.5 Volts.
Solder Temperatures: 260
o
C for 10 s (maximum)
MECHANICAL AND PACKAGING
CASE: DO-13 (DO-202AA), welded, hermetically
sealed metal and glass
FINISH: All external surfaces are Tin-Lead (Pb/Sn)
plated and solderable per MIL-STD-750 method
2026
POLARITY: Cathode connected case.
WEIGHT: 1.4 grams.
Tape & Reel option: Standard per EIA-296 (add
“TR” suffix to part number)
See package dimensions on last page
1N3016B – 1N3051B
*
For further mounting reference, thermal resistance from junction to metal case may be reduced to
<
20
o
C/W
when mounting DO-13 metal case directly on heat sink.
Copyright
2003
11-03-2003 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

 
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