DA9280.003
13 July 2006
MAS9280
This is preliminary information on a new
product under development. Micro Analog
Systems Oy reserves the right to make any
changes without notice.
IC FOR 18.00 – 40.00 MHz VCTCXO
•
•
•
•
•
•
Min. Supply Voltage 2.4 V
Max. Frequency 40 MHz
True Sine Wave Output
Frequency Stability +/- 1.5 ppm
Suitable Also for Low Pull
Crystals
Very Low Phase Noise
DESCRIPTION
The MAS9280 is an integrated circuit well suited to
build VCTCXO for mobile communication.
Temperature calibration is achieved in three
calibration temperatures only. The trimming is done
through a serial bus and the calibration information
is stored in an internal PROM. This means no
rework for trimming is needed.
To build a VCTCXO additionally only a crystal is
required. The compensation method is fully analog,
working continuously without generating any steps
or other interference.
Divider function allows the usage of double
frequency crystal.
FEATURES
•
•
•
•
•
•
Very small size
Minimum Vdd 2.4V
No voltage reference capacitor needed
Phase noise <-110 dBc/Hz at 100 Hz and
<-130 dBc/Hz at 1kHz @ 32 MHz crystal
Programmable VC-sensitivity
Oscillator frequency output f
o
/2 versions
available
APPLICATIONS
•
•
VCTCXO for mobile phones
VCTCXO for other telecommunications
systems
BLOCK DIAGRAM
DA
CLK
PV
VC
CUB
INF
SENS
LIN
4
4
f(T)
MAS9280
TE1
4
Σ
f(T)
8
T
Vref
TMux
TE2
CDAC1
8
VDD
CDAC2
2
OUT
X2
X1
VSS
1 (8)
DA9280.003
13 July 2006
PIN DESCRIPTION
Pin Description
Symbol
MAS9280A1/
A3 /B1/B3
x-coordinate
268
604
1047
1420
1848
1048
268
796
2020
1701
2058
MAS9280A1/
A3 /B1/B3
y-coordinate
1320
1320
1320
1320
1320
164
164
164
164
164
1320
MAS9280A2
/B2
x-coordinate
268
604
1420
1047
1848
1048
268
796
2020
1701
2058
MAS9280A2
/B2
y-coordinate
1320
1320
1320
1320
1320
164
164
164
164
164
1320
Power Supply Voltage
Programming Input
Serial Bus Clock Input
Serial Bus Data Input
Temperature Output
Crystal/Varactor Oscillator Input
Voltage Control Input
Crystal Oscillator Output
Buffer Output
Power Supply Ground
Test Multiplexer Output
VDD
PV
CLK
DA
TE1
X2
VC
X1
OUT
VSS
TE2
Note:
Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note:
Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
Note:
Test Multiplexer Output is for testing only and must not be connected in module.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Voltage
Power Dissipation
Storage Temperature
Note 1:
Not valid for programming pin PV
Symbol
V
DD
- V
SS
V
IN
P
MAX
T
ST
Min
-0.3
V
SS
-0.3
-55
Max
6.0
V
DD
+ 0.3
20
150
Unit
V
V
mW
o
C
Note
1)
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Supply Current
Operating Temperature
Load Capacitance
Load Capacitance
Crystal Pulling Sensitivity
Crystal Rs
Symbol
V
DD
I
CC
T
OP
C
L
C
L
S
C
RS
Conditions
Vdd = 2.8 Volt
-40
8
10
18
30
50
Min
2.4
Typ
2.6
Max
5.0
1.8
+85
Unit
V
mA
o
C
pF
pF
ppm/pF
Note
1
2
3
Note 1:
MAS9280A1, MAS9280A2 and MAS9280A3 with CDAC1 = 160 …200
Note 2:
MAS9280B1, MAS9280B2 and MAS9280B3 with CDAC1 = 160 …200
Note 3:
At 30 MHz to 40 MHz maximum Rs 30 ohm.
2 (8)
DA9280.003
13 July 2006
ELECTRICAL CHARACTERISTICS
Parameter
Frequency Range
Voltage Control Range
Voltage Control Sensitivity (VCR = 0)
Voltage Control Sensitivity (VCR = 1)
Frequency vs. Supply Voltage
Frequency vs. Load Change
Output Voltage (10kΩ // 10 pF)
Harmonic Distortion
Compensation Range ± 2.5 ppm
Compensation Range ± 2.0 ppm
Compensation Range ± 1.5 ppm
Compensation Range Linear Part
Compensation Inflection Point
Compensation Range Cubic Part
Compensation CDAC1 (8 Bit)
Compensation CDAC2 (2 Bit)
Start up Time
T
C
T
C
T
C
a1
INF
a3
C
X1
C
X2
T
START
C10
C20
2
-40
-30
-25
-0.7
25
95
C10 + 10.6
C20 + 3
Symbol
f
o
V
C
V
CSENS
V
CSENS
df
o
df
o
V
out
0.6
1.0
-25
85
85
75
0.0
31
Min
18.00
0
10
5
±0.2
±0.2
Typ
Max
40.00
VDD
Unit
MHz
V
ppm/V
ppm/V
ppm
ppm
Vpp
dBc
o
o
o
Note
1)
2)
3)
4)
C
C
C
C
5)
6)
ppm/K
o
ppm
2
/K
3
pF
pF
ms
Note 1:
MAS9280B1, MAS9280B2 and MAS9280B3 maximum frequency are 36MHz
Note 2:
default
Note 3:
VDD +/- 5%
Note 4:
R=10 kohm +/- 10%, C=10 pF +/- 10%
Note 5:
typ C10 = 9.7pF
Note 6:
typ C20 = 15.2pF
IC OUTLINES
VDD
PV
CLK
DA
TE1
TE2
VDD
PV
DA
CLK
TE1
TE2
1484um
1484um
MAS9280A1/A3 /B2/B3
MAS9280A2 /B2
VC
X1
X2
VSS
OUT
VC
X1
X2
VSS
OUT
Die map reference
2194um
Die map reference
2194um
Note 1:
MAS9280A and MAS9280B pads are round with 80 µm diameter at opening.
Note 2:
Pins CLK and DA can either be connected to VSS or left floating, pin PV can either be connected to
VDD or left floating and pin TE1 must be left floating in VCTCXO module end-user application.
Note 3:
Die map reference is the actual left bottom corner of the sawn chip.
3 (8)
DA9280.003
13 July 2006
SAMPLES IN SBDIL 20 PACKAGE
1
2
3
TE2 4
MAS9280A1
YYWW
XXXXX.X
20 OUT
19
18 VSS
17
16 X2
15
14 X1
13
12 VC
11
TE1 5
DA 6
CLK 7
PV 8
VDD 9
10
Top marking:
YYWW = Year, Week
XXXXX.X = Lot number
DEVICE OUTLINE CONFIGURATION
MSOP10
TE2
DA
CLK
PV
VDD
OUT
VSS
X2
X1
VC
Top View
A = product version
X = pad layout and fo version
Y = year
WW= week
9280
AX
YWW
4 (8)
DA9280.003
13 July 2006
PACKAGE (MSOP-10) OUTLINE
e
S
See Detail A
c
B
E1
E1
B
E
E
5-15 Degrees
L1
Detail A
A2
A
A1
D
L
G
M
A
A
0 - 8 Degrees
Gauge Plane
L2
Seating Plane
N
F
Land
Pattern
Recommendation
b1
(b)
Section B - B
c1
Symbol
A
A1
A2
b
b1
c
c1
D
E
E1
e
F
G
L
(Terminal length for
soldering)
L1
L2
M
N
S
Min
--
0.00
0.75
0.15
0.15
0.08
0.08
Nom
--
--
0.85
--
---
Max
1.10
0.15
0.95
0.30
0.25
0.23
0.18
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
0.40
3.00 BSC
4.90 BSC
3.00 BSC
0.50 BSC
4.8
0.50
0.60
0.80
0.95 REF
0.25 BSC
0.41
1.02
0.50
mm
mm
mm
Mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
Reference Standard : JEDEC MO-187 BA.
5 (8)
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