Nichia
STSE-CM6042A
<Cat.No.060410>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Reverse Voltage
Power Dissipation
Total Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
I
F
I
FP
V
R
P
D
P
tot
T
opr
T
stg
T
sld
Absolute Maximum Rating
Blue
Green
Red
35
35
50
110
110
200
5
123
123
125
280
-30 ~ + 85
-40 ~ +100
Reflow Soldering : 260°C
for 10sec.
Hand Soldering : 350°C for 3sec.
(Ta=25°C)
Unit
mA
mA
V
mW
mW
°C
°C
I
FP
Conditions : Pulse Width < 10msec. and Duty < 1/10
=
=
Value for one LED device (Single color).
Value for total power dissipation when two and more devices are lit simultaneously.
(2) Initial Electrical/Optical Characteristics
Item
Forward Voltage
Reverse Current
Luminous Intensity
Chromaticity Coordinate
x
y
Symbol
Condition
I
F
=20[mA]
V
R
= 5[V]
I
F
=20[mA]
I
F
=20[mA]
I
F
=20[mA]
Blue
Typ.
Max.
3.5
50
-
-
-
(3.2)
-
(400)
0.133
0.075
(Ta=25°C)
Green
Typ.
(3.2)
-
(1200)
0.189
0.718
Max.
3.5
50
-
-
-
Red
Typ.
(2.1)
-
(700)
0.700
0.299
Max.
2.5
50
-
-
-
Unit
V
F
I
R
Iv
-
-
V
µA
mcd
-
-
Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Luminous Intensity
Symbol
Condition
I
F
=20[mA]
Blue
Min.
Max.
560
280
(Ta=25°C)
Green
Min.
800
Max.
1600
380
Red
Min.
Max.
1080
Unit
Iv
mcd
Luminous Intensity Measurement allowance is ± 10%.
Color Ranks
Blue
(I
F
=20mA, Ta=25°C)
Rank W
0.113 0.134
0.080 0.105
Rank G0d
0.176 0.220
0.750 0.745
x
y
Green
0.139
0.035
0.129
0.050
0.145
0.072
0.152
0.056
x
y
0.190
0.628
0.136
0.739
0.250
0.638
-1-
0.219
0.637
Nichia
STSE-CM6042A
<Cat.No.060410>
Red
x
y
0.674
0.296
Rank R
0.648 0.677
0.323 0.323
0.708
0.292
Color Coordinates Measurement allowance is ± 0.01.
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Package
Material as follows ;
Encapsulating Resin
Electrodes
:
:
:
Heat-Resistant Polymer
Epoxy Resin (Diffused)
Ag Plating Copper Alloy
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows
lot number.
The lot number is composed of the following characters;
-
-
-
Year
( 5 for 2005, 6 for 2006 )
Month ( 1 for Jan., 9 for Sep., A for Oct.,
Nichia's Product Number
B for Nov. )
-2-
Nichia
STSE-CM6042A
<Cat.No.060410>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Thermal Shock
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Steady State Operating Life
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
Ta=60°C, RH=90%
Ta=-40°C
Ta=25°C,
B I
F
=13mA
G I
F
=32mA
R I
F
=21mA
Note
2 times
Number of
Damaged
0/50
100 cycles
100 cycles
10 cycles
500hrs.
500hrs.
500hrs.
500hrs.
0/50
0/50
0/50
0/50
0/50
0/50
0/50
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Value for one LED device (Single color).
60°C, RH=90%, B I
F
=8.5mA
G I
F
=18mA
R I
F
=14.5mA
Ta=-30°C,
B I
F
=13mA
G I
F
=32mA
R I
F
=21mA
500hrs.
0/50
500hrs.
0/50
(2) CRITERIA FOR JUDGING DAMAGE
(Value for one LED device (Single color).)
Criteria for Judgement
Min.
Max.
Item
Symbol
Test Conditions
Forward Voltage
Reverse Current
Luminous Intensity
V
F
I
R
I
V
B,G,R I
F
=20mA
B,G,R V
R
=5V
B,G,R I
F
=20mA
-
-
L.S.L.**) 0.7
U.S.L.*) 1.1
U.S.L.*) 2.0
-
*) U.S.L. : Upper Standard Level
**) L.S.L. : Lower Standard Level
-3-
Nichia
STSE-CM6042A-1
<Cat.No.061208>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag.
A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less.
The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrodes are silver plated copper alloy. The silver surface may be affected by
environments which contain corrosive substances. Please avoid conditions which may cause the LED
to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering
operations. It is recommended that the User use the LEDs as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· During operation of the LEDs the total power dissipation of the diode elements (red, green, and blue)
within the LEDs must not exceed the maximum power dissipation.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
-4-
stm32/stm8
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