Date
Mar. 19. 2003
32M (x16) Flash Memory
LH28F320BFHG-PTTLZK
LHF32FDJ
•
Handle this document carefully for it contains material protected by international copyright law. Any reproduction,
full or in part, of this material is prohibited without the express written permission of the company.
•
When using the products covered herein, please observe the conditions written herein and the precautions outlined in
the following paragraphs. In no event shall the company be liable for any damages resulting from failure to strictly
adhere to these conditions and precautions.
(1) The products covered herein are designed and manufactured for the following application areas. When using the
products covered herein for the equipment listed in Paragraph (2), even for the following application areas, be sure
to observe the precautions given in Paragraph (2). Never use the products for the equipment listed in Paragraph
(3).
•
Office electronics
•
Instrumentation and measuring equipment
•
Machine tools
•
Audiovisual equipment
•
Home appliance
•
Communication equipment other than for trunk lines
(2) Those contemplating using the products covered herein for the following equipment which demands high
reliability, should first contact a sales representative of the company and then accept responsibility for
incorporating into the design fail-safe operation, redundancy, and other appropriate measures for ensuring
reliability and safety of the equipment and the overall system.
•
Control and safety devices for airplanes, trains, automobiles, and other transportation equipment
•
Mainframe computers
•
Traffic control systems
•
Gas leak detectors and automatic cutoff devices
•
Rescue and security equipment
•
Other safety devices and safety equipment, etc.
(3) Do not use the products covered herein for the following equipment which demands extremely high performance
in terms of functionality, reliability, or accuracy.
•
Aerospace equipment
•
Communications equipment for trunk lines
•
Control equipment for the nuclear power industry
•
Medical equipment related to life support, etc.
(4) Please direct all queries and comments regarding the interpretation of the above three Paragraphs to a sales
representative of the company.
•
Please direct all queries regarding the products covered herein to a sales representative of the company.
Rev. 2.44
LHF32FDJ
1
CONTENTS
PAGE
0.75mm pitch 48-Ball CSP (7mm×7mm) Pinout ....... 3
Pin Descriptions.......................................................... 4
Simultaneous Operation Modes
Allowed with Four Planes .................................. 5
Memory Map .............................................................. 6
PAGE
Extended Status Register Definition ......................... 15
Partition Configuration Register Definition.............. 16
Partition Configuration ............................................. 16
1 Electrical Specifications......................................... 17
1.1 Absolute Maximum Ratings ........................... 17
Identifier Codes and OTP Address
for Read Operation ............................................. 7
Identifier Codes and OTP Address for
Read Operation on Partition Configuration........ 7
OTP Block Address Map for OTP Program............... 8
1.2 Operating Conditions ...................................... 17
1.2.1 Capacitance .............................................. 18
1.2.2 AC Input/Output Test Conditions ............ 18
1.2.3 DC Characteristics ................................... 19
Bus Operation............................................................. 9
Command Definitions .............................................. 10
Functions of Block Lock and Block Lock-Down..... 12
Block Locking State Transitions upon
Command Write................................................ 12
Block Locking State Transitions upon
WP# Transition................................................. 13
Status Register Definition......................................... 14
2 Related Document Information.............................. 29
1.2.4 AC Characteristics
- Read-Only Operations......................... 21
1.2.5 AC Characteristics
- Write Operations ................................. 25
1.2.6 Reset Operations ...................................... 27
1.2.7 Block Erase, Full Chip Erase,
(Page Buffer) Program and
OTP Program Performance.................... 28
Rev. 2.44
LHF32FDJ
2
LH28F320BFHG-PTTLZK
32Mbit (2Mbit×16)
Page Mode Dual Work Flash MEMORY
32M density with 16Bit I/O Interface
High Performance Reads
• 80/35ns 8-Word Page Mode
Configurative 4-Plane Dual Work
• Flexible Partitioning
• Read operations during Block Erase or (Page Buffer)
Program
• Status Register for Each Partition
Low Power Operation
• 2.7V Read and Write Operations
• V
CCQ
for Input/Output Power Supply Isolation
• Automatic Power Savings Mode Reduces I
CCR
in Static Mode
Enhanced Code + Data Storage
• 5µs Typical Erase/Program Suspends
OTP (One Time Program) Block
• 4-Word Factory-Programmed Area
• 4-Word User-Programmable Area
High Performance Program with Page Buffer
• 16-Word Page Buffer
• 5µs/Word (Typ.) at 12V V
PP
Operating Temperature -40°C to +85°C
CMOS Process (P-type silicon substrate)
Flexible Blocking Architecture
• Eight 4K-word Parameter Blocks
• Sixty-three 32K-word Main Blocks
• Top Parameter Location
Enhanced Data Protection Features
• Individual Block Lock and Block Lock-Down with
Zero-Latency
• All blocks are locked at power-up or device reset.
• Absolute Protection with V
PP
≤V
PPLK
• Block Erase, Full Chip Erase, (Page Buffer) Word
Program Lockout during Power Transitions
Automated Erase/Program Algorithms
• 3.0V Low-Power
11µs/Word
(Typ.)
Programming
• 12V No Glue Logic 9µs/Word (Typ.)
Production Programming and 0.5s Erase (Typ.)
Cross-Compatible Command Support
• Basic Command Set
• Common Flash Interface (CFI)
Extended Cycling Capability
• Minimum 100,000 Block Erase Cycles
0.75mm pitch 48-Ball CSP (7mm×7mm)
ETOX
TM*
Flash Technology
Not designed or rated as radiation hardened
The product, which is 4-Plane Page Mode Dual Work (Simultaneous Read while Erase/Program) Flash memory, is a low
power, high density, low cost, nonvolatile read/write storage solution for a wide range of applications. The product can
operate at V
CC
=2.7V-3.6V and V
PP
=1.65V-3.6V or 11.7V-12.3V. Its low voltage operation capability greatly extends
battery life for portable applications.
The product provides high performance asynchronous page mode. It allows code execution directly from Flash, thus
eliminating time consuming wait states. Furthermore, its newly configurative partitioning architecture allows flexible dual
work operation.
The memory array block architecture utilizes Enhanced Data Protection features, and provides separate Parameter and Main
Blocks that provide maximum flexibility for safe nonvolatile code and data storage.
Fast program capability is provided through the use of high speed Page Buffer Program.
Special OTP (One Time Program) block provides an area to store permanent code such as a unique number.
* ETOX is a trademark of Intel Corporation.
Rev. 2.44
LHF32FDJ
3
1
A
B
2
3
A
8
4
V
PP
5
6
A
19
7
8
A
4
A
13
A
14
A
15
A
11
WP#
A
18
A
20
A
7
A
5
A
3
A
10
A
12
WE#
RST#
A
9
NC
A
17
A
6
A
2
A
1
A
0
C
D
E
F
A
16
DQ
14
DQ
5
DQ
11
DQ
2
DQ
8
DQ
9
CE#
0.75mm pitch
48-BALL CSP
PINOUT
7mm x 7mm
TOP VIEW
V
CCQ
DQ
15
DQ
6
DQ
12
DQ
3
GND
DQ
7
DQ
13
DQ
4
DQ
0
GND
OE#
V
CC
DQ
10
DQ
1
Figure 1. 0.75mm pitch 48-Ball CSP (7mm×7mm) Pinout
Rev. 2.44
模拟电子
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