LED SPECIFICATION
530LB7C
¾
Features
z
Single color
z
High bright output
z
Low power consumption
z
High reliability and long life
¾
Descriptions
z
Dice material GaN
z
Emitting Color
Super Bright Blue
z
Device Outline
¶5mm
Round Type/ 5mm
z
Lens Type
Water Clear
1. All dimensions are millimeters
2. Tolerance is +/-0.25mm unless otherwise noted
¾
Directivity
1.0
0°
Ta=25° C
IF=20mA
30°
Relative Luminous Intensity
0.5
60°
0
90°
60°
30°
0°
0.5
90°
1.0
Radiation Angle
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LED SPECIFICATION
Typical electrical/optical characteristic curves
50
Forward Current(mA)
40
30
20
10
0
2.0
FORWARD CURRENT Vs
FORWARD VOLTAGE
2.5
Luminous Intensity
Relative Value at IF=20mA
2.0
1.5
1.0
0.5
0
0
30
10
20
40
IF-Forward Current (mA)
50
LUMINOUS INTENSITY Vs.
FORWARD CURRENT
2.4 2.8 3.2 3.6
Forward Voltage(V)
4.0
50
Forward Current(mA)
40
30
20
10
0
0
FORWARD CURRENT
DERATING CURVE
Relative Luminous Intensity
LUMINOUS INTENSITY Vs.
AMBIENT TEMPERATURE
2.5
2.0
1.5
1.0
0.5
0
-40
-20
40
0
20
60
80
Ambient Temperature T
A
( )
100
20
40
60
80
)
100
Ambient Temperature T
A
(
Relative Luminous Intensity
100
75
50
25
0
400
450
500
550
600
650
700
Wavelength
¬
(nm)
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LED
ySOLDERING
METHOD
LAMP APPLICATION
SOLDERING CONDITIONS
REMARK
y
Solder no closer than 3mm from the
base of the package
y
Using soldering flux,” RESIN FLUX”
is recommended.
y
During soldering, take care not to
press the tip of iron against the
DIP
SOLDERING
Bath temperature: 260±5
Immersion time: with 5 sec
Soldering iron: 30W or smaller
lead.
SOLDERING
Temperature at tip of iron: 260 or lower (To prevent heat from being
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
/HDG ZULHV
3DQHO
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
/HDG ZULHV
/HDYH D VOLJKW
FOHDUDQFH
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