Nichia STS-DA1-0226
<Cat.No.080519>
SPECIFICATIONS FOR NICHIA CHIP TYPE
BLUE
MODEL :
NSSB064T
LED
NICHIA CORPORATION
Nichia STS-DA1-0226
<Cat.No.080519>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Soldering Temperature
I
FP
Conditions
:
Symbol
I
F
I
FP
I
R
P
D
T
opr
T
stg
T
j
T
sld
and
Absolute Maximum Rating
35
100
85
133
-40 ~ +110
-40 ~ +110
125
Reflow Soldering : 260°C
Hand Soldering : 350°C
Duty
≤
1/10
(Ta=25°C)
Unit
mA
mA
mA
mW
°C
°C
°C
for 10sec.
for 3sec.
Pulse Width
≤
10msec.
(2) Thermal Characteristics
Item
Symbol
Rja
Heat resistance
Rjs
Typ.
300
120
(Ta=25°C)
Unit
°C/W
°C/W
Rja = Heat resistance from Dice to Ambient temperature (Ta)
Rjs = Heat resistance from Dice to Solder temperature of Cathode Side (Ts)
Using Nichia standard circuit board
FR4, t=1.6mm, Copper foil, t=35µm
(3) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
V
F
Luminous Intensity
Iv
Luminous Intensity
Iv
x
-
Chromaticity Coordinate
y
-
Please refer to CIE 1931 chromaticity diagram.
Condition
I
F
=30[mA]
I
F
=30[mA]
I
F
=20[mA]
I
F
=30[mA]
I
F
=30[mA]
Typ.
(3.4)
(600)
(440)
0.133
0.075
(Ta=25°C)
Max.
Unit
3.8
V
-
mcd
-
mcd
-
-
-
-
(4) Ranking
Item
Luminous Intensity
Rank X
Rank W
Rank V
Symbol
Iv
Iv
Iv
Condition
I
F
=30[mA]
I
F
=30[mA]
I
F
=30[mA]
Min.
600
426
300
(Ta=25°C)
Max.
Unit
852
mcd
600
mcd
426
mcd
Luminous Intensity Measurement allowance is ± 10%.
-1-
Nichia STS-DA1-0226
<Cat.No.080519>
Color Rank
x
y
0.137
0.037
0.124
0.058
Rank W
0.110
0.132
0.087
0.112
(I
F
=30mA,Ta=25°C)
0.142
0.081
0.151
0.058
Color Coordinates Measurement allowance is ± 0.01.
Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
2. INITIAL
OPTICAL/ELECTRICAL
CHARACTERISTICS
Please refer to “CHARACTERISTICS” on the following pages.
3.OUTLINE
DIMENSIONS
AND
MATERIALS
Please refer to “OUTLINE DIMENSIONS” on the following page.
Package
: Heat-Resistant Polymer
Material as follows ;
Encapsulating Resin
: Silicone Resin (with Diffused)
Electrodes
: Ag Plating Copper Alloy
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to “PACKING” on the following pages.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT
NUMBER
The first six digits number shows
lot number.
The lot number is composed of the following characters;
-
- Year
( 7 for 2007, 8 for 2008 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
- Ranking by Color Coordinates
- Ranking by Luminous Intensity
B for Nov. )
-2-
Nichia STS-DA1-0226
<Cat.No.080519>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Tsld=215 ± 5°C,
3sec.
(using flux, Lead Solder)
-40°C
~
110°C
1min. (10sec.) 1min.
(Pre treatment 30°C,70%,168hrs.)
-40°C ~ 25°C ~ 110°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=110°C
Ta=60°C,
Ta=-40°C
Ta=25°C, I
F
=35mA
Ta=85°C, I
F
=30mA
60°C, RH=90%, I
F
=30mA
Ta=-40°C, I
F
=30mA
JEITA ED-4701
500 501
JEITA ED-4701
400 403
Solvent : Isopropyl Alcohol
Solvent Temperature : 20 ~ 25°C
Dipping Time : 5 min.
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s
2
3directions, 4cycles
75cm
R=1.5kΩ, C=100pF
Test Voltage=2kV
RH=90%
Note
2 times
Number of
Damaged
0/22
1 time
over 95%
100 cycles
0/22
0/100
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Steady State Operating Life
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Permanence of Marking
100 cycles
10 cycles
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1 time
0/100
0/100
0/100
0/100
0/100
0/100
0/100
0/100
0/100
0/22
Vibration
48min.
0/10
Drop
Electrostatic Discharge
JEITA ED-4701
300 304
3 times
3 times
Negative/Positive
0/10
0/22
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Item
Forward Voltage
Luminous Intensity
Condition 1
Luminous Intensity
Condition 2
Symbol
V
F
I
V
I
V
Test Conditions
I
F
=30mA
I
F
=30mA
I
F
=30mA
Min.
-
L.S.L.**)
L.S.L.**)
0.7
0.5
Max.
U.S.L.*)
-
-
1.1
*) U.S.L. : Upper Standard Level
**) L.S.L. : Lower Standard Level
These test items are judged by the criteria of Luminous Intensity Condition 2.
-3-
Nichia STS-DA1-0226
<Cat.No.080519>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag.
A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less.
The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· This product has silver plated metal parts that are inside and/or outside the package body. The silver
plating becomes tarnished when being exposed to an environment which contains corrosive gases.
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.
Please do not expose the LEDs to corrosive atmosphere during storage.
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by
components and materials in close proximity of the LEDs within an end product, and the gases entering
into the product from the external atmosphere. The above should be taken into consideration when
designing.
Resin materials, in particular, may contain substances which affects on silver plating,
such as halogen.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
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