LED SPECIFICATION
530MY8C
Features
Single color
High bright output
Low power consumption
High reliability and long life
Descriptions
Dice material
Emitting Color
Super Bright Amber (Yellow)
Device Outline
5mm Round Type/ 5mm
Lens Type
Water Clear
1. All dimensions are millimeters
2. Tolerance is +/-0.25mm unless otherwise noted
Page: 1
LED SPECIFICATION
Typical electrical/optical characteristic curves
FORWARD CURRENT Vs.
FORWARD VOLTAGE
50
40
30
20
10
0
1.5
Luminous Intensity
Relative Value at IF=20mA
Forward Current(mA)
2.5
2.0
1.5
1.0
0.5
0
0
10
20
30
40
IF-Forward Current (mA)
50
LUMINOUS INTENSITY Vs.
FORWARD CURRENT
1.7
1.9
2.1
2.3
Forward Voltage(V)
2.5
FORWARD CURRENT Vs.
AMBIENT TEMPERATURE
Relative Luminous Intensity
50
Forward Current(mA)
40
30
20
10
0
0
20
40
60
80
)
LUMINOUS INTENSITY Vs.
AMBIENT TEMPERATURE
2.5
2.0
1.5
1.0
0.5
0
-40
100
Ambient Temperature T
A (
-20
40
60
0
20
Ambient Temperature T
A (
80 90
)
Relative Luminous Intensity
100
75
50
25
0
450
500
550
650
600
Wavelength (nm)
700
750
Page: 4
LED
SOLDERING
METHOD
LAMP APPLICATION
SOLDERING CONDITIONS
REMARK
Solder no closer than 3mm from the
base of the package
Using soldering flux,” RESIN FLUX”
is recommended.
DIP
SOLDERING
Bath temperature: 260±5
Immersion time: with 5 sec
During soldering, take care not to
press the tip of iron against the
lead.
Soldering iron: 30W or smaller
SOLDERING
Temperature at tip of iron: 260 or lower (To prevent heat from being
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
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5
51单片机
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